PI3B3257_V01 DIODES | Alldatasheet
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Features
¼Near-Zero propagation delay ¼5Ω switches connect inputs to outputs ¼Fast Switching Speed: 4.8ns max. ¼Ultra-Low Quiescent Power: 0.1µA typical – Ideally suited for notebook applications ¼Pin compatible with 74 series 257 logic devices ¼Packaging (Pb-free & Green avaliable): – 16-pin, QSOP (Q) – 16-pin, SOIC (W) – 16-pin, TSSOP (L) – 16-pin, UQFN (ZHD) Pin Configuration (QSOP, SOIC, TSSOP) Note: 1. H = High V oltage Level L = Low V oltage Level E IA0 IA1 IB0 IB1 IC0 IC1 ID0 ID1 S YA YB YC YD IY E SW SW SW SW SW SW SW SW SW Truth Table(1) E S YA YB YC YD Function H X Hi-Z Hi-Z Hi-Z Hi-Z Disable L L IA0 IB0 IC0 ID0 S = 0 L H IA1 IB1 IC1 ID1 S = 1 VCCS 1 EIA0 2 ID0IA1 3 ID1YA 4 YDIB0 5 IC0IB1 6 IC1YB 7 YC8 GND A product Line of Diodes Incorporated PI3B3257 5 6 7 8 16 15 14 13 S I 0A I 1A AY I 0B I 1B BY GND CY I 1C I 0C DY I 0 I 1D E VCC D Pin Configuration (UQFN) 3.3V, Quad 2:1 Mux/DeMux NanoSwitch™ Transparent top view Note 1: UQFN16 package die supply ground is connected to both GND pin and exposed center pad. GND pin must be connected to supply ground for proper de- vice operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region.
www.diodes.com April 2018 Diodes Incorporated PI3B3257 Document Number DS40430 Rev 2-2 Notes: 1. This parameter is determined by device characterization but is not production tested. Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not mplied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Parameters Description Test Conditions(1) Min. Typ.(2) Max. Units VIH Input HIGH V oltage Guaranteed Logic HIGH Level 2 VVIL Input LOW V oltage Guaranteed Logic LOW Level –0.5 0.8 IIH Input HIGH Current VCC = Max., VIN = VCC ±1 µAIIL Input LOW Current VCC = Max., VIN = GND ±1 IOZH High Impedance Output Current 0 ≤ In, Yn ≤ VCC ±1 VIK Clamp Diode V oltage VCC = Min., IIN = –18mA –1.2 V RON Switch On-Resistance(3) VCC = Min., VIN = 0.0V , Ion = 48mA or 64mA 5 8 Ω VCC = Min., VIN = 2.4V , ION = 15mA 8 17 Capacitance (TA = 25°C, f = 1 MHz) Parameters(1) Description Test Conditions Typ. Units CIN Input Capacitance VIN = 0V 3.0 pFCOFFYN YN Capacitance, Switch OFF 17.0 COFFIN IN Capacitance, Switch OFF 8.5 CON IN/YN Capacitance, Switch ON 25 Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 3.3V , TA = 25°C ambient and maximum loading. 3. Measured by the voltage drop between I and Y pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two (I,Y) pins. Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device. 2. Typical values are at V CC = 3.3V , +25°C ambient. 3. Per TTL driven input (control inputs only); I and Y pins do not contribute to ICC. 4. This current applies to the control inputs only and represent the current required to switch internal capacitance at the specified frequency. The I and Y inputs generate no significant AC or DC currents as they transition. This parameter is not tested, but is guaranteed by design. Power Supply Characteristics Parameters Description Test Conditions(1) Min. Typ.(2) Max. Units ICC Quiescent Power Supply Current VCC = Max. VIN = GND or VCC 0.1 3.0 µA∆ICC Supply Current per Input @ TTL HIGH(3, 4) VCC = Max. VIN = 3.0 750
www.diodes.com April 2018 Diodes Incorporated PI3B3257 Document Number DS40430 Rev 2-2 Notes: 1. This parameter is guaranteed but not tested on Propagation Delays. 2. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The switch’s time constant alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propaga- tional delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. Switching Characteristics Over Operating Range Parameters Description Conditions PI3B3257 UnitsCom. Min. Max. tIY Propagation Delay In to Yn(1,2) CL = 50pF RL = 500Ω 0.25 ns tSY Bus Select Time, Sn to Yn 1 4.5 tPZH tPZL Bus Enable Time, E to Yn 1 4.5 tPHZ tPLZ Bus Disable Time, E to Yn 1 4.8 Applications Information Logic Inputs The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a + 3.3V supply, IN may be driven low to 0V and high to 3.6V . Driving IN Rail-to-Rail® minimizes power consumption. Power-Supply Sequencing and Hot-Plug Information Proper power-supply sequencing is recommended for all CMOS devices. Always apply V CC and GND before applying signals to input/ output or control pins. Rail-to-Rail is a registeredtrademark of Nippon Motorola, Ltd. Part Marking Q Package W Package L Package PI3B 3257QE YWXX Y: Year W: Workweek 1st X: Assembly Site Code 2nd X: Fab Site Code PI3B 3257WE YYWWXX YY: Date Code (Year) WW: Date Code (Workweek) 1st X: Assembly Site Code 2nd X: Fab Site Code PI3B 3257LE YYWWXX YY: Year WW: Workweek 1st X: Assembly Site Code 2nd X: Fab Site Code wDZHDE YWXX Y: Year W: Workweek 1st X: Assembly Site Code 2nd X: Fab Site Code
www.diodes.com April 2018 Diodes Incorporated PI3B3257 Document Number DS40430 Rev 2-2 Packaging Mechanical: 16-QSOP (Q) 16-0056
www.diodes.com April 2018 Diodes Incorporated PI3B3257 Document Number DS40430 Rev 2-2 16-0145 Packaging Mechanical: 16-SOIC (W)
www.diodes.com April 2018 Diodes Incorporated PI3B3257 Document Number DS40430 Rev 2-2 16-0061 Packaging Mechanical: 16-TSSOP (L)
For latest package info. please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/ Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green” and Lead-free. Thermal characteristics can be found on the company web site at www.diodes.com/design/support/packaging/ 3. E = Pb-free and Green 4. X suffix = Tape/Reel www.diodes.com April 2018 Diodes Incorporated PI3B3257 Document Number DS40430 Rev 2-2
Ordering Information
Ordering Code Packaging Code Package Description PI3B3257QEX Q 16-pin, 150 mil wide (QSOP) PI3B3257WEX W 16-pin, 150-mil wide (SOIC) PI3B3257LEX L 16-pin, 173 mil wide (TSSOP) PI3B3257ZHDEX ZHD 16-pin, 3x3 (UQFN) PKG. DIMENSIONS(MM) SYMBOL Min Max A1 0.00 D 2.90 3.10 E1 1.60 1.90 b e 0.05 A 0.50 0.65 E 2.90 3.10
0.50 BSC
1.60 1.90
0.15 REF
0.18 0.30 L 0.25 0.55 PIN1 Index Area D E A e L b DATE: 07/27/16 DESCRIPTION: 16-Pin, UQFN, 3X3 PACKAGE CODE: ZHD(ZHD16) DOCUMENT CONTROL#: PD-2209 REVISION: -- Top View 16X0.27 0.50BSC 2.90 2.90 1.60 1.60 0.70x16 Bottom View Side View RECOMMENDED LAND PATTERN(unit:mm) Note: 1. Comply with MO-248E,except 'L' MIN and 'L' 'D1' 'E1' MAX N5N8 N12 N13 N16 16-0092 Packaging Mechanical: 16-UQFN (ZHD)
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