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R08DS0067EJ0100 Rev.1.00 Page 1 of 11 Nov 05, 2012 Data Sheet PH5504A2NA1 Ambient Light Sensor

DESCRIPTION

The PH5504A2NA1 is an ambient light sensor with a photo diode and current amplifier. This product has spectral characteristics close to human eye sensitivity and outputs light current proportional to the ambient brightness. The PH5504A2NA1 can be used to improve the performance and reduce the power consumption of digital equipment such as FPD-TV sets and mobile phon es, by enabling automatic brightness contro l and automatic switching on and off of lighting systems.

FEATURES

  • Small and thin SON package 2.55 x 1.56 x 0.55 mm
  • Spectral characteristics close to human eye sensitivity Peak sensitivity wavelength 530 nm TYP.
  • The impact of infrared light can be reduced by incorporating infrared light correction circuits.
  • Output characteristics proportional to illuminance
  • Output light current 55 μA TYP.@100 lx (Fluorescent light)
  • Reduced variation of output current among light sources
  • Low voltage operation V CC = 1.8 to 5.5 V
  • Pb-free

APPLICATIONS

  • FPD TV sets, displays
  • Mobile phones, smartphones
  • Notebook PCs, tablet PCs
  • DSCs, DVCs
  • FA equipment
  • Lighting systems, etc. R08DS0067EJ0100 Rev.1.00 Nov 05, 2012

R08DS0067EJ0100 Rev.1.00 Page 2 of 11 Nov 05, 2012 PACKAGE DIMENSIONS (UNIT: mm) BOTTOM VIEW TOP VIEW SIDE VIEW (0.25) 0.55 0.5 0.20.220.2 1.56±0.15 2.55±0.2 2.25 2 5 Remark Pin 1 is distinguishable by the shape of the lead frame. Remark ( ) indicates nominal dimensions. Pin No. Terminal

1 OUT

2 GND

3 V CC

Remark 1. Connect all the NC terminals to GND or V CC. 2. The bypass capacitor between V CC and GND is to be mounted within 20 mm of the package body.

R08DS0067EJ0100 Rev.1.00 Page 3 of 11 Nov 05, 2012 BLOCK DIAGRAM OUT Light Source GND VCC MARKING EXAMPLE (Bottom View) 1 pin Assembly code Product code

ORDERING INFORMATION

Part Number Order Number Solder Plating Specification Packing Styleç PH5504A2NA1-E4 PH5504A2NA1-E4-Y-A Pb-Free Embossed Tape 5 000 pcs/reel

R08DS0067EJ0100 Rev.1.00 Page 4 of 11 Nov 05, 2012 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage VCC 6 V Light Current IO 5 mA Power Dissipation *1 PD 135 mW Operating Temperature Topt −30 to +85 °C Storage Temperature Tstg −40 to +100 °C Note: *1. Mounted on glass epoxy board (18 mm × 13 mm × t0.8 mm) RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 1.8 3.0 5.5 V ELECTRO-OPTICAL CHARACTERISTICS (TA = 25°C, VCC = 3.0 V, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Current *1 I CC E V = 100 lx *2 − 63 − μA Peak Sensitivity Wavelength λp − − 530 − nm Light Current *1 I O0 E V = 0 lx − − 0.2 μA I O1 E V = 100 lx *2 44 55 66 μA Sensitivity Ratio of Fluorescent/Incandescent − E V = 100 lx − 1 − Multiple Saturation Output Voltage *3 V O EV = 100 lx, RL = 150 kΩ *2 2.6 2.9 − V Switching Rise Time tr RL = 5 kΩ *5 − 80 − μs Time *4 Fall Time tf − 140 − μs Delay Time td − 250 − μs Storage Time ts − 5 − μs Note: *1 Measured under load resistance conditions of an output current unsaturated *2 Fluorescent light *3 Saturation output voltage measurement method: Light Source Illuminance (lx) VCC PH5504A GND OUT RL VCC VCC VO

R08DS0067EJ0100 Rev.1.00 Page 5 of 11 Nov 05, 2012 *4 Switching Time Pulse input Input Output VCC PH5504A GND OUT RL VCC td ts 90% 10% tr tf *5 White LED

R08DS0067EJ0100 Rev.1.00 Page 6 of 11 Nov 05, 2012 TYPICAL CHARACTERISTICS (TA = 25°C, VCC = 3.0 V, unless otherwise specified) 1.1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 300 400 500 600 700 800 900 0 0.5 1 1.5 2 1 000 1 100 1 200 0.2 0.4 0.6 0.8 1.2 −90 −60 −30 0 30 60 90 0 0.2 0.4 0.6 0.8 1.2 −90 −60 −30 0 30 60 90 Wavelength (nm) Ratio Angle (deg.) Angle (deg.) RatioRatio Ratio White LED Krypton light Halogen light Incandescent light Fluorescent light SPECTRAL SENSITIVITY CHARACTERISTICS DIRECTIONAL CHARACTERISTICS 1 DIRECTIONAL CHARACTERISTICS 2 LIGHT SOURCE SENSITIVITY VARIATION 1 pin 1 pin Remark The graphs indicate nominal characteristics.

R08DS0067EJ0100 Rev.1.00 Page 7 of 11 Nov 05, 2012 0.2 0.4 0.6 0.8 1.2 1.4 −40 0 0.01 0.1 0.001 VCC (V) Ratio Ratio −40 −20 0 20 40 60 80 100 −2 00 2 04 06 08 0 1 0 0 0.2 0.4 0.6 0.8 1.2 1.4 Illuminance (lx) AT 100 lx (NORMALIZED AT VCC = 3 V) VCC DEPENDENCY OF LIGHT CURRENT CURRENT AT 100 lx (NORMALIZED AT 25°C) TEMPERATURE DEPENDENCY OF LIGHT LIGHT CURRENT vs. ILLUMINANCE OF LIGHT CURRENT AT 0 lx TEMPERATURE DEPENDENCY IO1 (μA) IO0 (μA) Temperature (°C) Temperature (°C) 0.01 0.1 1 000 10 00010 1 100 0.1 0.01 1 000 100 10 000 Remark The graphs indicate nominal characteristics.

R08DS0067EJ0100 Rev.1.00 Page 8 of 11 Nov 05, 2012 RECOMMENDED OPTICAL LAYOUT (UNIT: mm) 0.14 1.275 1.275 Offset 0.780.781 pin Recommended area for light to hit (2.5 mm radius) Light detecting area (0.54 x 0.18 mm) It is recommended to position the sensor so that light hits a circular area (shown by the dotted line) with a radius of 2.5 mm (diameter of 5 mm) from the center of the package.

R08DS0067EJ0100 Rev.1.00 Page 9 of 11 Nov 05, 2012 TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Symbol Dimensions (mm) A B W Symbol Dimensions (mm) C D E θ θ φφ φ 13±0.2 2.0±0.5 21.0±0.8 180 +0–1.5 60 +1 –09.0 +1 –0 1 θθ E W D C BA Perforation Direction of feed Product Carrier tape Cover tape Product Pin 1 φ φ 2.0±0.1 4.0±0.1 0.2±0.05 0.78±0.05 3.5±0.05 1.75±0.1 8.0±0.2 0.78±0.05 2.9 1.95 4.0±0.1 1.05±0.05 1.5 +0.1–0 90° 120°

R08DS0067EJ0100 Rev.1.00 Page 10 of 11 Nov 05, 2012 RECOMMENDED MOUNT PAD DIMENSIONS (Unit: mm) 0.24 0.24 0.22 0.50.5 0.50.5 0.22 0.220.22 1.85 0.55 Remark All dimensions in this figure must be evaluated before use.

R08DS0067EJ0100 Rev.1.00 Page 11 of 11 Nov 05, 2012 NOTES ON HANDLING 1. Recommended reflow soldering conditions (including infrared reflow, convection reflow, and infrared + convection reflow) (1) This product is dry-packed with desiccant in order to avoid moisture absorption. (2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature profile shown below. (3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and reel. Baking conditions: Once, with tape and reel, 60±5°C, 10 to 24 hours After the baking process, this product must be stored under conditions of 30°C or below, 70% RH or below, and reflow soldering must be done within 168 hours. < Storage conditions after breaking seal >

  • Storage conditions : 30 °C or below, 70% RH or below
  • Maximum storage period after breaking seal : 168 hours (Second reflow soldering must be completed within 168 hours.) < Reflow soldering conditions >
  • Peak reflow temperature : 260 °C or below (Package surface temperature)
  • Maximum number of reflows : 2
  • No repair by hand soldering
  • Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less Time Recommended Temperature Profile of Reflow Package Surface Temperature 60 to 120 s 220°C 255°C 8 min. MAX. 150°C Ramp-up rate 3°C/s MAX. Ramp-down rate 6°C/s MAX. Peak Temperature 260°C MAX. 30 s or less 60 s or less 200°C

All trademarks and registered trademarks are the property of their respective owners. C - 1 Rev. Date Page Summary

1.00 Nov 05, 2012 − First edition issued

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