PGA900ARHHT.A

PGA900 TI | Alldatasheet

Document overview

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Technical content

SCL, SDA ARM CORTEX M0 (PROGRAMMABLE BY USERS) GAIN VDD (3.3 ± 30 V) OWI SPI, UART I2C PWM VOUT MUX DEBUGGER INTERNAL TEMPERATURE SENSOR TOPDIG, TONDIG MISO/TX, MOSI/RX, CSN, SCK RATIOMETRIC BRIDGE EXCITATION 24-bit ADCPGA 24-bit ADCPGA CONTROL AND STATUS REGISTERS SOFTWARE AND DATA MEMORY EEPROM 14-bit DAC PGA900 VBRGP VBRGN VINPP VINPN VINTP VINTN OPTIONAL EXTERNAL TEMPERATURE SENSOR BRIDGE SENSOR TEMPERATURE SENSING AFE RESISTIVE SENSING AFE OR SWDIO, SWDCLK REFERENCE GPIO2 GPIO1 Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. PGA900 SLDS258 – APRIL 2019 PGA900ProgrammableResistiveSensingConditionerWithDigitalandAnalogOutputs

1 Features

1• High accuracy, low noise, low power, small size resistive sensing signal conditioner

• User-programmable temperature and nonlinearity compensation
• On-chip ARM® Cortex® M0 microprocessor allows users to develop and implement calibration software
• One-wire interface enables the communication through power supply pin without using additional lines
• On-chip power management accepts wide power supply voltage from 3.3 V to 30 V
• Operating temperature range: –40°C to +150°C
• Memory: – 8-kB software memory – 128 bytes EEPROM – 1-kB data SRAM
• Accommodates sensor sensitivities from 1 mV/V to 135 mV/V
• Two individual analog-front end (AFE) chains, each including: – Low-noise programmable gain amplifier – 24-bit sigma-delta analog-to-digital converter
• Built-in internal temperature sensor with option to use external temperature sensor
• 14-bit DAC with programmable gain amplifier
• Output options: – Ratiometric and absolute voltage output – 4- to 20-mA current loop interface – One-wire interface (OWI) over power line – PWM output – Serial peripheral interface (SPI) – Inter-integrated circuit (I2C)
• Depletion MOSFET gate driver
• Diagnostic functions

2 Applications

• Pressure sensor transmitters and transducers
• Liquid level meters and flow meters
• Weight scales, load meters, and strain gauges
• Thermocouples, thermistors, and 2-wire resistance thermometers (RTD)
• Resistive field transmitters

3 Description

The PGA900 is a signal conditioner for resistive sensing applications. It can accommodate various sensing element types. The PGA900 conditions its input signals by amplification and digitization through two analog front end channels. With the user programmed software in the on-chip ARM Cortex M0 processor, the PGA900 can perform linearization, temperature compensation, and other user defined compensation algorithms. The conditioned signal can be output as ratiometric voltage, absolute voltage, 4- to 20-mA current loop or PWM. The data and configuration registers can also be accessed through SPI, I2C, UART, and two GPIO ports. In addition, the unique OWI allows communication and configuration through the power supply pin without using additional lines. The PGA900 operating voltage is from 3.3 V to

30 V and it can operate in temperatures from –40°C

to +150°C. Device Information(1) NUMBER PACKAGE BODY SIZE (NOM) PGA900 VQFN (36) 6.00 mm × 6.00 mm DSBGA (36) 3.66 mm × 3.66 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. PGA900 Simplified Block Diagram

SLDS258 – APRIL 2019 www.ti.com Product Folder Links: PGA900 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated

4 Device and Documentation Support

4.1 Documentation Support

4.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, PGA900 as a Capacitive Load Driver application note
• Texas Instruments, PGA900 as a 4- to 20-mA Current Loop Transmitter application note
• Texas Instruments, Understanding Open Loop Gain of the PGA900 DAC Gain Amplifier application note
• Texas Instruments, Connecting PGA900 Instrumentation Amplifier to Resistive Bridge Sensor application note
• Texas Instruments, Understanding Open Loop Output Impedance of the PGA900 DAC Gain Amplifier application note
• Texas Instruments, System Noise Analysis of a Resistive Bridge Pressure Sensor Connected to the PGA900 application note
• Texas Instruments, PGAxxxEVM-034 user’s guide
• Texas Instruments, PGA900 Software user's guide
• Texas Instruments, PGA900 Pressure and Temperature Sensor Signal Conditioner user's guide

4.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

4.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

4.4 Trademarks

E2E is a trademark of Texas Instruments. ARM, Cortex are registered trademarks of ARM Ltd. All other trademarks are the property of their respective owners.

4.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

4.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) PGA900ARHHR Active Production VQFN (RHH) | 36 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 PGA900A RHH PGA900ARHHR.A Active Production VQFN (RHH) | 36 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 PGA900A RHH PGA900ARHHRG4.A Active Production VQFN (RHH) | 36 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 PGA900A RHH PGA900ARHHT Active Production VQFN (RHH) | 36 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 PGA900A RHH PGA900ARHHT.A Active Production VQFN (RHH) | 36 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 PGA900A RHH PGA900AYZSR Active Production DSBGA (YZS) | 36 1500 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 150 PGA900A YZS PGA900AYZSR.A Active Production DSBGA (YZS) | 36 1500 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 150 PGA900A YZS PGA900AYZST Active Production DSBGA (YZS) | 36 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 150 PGA900A YZS PGA900AYZST.A Active Production DSBGA (YZS) | 36 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 150 PGA900A YZS (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. Addendum-Page 1

www.ti.com 23-May-2025 (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PGA900ARHHR VQFN RHH 36 2500 367.0 367.0 38.0 PGA900ARHHT VQFN RHH 36 250 182.0 182.0 20.0 PGA900AYZSR DSBGA YZS 36 1500 182.0 182.0 20.0 PGA900AYZST DSBGA YZS 36 250 182.0 182.0 20.0 Pack Materials-Page 2

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRHH 36 PLASTIC QUAD FLATPACK - NO LEAD6 x 6, 0.5 mm pitch 4225440/A

www.ti.com PACKAGE OUTLINE C

0.625 MAX

0.225 0.175 2.5 TYP 2.5 TYP

0.5 TYP

36X 0.3 0.2 B E A D 4219444/A 02/2018 DSBGA - 0.625 mm max heightYZS0036 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 1 2 3

0.015 C A B

B C D E F SCALE 5.000 D: Max = E: Max = 3.745 mm, Min = 3.62 mm, Min = 3.685 mm 3.56 mm

www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN0.05 MAX 36X ( 0.23) (0.5) TYP (0.5) TYP ( 0.23) SOLDER MASK OPENING ( 0.23) METAL 4219444/A 02/2018 DSBGA - 0.625 mm max heightYZS0036 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 3 4 5 6 A B D E F LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 25X NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED METAL UNDER SOLDER MASK EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (0.5) TYP (0.5) TYP 4219444/A 02/2018 DSBGA - 0.625 mm max heightYZS0036 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM 1 2 3 4 5 6 C A B D E F SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE: 25X METAL TYP

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