PH310 NEC | Alldatasheet
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Technical content
a . - — > NE C ELECTRONICS INC 306 D mm@ b427525 0029615 4 mm ° T-HI- 53 . PHOTO DIODE ( / . ooo PLASTIC MOLDED PIN PHOTO DIODE
DESCRIPTION
PACKAGE DIMENSIONS PH310 is a photo diode with PIN structure. It has a wide in millimerers photo-recsiving area and high speed response enabling applica- tions for various remote controlling equipments. The resin 10. Jo" material itself used for the package has filter effect to pass Anode Cathode only infrared. O-@ Eh. r PO PEATURES 234 i © Ultra high speed response. (t,, ty 27 30 ns) ie [oe yo" © Coincidence of the wavelength of maximum sensitivity [7 “I 4 ii y with that of an infrared LED. (4, MAX. = 990 nm) 3 | t I bi © High sensitivity.[5 wA TYP. (@ V_ =5 V, H =0.1 mW/cm?)] ale | 31 © Wide dynamic range. ILO. Is ct dy i Ic OTT 02 wax. ABSOLUTE MAXIMUM RATINGS ‘. {1 _| | Maximum Reverse Voltage (Tq = 25 °C) LY iis l etontnts’) q flo Maximum Power Dissipation (T = 25 °C) Po 160 mW Maximum Temperatures 1 Operating Temperature Top, —30to+85 °C. Storage Temperature Tyg —40to #100 °C ‘Anode Cathode C ( .
=: a - = NE C ELECTRONICS INC 30E D M@@ 6427525 OOedb1lb b PHO gn gg ELECTRO-OPTICAL CHARACTERISTICS (T, = 25 °C) . ; [oerk current 0a 0a ato [ew of meaty | AR [ame [cmon ii esvon wap [| aa | ae Sof 2s [a2 [ain vans Rise and fall time of the photocurrent fram 10% |__t tf [120 "8 to 90 % and 90 % to 10 % of the final value tw [| 30 | fons | RL=TKR, VR =5V,A= 940 nm [eminem | +A = 940 nm TYPICAL CHARACTERISTICS (T, = 25 °C) WAVELENGTH SensiriviTY DIRECTIONAL CHARACTERISTIC 100) = 10" oF 10" 80 7 \\ 2408 LTRS e : ipo Dee 2 = 4 - SN Za 20] A {-70" lB: flit iT) -ESSzecr 400860 —S0d 700 0d. 38d — 100011901700 A= Wavelength -nm CAPACITANCE vs. SUPPLY VOLTAGE FALL Time “+ SUPPLY VOLTAGE 100 60 ao ase | Es E ad ie Pd [ot Pape | a ——— nee H foaw topo ol hii} i od _ toto Sess TOTO v 2 3 5 10 2030 Ya - Supply Voltage -V ° 10 26 30 Ya ~Supply Vottage-V a
NEC ELECTRONICS INC 30E D mm b42e7S25 OO29b17 6 . T-41-53 PH310 a _—_PH310 10) eT a ee a | == rel TTT TT | a off Pt i Pe PLT TAT “= eT A OE ST | “| eee ees ee ee eS A SS to" 41 eoel_—t 1 TT J i
9 Ey 10 1s 20 23 30 Tg -Ambient Temperature—"C
Vp~Supply Voltage-V¥ PHOTO CURRENT vs. ILLUMINANCE RELATIVE vs. AMBIENT TEMPERATURE. PT TTT) fe MOELLE veil | eT + 10) © - oe PEL TE TT UT od || | pb Cee eee | 47 -20 o 20 40 60 80 Ey-illuminance~ix PHOTO CURRENT vs. SUPPLY VOLTAGE PHOTO CURRENT vs, SUPPLY VOLTAGE. a ee a a ja a a i a a fo | ce [ é a a a 3 ft va jo a ee cl fT Poy +--+ Se Vp -Supply Voitage-V. Vp-Supply Voltage—V
NE C ELECTRONICS INC 30E D M@™@ 6427525 0029618 T PH310 T-41-53 . . 5 POWER DISSIPATION vs. ? AMBIENT TEMPCRATURE a i LI] Fo eeEATT TTT TT] 100) ee Er TTT NET T POOP Nee a LLT TT TPN cg A LEP TTT Cur | ° 29 a5 8030 80 Ta~Ambient Temperature~"C HANDLING PRECAUTIONS: , . 1. The full resin-molded PH310 has generally a little less mechanical and thermal strength than other resin-molded semic Conductor devices as they have less additives. Therefore please note on the following points, {a) Soldering of leads should be made at the point § mm or more from the root of the leads at 260 °C and within 5 +, (0) If the temperature of the molded portion rites in addition to the residual stress between the leads, the possibility that open or short circuit occurs due to the deformation or destruction of the resin will increase. 2. Oncleaning the device: {@) Cleaning with unsuitable solvent may impair the resin if the package and the following solvents should be used at the temperature of less than 45 °C and for less than 3 minutes of immersion time. Ethanol, Methanol Isopropyl-aicohol {b) Ultrasonic cleaning will add some stress on devices. The degree of the stress differs depending on the oscillation maine, Dower, the size of the PCB and the mounting methods of the devices, therefore it should be confirmed by making an experiment at actual conditions that the cleaning does not have any problem on the devices, v