PFMT SCHURTER | Alldatasheet

Document overview

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Technical content

www.schurter .com 19 Surface Mount PTC-Fuses Type PFMT 5,4 x 8,5 mm High voltage surge capabilities Compliance to ITU K.20/K.21 specifications Packaged per EIA 486-B Agency recognition: UL, CSA, TÜV Typical Time to Trip at 23 ˚C Time to trip (s) Dimensions

Applications

Used as a secondary overcurent protection device in:

  • Customer Premise Equipment (CPE)
  • Central Office (CO)
  • Subscriber Line Interface Cards (SLIC) Test Procedures And Requirements For Model PFMT Series Test / Test Test Conditions / Bedingungen Accept/Reject Criteria Visual/Mech. / visuell/mech. Verify dimensions and materials / Kontrolle Abmess./Mat. Per MF physical description Resistance / Widerstand In still air @ 23°C / bei ruhiger Luft 23 °C Rmin ≤ R ≤ Rmax Time to Trip / Trip-Zeit At specified current, Vmax 23 °C / Bei entspr. Strom T ≤ max. time to trip (sec.) Hold Current / Haltestrom 30 min. at Ihold / bei Haltestrom No trip / Keine Auslösung Trip Cycle Life / Trip-Zyklen Vmax, Imax, 100 cycles / Zyklen No arcing or burning Trip Endurance / Zeit im Tripzustand Vmax, 48 hours / Stunden No arcing or burning Solderability / Lötbarkeit MIL-STD-202F, Method 208F / Methode 208F 95% min. coverage Environmental Characteristics Operating/Storage Temperature / Einsatz/Lagertemp. -45 °C to +85 °C Maximum Device Surface Temperature in Tripped State / 125 °C Passive Aging / passive Alterung +85 °C, 1000 hours / Std. ± 2% typ. resist. change +60 °C, 1000 hours / Std. ± 3% typ. resist. change Thermal Shock / Thermischer Schock MIL-STD-202F, Method 107G ±10% typ. resist. change +125 °C/–55 °C 10 times / Zyklen ±15% typ. resist. change Solvent Resistance / Lösungsmittel-Beständigkeit MIL-STD-202, Method 215B No change Lead Solerability / Lötbarkeit ANSI/J-STD-002 Flammability / Entflammbarkeit IEC 695-2-2 No Flame for 60 sec. Vibration MIL-STD-883C, Method 2007.1, No change Condition A Typical Part Marking Layout may vary Manufacturer’s Trademark Part identification Date code week 1 of 2000 = 0A (year and week) week 27 of 2000 = A0 (week and year) Resistance Bin 50 75 100 Fault current (A) 0.1 1 5 0.1 0.01 PFMT.013.250.2 PFMT.013.250.B.2 1.8 (.071) 4.6 (.181) 9.7 (.382) 1.8 (.071) 4.6 (.181) Solder pad layouts End View / Endansicht Side View End View / Endansicht C B D A C E

www.schurter .com20

Electrical Characteristics

Soldering Profile / Lötprofil How To Order PF MT .xxx .xxx .x .x PTC-Fuse Style MT = Surface Mount/ Telecom Component Hold Current, Ihold 013 (0.13 Amps) Max. Interrupt Voltage, V 250 (250 V) Resistance Sorted Ω A = 6.5-9Ω B = 9-12Ω C = 7-12Ω Packaging Options Packaged per EIA 486-B 2 = Tape and reel Solder reflow

  • Recommended reflow methods: I R, vapor phase oven, hot air oven.
  • Devices are not designed to be wave soldered to the bottom side of the board.
  • Gluing the devices is not recom- mended.
  • Recommended maximum paste thickness is 0,25 mm (.010 inch).
  • Devices can be cleaned using standard industry methods and solvents. Note:
  • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework
  • A device should not be reworked. Thermal Derating Chart-Ihold/Itrip (Amps) Type / Typ Ambient Operating Temperature Dimensions in mm/inches Type / Typ Max. Oper. Max. Interrupt Hold Current / Initial Resistance / One Hour Nom. Power Voltage / Ratings / Post-Trip Dissipation Restistance / Volts Volts Amps Amps Ohms Ohms Ohms Watts at at / bei 23 °C at / bei 23 °C at / bei 23 °C at / bei 23 °C 650 V / 23 °C Maximum Package Body Temperature (220 °C) Melting Temperature of Solder (183 °C)

2 Minutes or More

Preheat Flux Activation Reflow Cool 10° to 20 C per Second Less than 120 °C per Second 300 250 200 150 100 0 30 60 100 150 200 250 Temperature (° C) / T Time (Seconde) (s) Packaged: Tape and reel: 2000 pcs. per reel