PE24B-0603 FS | Alldatasheet
Document overview
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Technical content
Features
ESD protection for high speed data lines to IEC61000-4-2 ESD contact discharge typical 8KV, Max 15KV IEC61000-4-2 ESD air discharge typical 15KV, Max 25KV Multilayer structure Surface mount Extremely low capacitance Very low leakage current Fast response time Bi-directional ESD protection Lead free solder termination The best ESD protection for high frequency, low voltage applications Application High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Display Port Interface Unified Display Interface (UDI) MDDI Ports Gigabit Ethernet USB2.0 and IEEE1394 interface Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a power line.
Electrical Characteristics
Parameter Symbol Conditions Min Typ Max Units Continuous operating voltage VDC V 42 --- --- --- Trigger voltage VT IEC61000-4-2 8KV contact discharge --- 500 --- V Clamping voltage VC IEC61000-4-2 8KV contact discharge --- 36 --- V Leakage current IL 24V VDC --- 0.20 10 nA Capacitance CP VR = 0V, f = 1MHz --- 0.05 --- pF 09 --- 04- --- --- erutarepmeT gnitarepO ℃ 051 --- 55- --- --- erutarepmeT egarotS ℃ ESD pulse withstand Pulses IEC61000-4-2 8KV contact discharge 2000 --- --- --- Notes: 1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV direct discharge method PE24B-0603 2009. 02. 17 1/4 TECHNICAL DATA Revision No : 1
Typical PESD clamping for +8KV pulse per IEC61000-4-2 Design Recommendations for USB2.0 For USB2.0 port Design Recommendations for Antenna For antenna line 2009. 02. 17 2/4Revision No : 1 PE24B-0603 PE24B-0603 PE24B-0603
PE 24 B – 0603 Series EI A Size Operating Voltage T rigger Voltage Level Environmental Specifications Operation temperature: -40~90 ℃ Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7,85% RH,85 ,1000hrs ℃ Thermal Shock: MIL-STD-202,Method 107G,-55 to1℃ 50 ,30 min cycle,10 cycles. ℃ Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40 , 3 solutions(H℃ 2O, detergent solution, deluxer ) Solder leach resistance and terminal adhesion: Per EIA-576 test Product Dimensions (mm) Length A Width B Height C Terminal width D Unit Min Max Min Max Min Max Min Max Recommended PAD Layout X Y G Unit Min Max Min Max Min Max 2009. 02. 17 3/4Revision No : 1 PE24B-0603
Solder Reflow Recommendation etaR ro emiT .pmeT hcaeR noitpircseD ssecorP metI A Soak Start From ambient to soak temperature and soak start 150℃ - 180℃ 2℃ - 4℃ / sec s021 - s06 --- emit kaoS emit kaoS B C Soak end Soak end 180℃ - 200℃ --- D Peak Temp. From soak temperature to Peak temperature 260℃ 2℃ - 3℃ / sec E Time above Main heating time 230℃ - 260℃ 40s - 60s F Cooling From main heating temperature to 100℃ 100℃ Max. 4℃ / sec Notes: 1* Peak temperature can be high to 260℃, and the recommendation time is as below at 230℃ 40s ~ 60s at 240℃ 30s ~ 40s at 260℃ 5s ~ 10s 2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder. 3* Devices can be cleaned using standard industry methods and solvents. 4* Component can withstand 270℃ 10 sec. 5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Package Information
Tape & Reel: 5000pcs per reel. 2009. 02. 17 4/4Revision No : 1 PE24B-0603