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Technical content

Features

Applications

t)%57)BSEXBSF t -BQUPQ%FTLUPQ Computer t/FU XPSL)BSEXBSF t$PNQVUFS1FSJQIFSBMT t%JHJUBM$BNFSB t&YUFSOBM4UPSBHF t4FU5PQ#PY t"OUFOOB t 3P)4DPNQMJBOU MFBEGSFF and available halogen-free t6MUSBMPXDBQBDJUBODF t-PXMFBLBHFDVSSFOU t'BTUSFTQPOTFUJNF t#JEJSFDUJPOBM t 8JUITUBOETNVMUJQMF &4%TUSJLFT t $PNQBUJCMFXJUI QJDLBOEQMBDFQSPDFTTFT t "WBJMBCMFJO 5000 and 10000 piece SFFMT &*"34 Equivalent Circuits 0402 and 0603 Devices SOT23 Device Product Characteristics Part Number Lines Protected Component Package Available as Halogen-Free PGB1010402 1 0402 /P1 PGB1010603 1 0603 Y es PGB102ST23 2 SOT23 Y es

Electrical Characteristics

Specification PGB1010402 PGB1010603 PGB102ST23 Notes ESD Capability: IEC 61 000-4-2 Contact Discharge *&$"JS%JTDIBSHF 1FBL7PMUBHF UZQJDBM 1000V 500V 500V Measured per IEC 61000-4-2 L7$POUBDU%JTDIBSHF Clamping Voltage (typical) 250V 1 50V 1 50V Measured per IEC 61000-4-2 L7$POUBDU%JTDIBSHF 2, at 25 nsec. 3BUFE7PMUBHF NBYJNVN 12VDC 24VDC 24VDC Capacitance (typical) Q' Q' Q' Measured at 250 MHz 3FTQPOTF5JNF <1nS <1nS <1nS -FBLBHF$VSSFOU UZQJDBM O" 7%$ O" 7%$ O" 7%$ &4%1VMTF8JUITUBOE 100 pulses min 1000 pulses min 1000 pulses min Some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate /PUFT1(#QSPEVDUOPUPGGFSFEBT)BMPHFO'SFF4FF1(#TFSJFTQSPEVDUJOTUFBE IUUQXXXMJUUFMGVTFDPNTFSJFT1(#IUNM 5FTUJOHQFSGPSNFEPO-JUUFMGVTFUFTUTFUVQBTEFTDSJCFEJO5ZQJDBM5FTU4FUVQ4FDUJPOPOQBHFPGUIJTEPDVNFOU PGB1 Series Halogen-Free / Lead-Free

www.littelfuse.com ©2011 Littelfuse PGB1 Series Specifications are subject to change without notice. Revised: January 11, 2012 PulseGuard® Suppressors Surface Mount Polymeric ESD Suppressors T ypical Device Capacitance 0.01 0.10 1.00 100 1,000 10,000 Frequency (MHz) PGB1010402 PGB1010603 PGB102ST23 Capacitance (pF) T ypical ESD Response 200 400 600 800 1000 1200 -25 0 25 50 75 100 125 150 175 PGB1010603 PGB102ST23 PGB1010402 Time (ns) Voltage (V) Dimensions Reflow Solder Wave Solder 1.27 (0.050") 0.76 (0.030") 3.30 (0.130") 3.05 (0.120") 1.27 (0.050") 0.51 (0.020") 1.66 +/- 0.06 0.84 +/- 0.05 0.36 (0.014") 1.04 (0.041") REF 0.43 +/- 0.18

0402 Device

Reflow Solder 2.24 +/- 0.18 1.27 (0.050") 1.02 (0.040") 2.03 (0.080") 0.51 (0.020") 0.64 (0.025") 2.29 (0.090") 2.54 1.02 (0.040") 0.15 +/- 0.08 (0.006 +/- 0.003") TYP 0.81 (0.032") TYP 1.09 (0.043") 1.91 (0.075") 0.91 (0.036") TYP 3.00 +/- 0.20 0.69 +/- 0.10 (0.027" +/- 0.004) Wave Solder 1.27 (0.050") 1.27 (0.050") 2.29 (0.090") 0.64 (0.025") 1.02 (0.040") SOT23 Device 0.56 (0.022") Recommended for reflow soldering only 0.99 +/- 0.05 0.25 (0.010") 0.24 +/- 0.09 0.38 (0.015") .58 (0.023") 1.55 (0.061") 0.15 +/- 0.08 0.310 +/- 0.08 0.51 +/- 0.05 Reflow Solder

0603 Device

Dimensions: mm (inch) Part Numbering System PGB1 01 0603 MR QUANTITY & PACKAGING CODE: MR = 1000 pieces, tape & reel WR = 3000 pieces, tape & reel NR = 5000 pieces, tape & reel KR = 10,000 pieces, tape & reel *Note: PGB1 0402 product not available as Halogen Free item. See PGB2 0402 product instead, part number PGB2010402KRHF (http://www.littelfuse.com/series/PGB2010402.html). LINES PROTECTED: 01 = 1 line 02 = 2 lines DEVICE SIZE CODE: 0402 = 0402 (1005)* 0603 = 0603 (1608) ST23 = SOT23 LEAD-FREE PULSEGUARD ESD SUPPRESSORS Dimensions: mm (inch) Dimensions: mm (inch)

www.littelfuse.com ©2011 Littelfuse PGB1 Series Specifications are subject to change without notice. Revised: January 11, 2012 PulseGuard® Suppressors Surface Mount Polymeric ESD Suppressors Environmental Specifications Operating T emperature -65°C to +125°C Moisture Resistance 0402 series: IPVST 0603, ST23: IPVST Thermal Shock .*-45% .FUIPE -65°C to 125°C, 30 min. cycle, 10 cycles Vibration .*-45% .FUIPE to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y -Z) Chemical Resistance .*-45% .FUIPE Solder Leach Resistance and T erminal Adhesion *1$&*"+45% Physical Specifications Materials #PEZ(MBTT&QPYZ 5FSNJOBUJPOT$PQQFS/JDLFM5JO Solderability .*-45% .FUIPE Soldering Parameters 8BWFTPMEFS¡$ TFDPOETNBYJNVN 3FnPXTPMEFS¡$ TFDPOETNBYJNVN Design Consideration Because of the fast rise-time of the ESD transient, proper QMBDFNFOUPG1 VMTF(VBSETVQQSFTTPSTBSFBLFZEFTJHO consideration to achieving optimal ESD suppression. The devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard TVQQSFTTPST DPOOFDUFEGSPNTJHOBMEBUBMJOFUPHSPVOE directly behind the connector so that they are the first board- level circuit component encountered by the ESD transient. Soldering Parameters Reflow Condition 1Co'SFFBTTFNCMZ Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) oTFDPOET Average ramp up rate (Liquidus Temp (TL) to peak ¡$TFDPOENBY TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY Reflow - Temperature (TL) (Liquidus) ¡$ - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time within 5°C of actual peak Temperature (t p) 10 – 30 seconds Ramp-down Rate ¡$TFDPOENBY Time 25°C to peak Temperature (TP) NJOVUFTNBY

www.littelfuse.com ©2011 Littelfuse PGB1 Series Specifications are subject to change without notice. Revised: January 11, 2012 PulseGuard® Suppressors Surface Mount Polymeric ESD Suppressors T ypical T est Setup AGILENT INFINIIUM

1.5 GHz 8 GS/s

6158 (20x TIP) RESISTANCE TEST FIXTURE QUADTECH 1865 RESISTANCE METER COMPUTER FARADAY CAGE ESD PULSE GENERATOR TEST BOARD W/ DUT ESD TEST FIXTURE T ape and Reel Specifications Description 0402 Series (mm)

0603 Series

(mm) SOT23 Series (mm) Ct$PWFSUBQFUIJDLOFTT 0.05 0.05 0.06 Dd - Drive hole diameter 1 .501 . 501 .50 Ds - Drive hole spacing 4.00 4.00 4.00 Pd1PDLFUEFQUI 0.41 1 .02 Ph1PDLFUIFJHIU 1. 12 3.23 Ps1PDLFUTQBDJOH 2.00 4.00 4.00 Pw1PDLFUXJEUI 0.62 1 .02 2.46 Tt$BSSJFSUBQFUIJDLOFTT 0.61 0.65 Tw - Carrier tape width T Ds PP D Ct Ps P Tt Packaging Part Number Quantity & Packaging Code Quantity Packaging Option Packaging Specification PGB1010402 ,3 1 0000 5BQF3FFM wSFFM QBSU PGB1010603 .3 1000 5BQF3FFM wSFFM QBSU PGB102ST23 83 3000 5BQF3FFM wSFFM QBSU PGB1010603 /3 5000 5BQF3FFM wSFFM QBSU