PGA970 TI | Alldatasheet
Document overview
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Technical content
M U X External Temperature Sensor Internal Temperature Sensor Diagnostics ARM Cortex M0 (User Programmable) Debugger Digital Demodulation Digital Demodulation ADC ADCPGA Gain Wave Gain Waveform Generator Reference Internal Oscillator Power Management OWI SPI GPIO 14-bit DAC C o r e LVDT Sensor Software and Data Memory 16KB FRAM 2KB RAM 512B RAM Control and Status Registers PGA PGA PI PE S1P S2P S2N S1N AIN1 COMP FBN OUT SWDIO SWDCLK MISO/MOSI CSN/SCK GPIO1 GPIO2 VDD (3.3 to 30 V) PGA970 Copyright © 2016, Texas Instruments Incorporated Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. PGA970 SLDS257 –APRIL 2019 PGA970LVDTSensorSignalConditioner
1 Features
1• Analog features – Programmable-gain analog front end for LVDT sensors – Excitation waveform generator and amplifier – Dual 24-bit ADC with amplitude and phase demodulators – 24-bit auxilary ADC – On-chip internal temperature sensor – 14-bit output DAC with programmable gain – Built-in diagnostics
- Digital features – ARM® Cortex®-M0 microcontroller – 16KB ferroelectric RAM (FRAM) program memory – 2KB general-pupose RAM – 512B RAM waveform-generator look-up table – 8-MHz on-chip oscillator
- Peripheral features – Serial peripheral interface (SPI) – One-wire interface (OWI) – Ratiometric and absolute voltage output
- General features – Operational supply range: 3.5 V to 30 V – Ambient temperature range: –40°C to +125°C – DMOS gate controller for extended supply range >30 V
2 Applications
- Position sensor signal conditioning
- Linear variable differential transformer (LVDT)
- Rotational variable differential transformer (RVDT)
- Resolver
- RLC measurement
3 Description
The PGA970 is a highly integrated system-on-chip LVDT sensor-signal conditioner with advanced signal- processing capabilities. It contains a three-channel, low-noise, programmable-gain, analog front end that allows direct connection to the sense element, followed by three independent 24-bit delta-sigma ADCs. Further, the device contains a digital signal- demodulation block that interfaces to an integrated ARM-Cortex M0 MCU, allowing implementation of custom sensor-compensation algorithms stored in the device nonvolatile memory. External system communication is achieved by using any of the SPI, OWI, GPIO, or PWM digital interfaces. Analog output is supported through a 14-bit DAC and programmable-gain amplifier offering reference or absolute-voltage output. Sensing-element excitation is achieved by the use of an integrated waveform generator and waveform amplifier. The waveform signal data is user-defined and stored in a designated RAM memory area. Besides the primary functional components, the PGA970 is equipped with additional support circuitry. The device diagnostics, sensor diagnostics, and integrated temperature sensor provide protection and information about the integrity of the overall system and sensing element. The device also includes a gate-controller circuit which when used with an external depletion MOSFET can regulate the device supply voltage in systems where the supply voltage exceeds 30 V. Device Information(1) ORDER NUMBER PACKAGE BODY SIZE (NOM) PGA970QPHPR HTQFP (48) 7.00 mm × 7.00 mm PGA970QPHPT (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Diagram
SLDS257 –APRIL 2019 www.ti.com Product Folder Links: PGA970 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Documentation
For related documentation see the following:
- Texas Instruments, PGA970 GUI user's guide
- Texas Instruments, PGA970 Software Quick Start Guide user's guide
- Texas Instruments, PGA970 Software user's guide
- Texas Instruments, PGA970EVM user's guide
4.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
4.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
4.4 Trademarks
E2E is a trademark of Texas Instruments. ARM, Cortex are registered trademarks of ARM Limited. All other trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.6 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most- current data available for the designated device. This data is subject to change without notice and without revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) PGA970QPHPR Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 PGA970Q PGA970QPHPR.A Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 PGA970Q PGA970QPHPRG4.A Active Production HTQFP (PHP) | 48 1000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 PGA970Q (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 24-Feb-2023 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 24-Feb-2023 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PGA970QPHPR HTQFP PHP 48 1000 350.0 350.0 43.0 Pack Materials-Page 2
www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. TQFP - 1.2 mm max heightPHP 48 QUAD FLATPACK7 x 7, 0.5 mm pitch 4226443/A
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