DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
FENG-JUI TECHNOLOGY CO., LTD HIGH CURRENT INDUCTOR -RoHS Your Perfect Inductor Rev.1701 PI17070Q1 TYPE
- FEATURE 1. Shielded construction，Frequency range up to 5MHz 2. AEC-Q200 Grade 1 qualified
- Applications 1. Notebook, server application, High current power supplier
- Shape and Dimension ●Schematics and Land Patterns(mm) ±0.3m/m ; E=3.20m/m Ref. ; G=18.5m/m ; H=12.2m/m ; I=11.7m/m
- Specification P/N L (μH) RDC (mΩ) Typical RDC (mΩ)Max Isat (A) Irms (A) PI17070Q1-100M 10±20% 8.89 9.33 17.0 19.0 PI17070Q1-220M 22±20% 20.0 21.0 9.5 12.0 PI17070Q1-330M 33±20% 35.1 37.0 9.0 10.7 PI17070Q1-470M 47±20% 40.7 42.7 8.6 8.7 PI17070Q1-560M 56±20% 55.0 57.8 4.2 7.2 PI17070Q1-680M 68±20% 72.1 75.7 4.5 6.1 PI17070Q1-820M 82±20% 87.3 91.7 4.5 5.5 PI17070Q1-101M 100±20% 105 110 4.0 5.0
FENG-JUI TECHNOLOGY CO., LTD HIGH CURRENT INDUCTOR -RoHS Your Perfect Inductor Rev.1701 Note1. Measurement frequency of Inductance value : at 100KHz Note2. Measurement ambient temperature of L, DCR and IDC : at 25℃ Note3. Isat: DC current at which the inductance drops 30%(typ) from its value without current Note4. Irms: Average current for 40℃ temperature rise from 25℃ ambient(typical) Note5. Inductance tolerance: M: ±20% Note6. Packaging: Taping ; 300pcs/reel
FENG-JUI TECHNOLOGY CO., LTD HIGH CURRENT INDUCTOR -RoHS Your Perfect Inductor Rev.1701 GENERAL CHARACTERISTICS 1. Operating temperature range: -55 TO + 125℃(Includes temperature when the coil is heated) 2. High temperature exposure(storage) refer MIL-STD-202 Method 108: 1000 hrs at rated operating after test conclusion. 3. Temperature cycling refer JESD22 Method JA-104: 1000 cycles(-55 TO + 125℃). Measurement at 24±4 hours 4. Biased Humidity refer MIL-STD-202 Method 103: 1000 hours 85℃/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion. 5. Operational Life refer MIL-PRF-27: 1000 hrs. at 125 ℃ tested. Measurement at 24±4 hours after test conclusion. 6. External Visual refer MIL-STD-883 Method 2009: Inspect device construction, marking and workmanship. 7. Physical Dimension refer JESD22 Method JB-100: Verify physical dimensions to the applicable device detail specification. 8. Resistance to Solvents refer MIL-STD-202 Method 215: Add aqueous wash chemical - OKEM clean or equivalent. 9. Mechanical Shock refer MIL-STD-202 Method 213: Figure 1 of Method 213. Condition C. 10. Vibration refer MIL-STD-202 Method 204: 5g;s for 20 minutes, 12 cycles each of 3 orientations. Test from 10-2000 Hz. 11. Resistance to soldering Heat refer MIL-STD-202 Method 210: Condition B No pre-heat of samples. Single wave solder-procedure 2 for SMD and procedure 1 for leaded with solder within 1.5mm of device body. 12. ESD refer AEC-Q200-002 or ISO/DIS 10605: Direct contact discharge 2kV. 13. Solderability refer J-STD-002: For both Leaded & SMD. Magnification 50X. Conditions: Leaded, Method A@235℃,category 3 ; SMD, a)Method B, 4hrs@155℃ dry heat @235℃, b)Method B@215℃ category 3., c)Method D category 3@260℃ 14. Electrical Characterization refer spec: Show Min, Max Mean and Standard deviation at room from Min and Max temperature. 15. Flammability refer UL-94: V-0 or V-1 Acceptable. 16. Board Flex refer AEC-Q200-005: 60 sec minimum holding time. 17. Terminal Strength(SMD) refer AEC-Q200-006 18. Reflow profile recommend: 260 ℃ 230 ℃ 300 250 200 150 100 T( ℃ ) T(s 300240180120600 Lead-free heat endurance test 245 ℃ Peak 230 ℃ 170 ± 10℃ ,6 0-120S 300 250 200 150 100 T( ℃ ) T(s) 300240180120600 Lead-free the recom m ended refl ow condi ti on