SLVA343A TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
SLVA343A –June 2009–RevisedMay 2010 Medium IntegratedPower SolutionUsing a Dual DC/DC Converterand an LDO ABSTRACT This referencedesign is intended for users designingwith the TMS320C6742, TMS320C6746, TMS320C6748, or OMAP-L138 processor.Using sequenced power supplies,thisreferencedesign describesa system havinga 3.3-Vinputvoltageand a high-efficiencydc/dcconverterwithintegrated FETs fora small,simpledesign. Sequenced power supplyarchitecturesare becoming commonplace inhigh-performancemicroprocessor and digitalsignalprocessor(DSP) systems.To save power and increaseprocessingspeeds,processor coreshave smallergeometrycellsand requirelowersupplyvoltagesthanthesystem bus voltages.Power management inthesesystems requiresspecialattention.Thisapplicationreportaddressesthesetopics and suggestssolutionsforoutputvoltagesequencing.
Contents
EasyScaleisa trademarkofTexas Instruments. 1SLVA343A –June 2009–RevisedMay 2010 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO Copyright© 2009–2010,Texas InstrumentsIncorporated
Introduction www.ti.com
1 Introduction
Indualvoltagearchitectures,coordinatedmanagement ofpower suppliesisnecessarytoavoidpotential problemsand ensurereliableperformance.Power supplydesignersmust considerthetimingand voltage differencesbetween coreand input/output(I/O)voltagesuppliesduringpower-upand power-down operations. Sequencingreferstotheorder,timing,and differentialinwhichthetwo voltagerailsarepowered up and down. A systemdesignedwithoutpropersequencingmay be atriskfortwo typesoffailures.The firstof theserepresentsa threattothelong-termreliabilityofthedualvoltagedevice,whereas thesecond is more immediate,withthepossibilityofdamaging interfacecircuitsintheprocessororsystemdevices such as memory, logicordataconverterintegratedcircuits(IC). Anotherpotentialproblemwithimpropersupplysequencingisbus contention.Bus contentionisa conditionwhen theprocessorand anotherdevicebothattempttocontrola bidirectionalbus duringpower up.Bus contentionmay alsoaffectI/Oreliability.Power supplydesignersmust checktherequirements regardingbus contentionforindividualdevices. The power-onsequencingfortheOMAP-L138, TMS320C6742, TMS320C6746, and TMS320C6748 are shown inTable1.No specificvoltageramp rateisrequiredforany ofthesuppliesas longas the3.3-Vrail neverexceedsthe1.8-Vrailby more than2 V.
2 Power Requirements
The power requirementsareas specifiedinTable1. Table1.Power Requirements VOLTAGE (1)(2) Imax SEQUENCING TIMINGPIN NAME TOLERANCE(V) (mA) ORDER DELAY I/O RTC_CVDD 1.2 1 –25%, +10% 1(3) I/O RVDD, PLL0_VDDA, 1.2 200 –5%, +10% 3 PLL1_VDDA, SATA_VDD, USB_CVDD, USB0_VDDA12 I/O USB0_VDDA18, USB1_VDDA18, 1.8 180 ±5% 4 DDR_DVDD18, SATA_VDDR, DVDD18 I/O USB0_VDDA33, USB1_VDDA33 3.3 24 ±5% 5 DVDD3318_C (1) If1.8-VLVCMOS isused,power railsup withthe1.8-Vrails.If3.3-VLVCMOS isused,power itup withtheANALOG33 rails (VDDA33_USB0/1). (2) No specificvoltageramp rateisrequiredforany ofthesuppliesLVCMOS33 (USB0_VDDA33, USB1_VDDA33) ifSTATIC18 (USB0_VDDA18, USB1_VDDA18, DDR_DVDD18, SATA_VDDR, DVDD18) neverexceedsmore than2 volts. (3) IfRTC isnotused/maintainedon a separatesupply,itcan be includedintheSTATIC12 (fixed1.2V) group. (4) IfusingCVDD atfixed1.2V,all1.2-Vrailsmay be combined. (5) IfDVDD3318_A, B,and C arepowered independently,maximum power foreach railis1/3theabove maximum power. 2 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO SLVA343A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated
www.ti.com Features
3 Features
The designuses thefollowinghigh-efficiencydc/dcconverterwithintegratedFETs. INPUT VOLTAGE ~3.3V INTEGRATION AND HIGH EFFICIENCY (WithoutDVFS) COMBINE RTC AND STATIC 1.2 Core 1.2V at600 mA TPS62420 (DCDC1) Static1.2V + VRTC at251 mA Static1.8V at230 mA TPS62420 (DCDC2) Static3.3V at115 mA TPS71733 (DRV) Intheprecedingtable,VRTC isincludedintheSTATIC12 (fixed1.2V) group. TPS62420
- Highefficiency– up to95%
- VIN rangeFrom 2.5V to6 V
- Outputcurrent600 mA and 1000 mA
- EasyScale™ optional1-pinserialinterfacefordynamicoutputvoltageadjustment
- Power-Save mode atlight-loadcurrents
- Availableina 10-pinQFN (3×3mm) TPS71733
- 150-mA low-dropout(LDO) regulatorwithenable
- Low noise:30 mV typical(100Hz to100 kHz)
- Excellentload/linetransientresponse
- SmallSC70-5,2 mm × 2 mm SON-6, and 1,5mm × 1,5mm SON-6 packages More informationon thedevicescan be foundinthedatasheets.
- TPS62420, SLVS676
- TPS71733, SBVS068 3SLVA343A –June 2009–RevisedMay 2010 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO Copyright© 2009–2010,Texas InstrumentsIncorporated
Features www.ti.com Figure1.PMP4978 ReferenceDesign Schematic 4 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO SLVA343A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated
www.ti.com Features Propersequencingisensuredinthedesignwiththeuse ofa NPN transistorand a N-channelMOSFET. As required,Core 1.2V at600 mA comes first,whichinturnpullsup thegateofa N-channelMOSFET to enablestheDCDC1 and sequentially1.8V comes up,whichagainenablesan LDO togive3.3V at115 mA. (1) Use threesuch LDOs topower up DVDDA, DVDDB, and DVDDC. (Itcan be either1.8V or3.3V.) (2) Rx = 0.499M Ω,Ry = 1 M Ω forVout= 1.8V (3) Rx = 1.8M Ω,Ry = 1 M Ω forVout= 3.3V (4) Forpropersequencingofoutput,enableoftheLDOs arefedeitherfroma 1.2-VoutputfromTPS62420 DCDC2 ifDVDDX is1.8V orfroma 1.8-VoutputfromTPS62420 DCDC1 ifDVDDX is3.3V. Figure2.OptionalCircuitforDVDD_A, DVDD_B and DVDD_C 5SLVA343A –June 2009–RevisedMay 2010 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO Copyright© 2009–2010,Texas InstrumentsIncorporated
BillofMaterials www.ti.com
4 BillofMaterials
Table2.PMP4978 BillofMaterials Count RefDes Value Description Size PartNumber MFR Area 1 C1 0.1mF Capacitor,Ceramic,50V,C0G, 5% 0603 Std Std 5650
1 C2 33pF Capacitor,Ceramic,50V,C0G, 5% 0603 Std Std 5650
6 C3 10 mF Capacitor,Ceramic,6.3V,X5R, 20% 0805 C2012X5R0J106M TDK 10560 C4 10 mF Capacitor,Ceramic,6.3V,X5R, 20% 0805 C2012X5R0J106M TDK 10560 C5 10 mF Capacitor,Ceramic,6.3V,X5R, 20% 0805 C2012X5R0J106M TDK 10560 C6 10 mF Capacitor,Ceramic,6.3V,X5R, 20% 0805 C2012X5R0J106M TDK 10560 C7 10 mF Capacitor,Ceramic,6.3V,X5R, 20% 0805 C2012X5R0J106M TDK 10560 C8 10 mF Capacitor,Ceramic,6.3V,X5R, 20% 0805 C2012X5R0J106M TDK 10560 1 C9 2.2mF Capacitor,Ceramic,16V,X5R, 10% 0603 C1608X5R1C225K TDK 5650 1 C10 1.0mF Capacitor,Ceramic,25V,X5R, 10% 0603 C1608X5R1E105K TDK 5650 1 C11 0.01mF Capacitor,Ceramic,50V,X7R, 10% 0603 C1608X7R1H103K TDK 5650 1 J1 PEC36SAAN Header,Male 5-pin,100milspacing,(36-pin 0.100inch× 5 PEC36SAAN Sullins 60000 strip) 2 L1 2.2mH Inductor,SMT, 1.2A,100m Ω 0.102× 0.110inch VLF3014AT-2R2M1R2 TDK 24,7 L2 2.2mH Inductor,SMT, 1.2A,100m Ω 0.102× 0.110inch VLF3014AT-2R2M1R2 TDK 24,7
2 Q1 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild37800
Q2 2N3904 Transistor,NPN, 40V,200mA, 625mW TO-92 2N3904 Fairchild37800 1 Q3 Si1012R/X MOSFET, N-ch,20V,600mA, 0.7ohms SC89-3 Si1012R/X Vishay 12125
2 R1 10k Resistor,Chip,1/16W,1% 0603 CRCW0603-xxxx-F Vishay 9100
R2 10k Resistor,Chip,1/16W,1% 0603 CRCW0603-xxxx-F Vishay 9100
1 R3 100k Resistor,Chip,1/16W,1% 0603 CRCW0603-xxxx-F Vishay 9100
1 R4 20k Resistor,Chip,1/16W,1% 0603 CRCW0603-xxxx-F Vishay 9100
3 R5 365K Resistor,Chip,1/16W,1% 0603 Std Std 5650
R6 365K Resistor,Chip,1/16W,1% 0603 Std Std 5650
1 R7 10K Resistor,Chip,1/16W,1% 0603 Std Std 5650
1 R8 12.5K Resistor,Chip,1/16W,1% 0603 Std Std 5650 R9 365K Resistor,Chip,1/16W,1% 0603 Std Std 5650
1 R10 182K Resistor,Chip,1/16W,1% 0603 Std Std 5650
1 U1 TPS62420DRC IC,2.25MHz DualStepDown Converter QFN10 TPS62420DRC TI 40500 1 U2 TPS71733DCK IC,150mA, Low Iq,Wide Bandwidth,LDO SC70 TPS71728DCK TI 18.6 LinearRegulators Notes:1. These assembliesareESD sensitive,ESD precautionsshallbe observed. 2. These assembliesmust be cleanand freefromfluxand allcontaminants.Failuretouse cleanfluxisunacceptable. 3. These assembliesmust complywithworkmanshipstandardsIPC-A-610Class2. 4. Referencedesignatorsmarked withan asterisk('**')cannotbe substituted.Allothercomponents can be substitutedwithequivalentMFG 's components. 6 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO SLVA343A –June 2009–RevisedMay 2010 Copyright© 2009–2010,Texas InstrumentsIncorporated
0.01 0.1 1 10 100 1000 Efficiency I -□mAOUT Power□Save□Mode MODE/DATA =□0 Forced□PWM□Mode MODE/DATA =□1 V =□1.8□VOUT2 V =□2.7□VIN V =□3.6□VIN V =□5□VIN V =□2.7□VIN V =□3.6□VIN V =□5□VIN 100 0.01 0.1 1 10 100 1000 Efficiency Power□Save□Mode MODE/DATA =□0 Forced□PWM□Mode MODE/DATA =□1 V =□2.7□VIN V =□3.6□VIN V =□2.7□VIN V =□3.6□VIN V =□5□VIN V =□5□VIN V =□1.1□VOUT1 I -□mAOUT www.ti.com BillofMaterials
4.1 TestResult
The start-upwaveform (Figure3)specifiesthesequencingorderthatisrequired. Figure3.Sequencing inStart-upWaveform Figure4.EfficiencyVOUT2 = 1.8V Figure5.EfficiencyVOUT1 = 1.1V 7SLVA343A –June 2009–RevisedMay 2010 Medium IntegratedPower SolutionUsinga DualDC/DC Converterand an LDO Copyright© 2009–2010,Texas InstrumentsIncorporated
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and www.ti.com/communications Telecom DSP dsp.ti.com Computers and www.ti.com/computers Peripherals Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defense Defense RF/IF and ZigBee® Solutionswww.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated