PH2323-14 MA-COM | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- NPN silicon microwave power transistor
- Common base configuration
- Class C operation
- Interdigitated geometry
- Gold metallization system
- Hermetic metauceramic package
- Diffused emitter ballasting resistors
- Internal input and output impedance matching Outline Drawing ABSOLUTE MAXIMUM RATING AT 25°C Parameter Symbol Rating Units Collector-Emitter Voltage VCES 60 V Emitter-Base Voltage VEBO 3.0 V Collector Current IC 0.8 A Power Dissipation PD 25 W Junction Temperature TJ 200 °C Storage Temperature TSTG -65 to + 200 °C Thermal Resistance θJC 4.5 °C/W F (GHz) ZIN (Ω) ZOF (Ω) TEST FIXTURE IMPEDANCES ELECTRICAL SPECIFICATIONS AT 25°C Parameter Symbol Min Max Units Test Conditions Collector-Emitter Breakdown Voltage BVCES 60 - V IC = 10mA Collector-Emitter Leakage Current ICES - 2.0 mA VCE = 28V Input Power POUT 14 - w VCE = 28V, Pout = 2.5 W, F =2.3 GHz Power Gain GP 7.6 - dB VCE = 28V, Pout = 2.5 W, F =2.3 GHz Collector Efficiency ŋC 35 - % VCE = 28V, Pout = 2.5 W, F =2.3 GHz Input Return Loss RL 10 - dB VCE = 28V, Pout = 2.5 W, F =2.3 GHz Load Mismatch Tolerance VSWR-T - 2:1 - VCE = 28V, Pout = 2.5 W, F =2.3 GHz TEST FIXTURE INPUT CIRCUIT TEST FIXTURE OUTPUT CIRCUIT 50Ω 50 Ω ZIF Z OF
14W, 2.3 GHz M/A-COM Products PH2323-14
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. TEST FIXTURE ASSEMBLY TEST FIXTURE DIMENSIONS