PGA2311_06 BURR-BROWN | Alldatasheet
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Technical content
SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 /C0083/C0116/C0101/C0114/C0101/C0111 /C0065/C0117/C0100/C0105/C0111 /C0086/C0111/C0108/C0117/C0109/C0101 /C0067/C0111/C0110/C0116/C0114/C0111/C0108 /C0080/C0071/C0065/C0050/C0051/C0049/C0049
FEATURES
/C0068DIGITALLY-CONTROLLED ANALOG VOLUME CONTROL Two Independent Audio Channels Serial Control Interface Zero Crossing Detection Mute Function /C0068WIDE GAIN AND ATTENUATION RANGE +31.5dB to –95.5dB with 0.5dB Steps /C0068LOW NOISE AND DISTORTION 120dB Dynamic Range 0.0004% THD+N at 1kHz (U-Grade) 0.0002% THD+N at 1kHz (A-Grade) /C0068NOISE-FREE LEVEL TRANSITIONS /C0068LOW INTERCHANNEL CROSSTALK –130dBFS /C0068POWER SUPPLIES: ±5V Analog, +5V Digital /C0068AVAILABLE IN DIP-16 AND SOL-16 PACKAGES /C0068PIN AND SOFTWARE COMPATIBLE WITH THE CRYSTAL CS3310
APPLICATIONS
/C0068AUDIO AMPLIFIERS /C0068MIXING CONSOLES /C0068MULTI-TRACK RECORDERS /C0068BROADCAST STUDIO EQUIPMENT /C0068MUSICAL INSTRUMENTS /C0068EFFECTS PROCESSORS /C0068A/V RECEIVERS /C0068CAR AUDIO SYSTEMS
DESCRIPTION
The PGA2311 is a high–performance, stereo audio volume control designed for professional and high-end consumer audio systems. Using high performance operational amplifier stages internal to the PGA2311 yields low noise and distortion, while providing the capability to drive 600Ω loads directly without buffering. The 3-wire serial control interface allows for connection to a wide variety of host controllers, in addition to support for daisy-chaining of multiple PGA2311 devices. www.ti.com Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to ob- serve proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE –LEAD PACKAGE DESIGNATOR (1) OPERATING TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DIP–16 N PGA2311P PGA2311P Rails PGA2311 (U–Grade) SOL 16 DW –40°C to +85°C PGA2311U PGA2311U RailsPGA2311 (U Grade) SOL –16 DW
40 C to +85 C
PGA2311U PGA2311U/1K Tape and Reel, 1000 DIP–16 N PGA2311PA PGA2311PA Rails PGA2311 (A–Grade) SOL 16 DW –40°C to +85°C PGA2311UA PGA2311UA RailsPGA2311 (A Grade) SOL –16 DW PGA2311UA PGA2311UA/1K Tape and Reel, 1000 (1)For the most current specifications and package information, refer to our web site at www. ti.com.
ELECTRICAL CHARACTERISTICS
At TA = +25°C, VA+ = +5V, VA– = –5V, VD + = +5V, RL = 100kΩ , CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. PARAMETER CONDITIONS PGA2311P , U (U–Grade). PGA2311PA, UA (A–Grade) UNITSPARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS DC CHARACTERISTICS Step Size 0.5 0.5 dB Gain Error Gain Setting = 31.5dB ±0.05 ±0.05 dB Gain Matching ±0.05 ±0.05 dB Input Resistance 10 10 kΩ Input Capacitance 3 3 pF AC CHARACTERISTICS THD+N VIN = 2Vrms, f = 1kHz 0.0004 0.001 0.0002 0.0004 % Dynamic Range VIN = AGND, Gain = 0dB 116 120 116 120 dB Voltage Range, Output (VA–) + 1.25 (VA+) – 1.25 (VA–) + 1.25 (VA+) – 1.25 V Voltage Range, Input (without clipping) 2.5 2.5 Vrms Output Noise VIN = AGND, Gain = 0dB 2.5 4 2.5 4 µVrms Interchannel Crosstalk f = 1kHz –130 –130 dBFS OUTPUT BUFFER Offset Voltage VIN = AGND, Gain = 0dB 0.25 0.5 0.25 0.5 mV Load Capacitance Stability 100 100 pF Short–Circuit Current 50 50 mA Unity–Gain Bandwidth, Small Signal 10 10 MHz
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com ELECTRICAL CHARACTERISTICS (Cont.) At TA = +25°C, VA+ = +5V, VA– = –5V, VD + = +5V, RL = 100kΩ , CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. PARAMETER CONDITIONS PGA2311P , U (U–Grade) PGA2311PA, UA (A–Grade) UNITSPARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS DIGITAL CHARACTERISTICS High–Level Input Voltage, VIH +2.0 VD + +2.0 VD + V Low –Level Input Voltage, VIL –0.3 0.8 –0.3 0.8 V High–Level Output Voltage, VOH IO = 200µA (VA+) – 1.0 (VD +) – 1.0 V Low –Level Output Voltage, VOL IO = –3.2mA 0.4 0.4 V Input Leakage Current 1 10 1 10 µA SWITCHING CHARACTERISTICS Serial Clock (SCLK) Frequency fSCLK 0 6.25 0 6.25 MHz Serial Clock (SCLK) Pulse Width LOW tPH 80 80 ns Serial Clock (SCLK) Pulse Width HIGH tPL 80 80 ns MUTE Pulse Width LOW tMI 2.0 2.0 ms Input Timing SDI Setup Time tSDS 20 20 ns SDI Hold Time tSDH 20 20 ns CS Falling to SCLK Rising tCSCR 90 90 ns SCLK Falling to CS Rising tCFCS 35 35 ns Output Timing CS LOW to SDO Active tCSO 35 35 ns SCLK Falling to SDO Data Valid tCFDO 60 60 ns CS HIGH to SDO High Impedance tCSZ 100 100 ns POWER SUPPLY Operating Voltage Quiescent Current IA+ VA+ = +5V 8 10 8 10 mA IA– VA– = –5V 10 12 10 12 mA ID + VD + = +5V 0.5 1.0 0.5 1.0 mA Power–Supply Rejection Ratio PSRR (250Hz) 100 100 dB TEMPERATURE RANGE Operating Range –40 +85 –40 +85 °C Storage Range –65 +150 –65 +150 °C Thermal Resistance, JC DIP–16 60 60 °C/W SOL –16 50 50 °C/W
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com PIN CONFIGURATION Top View DIP , SOL PIN ASSIGNMENTS PIN NAME FUNCTION
1 ZCEN Zero Crossing Enable Input (Active HIGH)
2 CS Chip Select Input (Active LOW)
3 SDI Serial Data input
4 VD + Digital Power Supply, +5V
5 DGND Digital Ground
6 SCLK Serial Clock Input
7 SDO Serial Data Output
8 MUTE Mute Control Input (Active LOW)
9 VINR Analog Input, Right Channel
10 AGNDR Analog Ground, Right Channel
11 VOUT R Analog Output, Right Channel
12 VA+ Analog Power Supply, +5V
13 VA– Analog Power Supply, –5V
14 VOUT L Analog Output, Left Channel
15 AGNDL Analog Ground, Left Channel
16 VINL Analog Input, Left Channel
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VA+ = +5V, VA– = –5V, VD + = +5V, RL = 100kΩ , CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. (NOTE: All plots taken with PGA2311 A–Grade.)
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com TYPICAL CHARACTERISTICS (CONT.) At TA = +25°C, VA+ = +5V, VA– = –5V, VD + = +5V, RL = 100kΩ , CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. (NOTE: All plots taken with PGA2311 A–Grade.)
functional block diagram of the PGA2311. tings for for each channel via the serial control port. supply voltage returns to greater than ±3.2V. VOUT R (pin 11) and VOUT L (pin 14). output voltage range is 7.5Vp-p. Typical Characteristics section of the datasheet. Figure 1. PGA2311 Block Diagram.
analog ground (AGNDR or AGNDL). Figure 3. Serial Interface Timing Requirements.
terface to control many PGA2311 devices. to allow enough SCLK cycles to load all devices. tion that can provide for noise-free level transitions. ing of the input signal, thus minimizing audible glitches. Figure 4. Daisy-Chaining Multiple PGA2311 Devices.
Figure 6. Typical PCB Layout Floor Plan.
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com PACKAGE DRAWINGS
/C0080/C0071/C0065/C0050/C0051/C0049/C0049 SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 www.ti.com PACKAGE DRAWINGS (Cont.)
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) PGA2311P ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311PA ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311PAG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311PG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311U ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311U/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311U/1KG4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR PGA2311UA ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UA/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UA/1KG4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UAG4 ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UG4 ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2006 Addendum-Page 1
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2006 Addendum-Page 2
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