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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
Features
Size 1005mm/0402mils,1608mm/0603mils Surface Mount packaging for automated assembly Very low capacitance 0.15pF ESD/PESD Series IEC Compatibility IEC61000-4-2(ESD):Contact:±8kv,Air:±15kv
Applications
High speed data transmission line A B C D1 D2 C B Dimensions(0402/0603) DIM A B C D1/D2 A B C D1/D2 Millimeters Min 0.85 0.40 0.40 0.10 1.45 0.65 0.70 0.10 Max 1.15 0.60 0.60 0.30 1.75 0.95 0.90 0.50 Min 0.033 0.016 0.016 0.004 0.057 0.026 0.028 0.004 Max 0.045 0.024 0.024 0.012 0.069 0.037 0.035 0.020 Inches CODE 0402 0603 Product Name PESD040205A015FR B:Buik pack R:Tape& Reel pake S:Solderable(Ag/Pd/Pt) F:Electroplate(Pb-free) 015:0.15pF 020:0.2pF 030:0.3pF A:300V B:500V C:1000V 05:5V 12:12V 14:14V 18:18V 24:24V 0402:1.0*0.5mm 0603:1.6*0.8mm PESD:Product Series Packaging Type Termination Type Capacitance Trigger Voltage Working Voltage Size Designator Series Name
/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Product Application ESD/PESD Series GPS S.W USPCS (K-PCS) CDMA PESD PESD
Electrical Characteristics
(V) Leakage Current IL (µA) Response time (ns) Trigger Voltage VT (V) Clamping Voltage VC (V) Capacitance CPZ@1MH (pF) PESD040205A015FR PESD040212A015FR PESD040214A015FR PESD040218A015FR PESD040224A015FR PESD060305A015FR PESD060312A015FR PESD060314A015FR PESD060318A015FR PESD060324A015FR 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 300 300 300 300 300 300 300 300 300 300 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15
/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Reliability Test ESD/PESD Series ITEM REQUIREMENTS TEST CONDITION Operating temperature range Storage temp. & humidity range -25℃ ∼ +85℃, 70% RH max. ― Reflow soldering 1. More then 50% of the terminal electrode shall be covered with new solder. P re h e a t temperature : 165~185℃ preheat time : 110±10sec max Solder temperature : 260℃ soldering time : 10 sec.max (Reflow soldering profile) Tensile strength (terminal strength) 1. No mechanical damage W 1.0 kgf Adhesion of terminal electrode (Flexure strength) 1. No mechanical damage a 1.0 mm b 0.8 mm c 1.3 mm W 2.0 kgf Thermal shock (Temperature cycle) 1. No mechanical damage 2. Leakage current : within 10㎂ Step 1. -40±3℃ 30±3min. Step 2. 85±3℃ 30±3min. Number of cycle : 100 times Heat load resistance 1. No mechanical damage 2. Leakage current : within 10㎂ Temperature : 85±2℃ Applied Voltage : working voltage Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage 2. Leakage current : within 10㎂ Temperature : 40±2℃ Humidity : 90∼95%RH Applied voltage :Working Voltage Time : 500 hours Measured at room ambient temperature after placing for 24 hours
/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI ESD/PESD Series Land Pattern & Reflow Soldering Land Pattern c ab Size a b c Reflow Soldering Profile 10s Natural cooling 260℃ max 220℃ min Preheating : 110 ±10sec 165 to 185℃ 30s max Time(s) Temp.(℃) Packing Speci fication Taping Figure
/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI ESD/PESD Series Packing Specification Carrier Tape and Dim ensions Unit : mm SYMBOL 1 P2 P0 D 0402 0.65+0.05 -0.10 1.15+0.05 0.60.05 3.50.05 tA B W F E P Reel Dimens ions -Reel Dimensions Unit : mm-T a p i n g - Standard Packing Quantity per Reel(178) Paper Tape : 10,000 pcs /reel CODE A B C D DIMENSION 1782M i n . 50 130.5 210.8 CODE E W t R