PFMD SCHURTER | Alldatasheet
Document overview
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Technical content
www.schurter.com 13 Surface Mount PTC-Fuses Type PFMD 3,4 x 4,7 mm fast tripping Packaged per EIA 481-1 Agency recognition: UL, CSA, TÜV Typical Time to Trip at 23 ˚C Dimensions / Abmessungen Solder pad layouts 50 75 100 A C B D
Applications
- Hard disk drives
- PC motherboards
- PC peripherals
- Point-of-sale (POS) equipment
- PCMCIA cards
- General Electronics Typical Part Marking Layout may vary Manufacturer’s Trademark Part identification Date code week 1 of 2000 = 0A (year and week) week 27 of 2000 = A0 (week and year) Test Procedures And Requirements For Model PFMD Series Test / Test Test Conditions / Bedingungen Accept/Reject Criteria Visual/Mech. / visuell/mech. Verify dimensions and materials / Kontrolle Abmess./Mat. Per PF physical description Resistance / Widerstand In still air @ 23 °C / bei ruhiger Luft 23 °C Rmin ≤ R ≤ Rmax Time to Trip / Trip-Zeit At specified current, Vmax, 23 °C / Bei entspr. Strom T ≤ max. time to trip / Trip-Zeit (sec.) Hold Current / Haltestrom 30 min. at Ihold / bei Haltestrom No trip Trip Cycle Life / Trip-Zyklen Vmax, Imax, 100 cycles / Zyklen No arcing or burning Trip Endurance / Zeit im Tripzustand Vmax, 48 hours / Stunden No arcing or burning Environmental Characteristics Operating/Storage Temperature / Einsatz/Lagertemp. –40 °C to / bis +85 °C Maximum Device Surface Temperature in Tripped State / 125 °C Passive Aging / passive Alterung +85 °C, 1000 hours / Std. ± 5% typ. resist. change Thermal Shock / Thermischer Schock +85 °C to/bis –40 °C, 20 times / Zyklen ± 10% typ. resist. change Solvent Resistance / Lösungsmittel-Beständigkeit MIL-STD-202, Method 215 No change Vibration MIL-STD-883C, Method 2007.1, No change Condition A 0.1 1 10 100 100 0.1 0.01 0.001 Fault current (A) Time to trip (s) PFMD.010.2 PFMD.125.2 PFMD.075.2 PFMD.260.2 PFMD.110.2 PFMD.050.2 PFMD.150.2 PFMD.030.2 PFMD.014.2 PFMD.020.2 PFMD.160.2 PFMD.200.2
www.schurter.com14 Type / Typ Imax Vmax Ihold Itrip Initial 1 Hour (R1) Post- Max. Time Tripped Power Resistance / Reflow Resistance / to trip at 23 °C/8A / Dissipation / Amperes at 23 °C / Ohms at 23 °C / Amperes / Seconds / Watts at 23 °C / AV Hold Trip R min. R1 max. at / bei 23 °C at / bei 23 °C
Electrical Characteristics
Packaging: 2000 pcs. per reel Dimensions in mm/inches Soldering Profile Note PFMD
- models can be wave soldered and reworked. Maximum Package Body Temperature (220 °C) Melting Temperature of Solder (183 °C)
2 Minutes or More
Preheat Flux Activation Reflow Cool 10° to 20 C per Second Less than 120 °C per Second 300 250 200 150 100 0 30 60 100 150 200 250 Temperature (° C) / Time (Second) (s) PF MD .xxx .x PTC-Fuse / Style MD = 4,5 mm Surface Mount Component Hold Current, Ihold 010-260 (0,10 A - 2,60 A) Packaging Packaged per EIA 481-1 2 = Tape and reel / Thermal Derating Chart-Ihold / Itrip (Amps) Type / Typ Ambient Operating Temperature How To Order