PH302 NEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
-. - _ a = “NE C ELECTRONICS INC 30E D MM 6427525 0029599 T : T- 41-53 © / PLASTIC MOLDED PIN PHOTO DIODE
DESCRIPTION
PACKAGE DIMENSIONS PH302 is a photo diode with PIN structure, It has a wide photo-receiving nits mm area and high speed response enabling applications for various remote 1.72802 29203 controlling equipments. The resin material itself used for the package has ° aor ate filter effect to pass only infrared. {i | 3. Es FEATURES sr 3 « ° dae © Ultra high speed response. (t,. ty = 50 ns) ah 5 Coincidence of the wavelength of maximum sensitivity with that of = f ae H an infrared LED. (As max,= 940 nm) 12-te | © High sensitivity. (50 nA/Ix) 06+. 3 046 © Wide dynamic range. , ABSOLUTE MAXIMUM RATINGS wy sca” et Maximum Reverse Voltage (Ta=25°C) Va 32 v — Maximum Power Dissipation (Tg=25°C) Po 150 mW 1—>- 3 Maximum Temperatures Anode Catnode Junction Temperature Ty 80 °c Storage Temperature Tstg —40to+80 °C CONNECTION DIAGRAM i 2 \\
N E'C ELECTRONICS INC 30E D m™@ 6427525 0029600 2 mm PH302 1281-53 ELECTRO-OPTICAL CHARACTERISTICS (T,=25 °C) Quantum yietd [_omnsreunvetwe | wp | [ever | from 10 % to 90 % and 90 % to 10% a a [_oeweontimin Pe Tenn [fever] TYPICAL CHARACTERISTICS (T,*25 °C) WAVELENGTH SENSITIVITY DIRECTIONAL CHARACTERISTIC TITAN TT) UL ECEN ° L\\_\\ tt TN j ° A i 7 Yl frit 7 tT AE | ote PP “0 ar : Lt | el LI : Yi} {| it ELE T Ty ; Litt tf | 30030) 200900800300 1000 11002200 ar a ar er + wovtength = =m aoge ("3 Me CAPACITANCE va, SUPPLY VOLTAGE Fact Time “SUPPLY VOLTAGE CT a ee ee | A ee PST 7 pas |] ok | a A a | 50) %® ti) er INN. EEL , He Parra 220 = = 2 a] NHS , | Daa -” al att Pt pty | So to EE VR — Suooly Voltage -V 0 10 20 EC) VR~ Sunbly Votage -¥
N E C ELECTRONICS INC 30E D M® 6427525 0029601 4 es __PH02 A a | 10” ====—— ee eS Pe 10 /\\
5 A | 3 pa
ii} EDZAnaniil tt “| =—S====S== A A SO RN | 10-4 Fal a i a rr % 5 Ws 00 T,-Ambient Temperature -"C YR— Supply Voltage -V ee ey enna ; AMEE =ae © : Pwr 2 > LEE | | Er Cece ere ra -20 0 20 40 60 80 o 100 200 0 . Ey— "luminance -ix PHOTO CURRENT vs. SUPPLY VOLTAGE PHOTO CURRENT vs. SUPPLY VOLTAGE Ce a a es ee ee a F ae ol a a a re to oe a 2 | a ae 4 a A a ee a es a ° 10 20 0 25 1 is aan 1 4
NE C ELECTRONICS INC 30E D m@@ 6427525 0025602 & mm PH302 . _ $$ T-41-53 POWER DISSIPATION vs, . re “y x 40 30 40 1% HANDLING PRECAUTIONS: 1, The full resin-molded PH302 has generally a little less mechanical and thermal strength than other resin-molded semiconductor devices as they have less additives. Therefore please note on the following points. (a) Soldering of leads should be made at the point § mm or more from the root of the leads at 260 °C and within 5 s. (b) If the temperature of the molded portion rises in addition to the residual stress between the leads, the possibility that ‘open or short circuit occurs due to the deformation or destruction of the resin will increase. 2. On cleaning the device: . {a) Cleaning with unsuitable solvent may impair the resin if the package and the following solvents should be used at the temperature of less than 45 °C and for less than 3 minutes of immersion time. Ethanol, Methanol Isopropyl-alcohot {b} Ultrasonic cleaning will add some stress on devices. The degree of the stress differs depending on the oscillation output power, the size of the PCB and the mounting methods of the devices, therefore it should be confirmed by making an experiment at actual conditions that the cleaning does not have any problem on the devices.