PDIUSBD

PDIUSBD11 PHILIPS | Alldatasheet

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/C0080 /C0115 /C0111/C0110/C0111 /C0115 Product specification Supersedes data of 1999 Nov 19 PDIUSBD11 USB device with serial interface Product specification 1999 Jul 22 INTEGRATED CIRCUITS

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

21999 Jul 22 853-2050 22023

FEATURES

• Complies with the Universal Serial Bus specification Rev. 1.1
• Complies with the ACPI, OnNOW, and USB power management requirements
• Compliant with USB Human Interface Devices and Monitor Control Class
• Compliant with System Management Bus Specification Rev. 1.0
• Integrated SIE (Serial Interface Engine), FIFO memory and transceivers
• Automatic USB protocol handling
• High speed I2C Interface (up to 1 Mbit/s)
• Compatible with the PDIUSBH11 software
• Software controllable connection to USB bus (SoftConnect )
• Low frequency 12 MHz crystal oscillator eases EMI design issues
• Programmable output clock frequency
• Bus powered capability with very low suspend current
• Controllable LazyClock output during suspend
• Single 3.3 V supply with 5 V tolerant I/O
• Available in 16-pin DIP and SO packages
• Full-scan design with high fault coverage (>99%) insures high quality
• Higher than 8 kV in-circuit ESD protection lowers cost of extra components

DESCRIPTION

The Universal Serial Bus hub PDIUSBD11 is a cost and feature-optimized USB interface device. It is used in microcontroller-based systems and communicates with the system microcontroller over the high speed I 2C serial bus. This modular approach to implementing USB functions allows the designer to choose the optimum system microcontroller from the available wide variety. This flexibility cuts down the development time, risks, and costs by allowing the use of the existing architecture and the firmware investments. This results in the fastest way to develop the most cost-effective USB peripheral solutions. The PDIUSBD11 is ideally suited for computer monitors, docking stations, keyboards, and many other applications that use the I 2C or the SMBus-based architecture. The PDIUSBD11 conforms to the USB specification Rev. 1.1, I2C serial interface and the SMBus specifications. It is fully compliant with the Human Interface Device Class and Monitor Control Class specifications. Its low suspend power consumption along with the programmable LazyClock output allows for easy implementation of equipment that is compliant to the ACPI, OnNOW, and USB power management requirements. The low operating power allows the implementation of bus-powered function. The PDIUSBD11 is fully backward compatible to the PDIUSBH11/PDIUSBH11A software. In addition, it also incorporates the feature enhancements like SoftConnect , LazyClock, programmable clock output, lower frequency crystal oscillator, multiple function endpoints and integration of termination resistors. All of these feature enhancements contribute to significant cost savings in the system implementation and at the same time ease the implementation of advanced USB functionality into the peripherals.

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. # 16-pin plastic SO –40°C to +85°C PDIUSBD11 D PDIUSBD11 D SOT162-1 16-pin plastic DIP –40°C to +85°C PDIUSBD11 N PDIUSBD11 N SOT38-4 BLOCK DIAGRAM ANALOG TX/RX PHILIPS SIE INTEGRATED RAM BIT CLOCK RECOVERY MEMORY MANAGEMENT UNIT I SLAVE INTERFACE

12 MHz

D+ D– UPSTREAM PORT FULL SPEED PLL SoftConnect 3.3V 1.5k/C0087 SV00823 NOTE: 1. This is a conceptual block diagram and does not include each individual signal.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 3

The transceiver interfaces directly to the USB cables through some termination resistors. They are capable of transmitting and receiving serial data at “full speed” (12 Mbit/s) only. PLL A 12 MHz to 48 MHz clock multiplier PLL (Phase-Locked Loop) is integrated on-chip. This allows for the use of low-cost 12 MHz crystal. EMI is also minimized due to lower frequency crystal. No external components are needed for the operation of the PLL. Bit Clock Recovery The bit clock recovery circuit recovers the clock from the incoming USB data stream using 4X over-sampling principle. It is able to track jitter and frequency drift specified by the USB specification. Philips Serial Interface Engine (PSIE) The Philips SIE implements the full USB protocol layer. It is completely hardwired for speed and needs no firmware intervention. The functions of this block include: synchronization pattern recognition, parallel/serial conversion, bit stuffing/de-stuffing, CRC checking/generation, PID verification/generation, address recognition, handshake evaluation/generation. Memory Management Unit (MMU) and Integrated RAM The MMU and the integrated RAM is used to handle the large difference in data rate between USB, running in bursts of 12 Mbit/s and the I2C interface to the microcontroller, running at up to 1 Mbit/s. This allows the microcontroller to read and write USB packets at its own speed through I 2C. I2C Slave Interface This block implements the necessary I2C interface protocol. A slave I2C allows for simple micro-coding. An interrupt is used to alert the microcontroller whenever the PDIUSBD11 needs attention. As a slave I 2C device, the PDIUSBD11 I2C clock: SCL is an input and is controlled by the microcontroller. The I2C interface can run up to 1 Mbit/s. SoftConnect The connection to the USB is accomplished by bringing D+ (for high-speed USB device) high through a 1.5 k/C0087 pull-up resistor. In the PDIUSBD11, the 1.5 k/C0087 pull-up resistor is integrated on-chip and is not connected to VCC by default. The connection of the internal resistor to Vcc is established through a command sent by the external/system microcontroller. This allows the system microcontroller to complete its initialization sequence before deciding to establish connection to the USB. Re-initialization of the USB bus connection can also be affected without requiring the pull out of the cable. The PDIUSBD11 will check for USB VBUS availability before the connection can be established. VBUS sensing is provided through VBUS pin. It should be noted that the tolerance of the internal resistors is higher (30%) than that specified by the USB specification (5%). However, the overall V SE voltage specification for the connection can still be met with good margin. The decision to make sure of this feature lies with the users. SoftConnect is a patent pending technology from Philips Semiconductors. ENDPOINT DESCRIPTIONS ENDPOINT# ENDPOINT INDEX TRANSFER TYPE DIRECTION MAX PACKET SIZE (BYTES) Control OUT 8 Control IN 8 Generic OUT 8 Generic IN 8 Generic OUT 8 Generic IN 8 Generic OUT 8 Generic IN 8 NOTE: 1. Generic endpoint can be used for Interrupt or Bulk endpoint.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 4

PIN NO PIN SYMBOL TYPE DRIVE DESCRIPTION

1 TEST Input Connect to GND for normal operation

2 RESET_N Input ST Power-on reset

3 XTAL1 Input Crystal connection 1 (12MHz)

4 XTAL2 Output Crystal connection 2 (12MHz)

5 CLKOUT Output 3 mA Programmable output clock for external devices

6 VCC Power Voltage supply 3.3V±0.3V

7 SUSPEND Output OD6 Device is in suspended state

8 INT_N Output OD6 Connect to microcontroller interrupt

9 SDA I/O OD6 I2C bi-directional data

10 SCL I/O OD6 I2C bit-clock

11 GND Power Ground reference

12 DP AI/O USB D+ connection

13 DM AI/O USB D– connection

14 AGND Power Analog ground reference

15 AV CC Power Analog voltage supply 3.3V±0.3V

16 VBUS Input USB VBUS sensing pin

NOTES: 1. Signals ending in _N indicate active LOW signals. ST: Schmitt Trigger OD6: Open Drain with 6 mA drive AI/O: Analog I/O APPLICATION DIAGRAM µC USB Upstream3.3V CLKOUT FUNCTIONAL BLOCK SV00824

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

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The I2C bus is used to interface to an external microcontroller needed to control the operation of the USB device. For cost consideration, the target system microcontroller can be shared and utilized for both the functional part as well as the USB protocol interfacing. The PDIUSBD11 implements a slave I 2C interface. When the PDIUSBD11 needs to communicate with the microcontroller it asserts an interrupt signal. The microcontroller services this interrupt by reading the appropriate status register on the PDIUSBD11 through the I 2C bus. (For more information about the I2C serial bus, refer to the I2C Handbook, Philips order number 9397 750 00013). The I2C interface on the PDIUSBD11 defines two types of transactions:

• command transaction – A command transaction is used to from/written to the USB interface in the next data transaction. A data transaction usually follows a command transaction.
• data transaction – A data transaction reads data from/writes data to the USB interface. The meaning of the data is dependent on the command transaction which was sent before the data transaction. Two addresses are used to differentiate between command and data transactions. Writing to the command address is interpreted as a command, while reading from/writing to the data address is used to transfer data between the PDIUSBH11A and the controller. ADDRESS TABLE Type of Address Physical Address MSB to LSB (Binary) Command 0011 011 Data 0011 010 Protocol An I2C transaction starts with a Start Condition, followed by an address. When the address matches either the command or data address the transaction starts and runs until a Stop Condition or another Start Condition (repeated start) occurs. The command address is write-only and is unable to do a read. The next bytes in the message are interpreted as commands. Several command bytes can be sent after one command address. Each of the command bytes is acknowledged and passed on to the Memory Management Unit inside the PDIUSBD11. When the Start Condition address matches the data address, the next bytes are interpreted as data. When the RW bit in the address indicates a master writes data to slave (=‘0’) the bytes are received, acknowledged and passed on to the Memory Management Unit. If the RW bit in the address indicates a master reads data from slave (=‘1’) the PDIUSBD11 will send data to the master. The I2C-master must acknowledge all data bytes except the last one. In this way the I2C interface knows when the last byte has been transmitted and it then releases the SDA line so that the master controller can generate the Stop Condition. Repeated start support allows another packet to be sent without generating a Stop Condition. Timing The I2C interface in the PDIUSBD11 can support clock speeds up to 1 MHz.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 6

Some commands have the same command code (e.g., Read Buffer and Write Buffer). In these cases, the direction of the Data Phase (read or write) indicates which command is executed. COMMAND NAME RECIPIENT CODING DATA PHASE Initialization Commands Set Address/Enable Function D1h Write 1 byte Set Endpoint Enable Function D8h Write 1 byte Set Mode Function F3h Write 2 byte Data Flow Commands Read Interrupt Register F4h Read 2 bytes Select Endpoint Control OUT Endpoint 00h Read 1 byte (optional) Control IN Endpoint 01h Read 1 byte (optional) Other Endpoints 00h+Endpoint Index Read 1 byte (optional) Read Last Transaction Status Control OUT Endpoint 40h Read 1 byte Control IN Endpoint 41h Read 1 byte Other Endpoints 40h+Endpoint Index Read 1 byte Read Endpoint Status Control OUT Endpoint 80h Read 1 byte Control IN Endpoint 81h Read 1 byte Other Endpoints 80h+Endpoint Index Read 1 byte Read Buffer Selected Endpoint F0h Read n bytes Write Buffer Selected Endpoint F0h Write n bytes Set Endpoint Status Control OUT Endpoint 40h Write 1 byte Set Endpoint Status Control IN Endpoint 41h Write 1 byte Other Endpoints 40h+Endpoint Index Write 1 byte Acknowledge Setup Selected Endpoint F1h None Clear Buffer Selected Endpoint F2h None Validate Buffer Selected Endpoint FAh None General Commands Send Resume F6h None Read Current Frame Number F5h Read 1 or 2 bytes

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

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There are three basic types of commands: Initialization, Data Flow, and General commands. Respectively, these are used to initialize the function; for data flow between the function and the host; and some general commands. Initialization Commands Initialization commands are used during the enumeration process of the USB network. These commands are used to enable the function endpoints. They are also used to set the USB assigned address. Set Address / Enable Command : D1h, (Function) Data : Write 1 byte This command is used to set the USB assigned address and enable the function. 76 5432 POWER ON VALUE ADDRESS ENABLE SV00825 000000 Address The value written becomes the address. Enable A ‘1’ enables this function. Set Endpoint Enable Command : D8h Data : Write 1 byte The generic endpoints can only be enabled when the function is enabled via the Set Address/Enable command. 76 5432 X POWER ON VALUE RESERVED; WRITE 0 FUNCTION GENERIC ENDPOINTS XXXXXX RESERVED; WRITE 0 SV00826 Function Generic Endpoint A value of ‘1’ indicates the function generic endpoints are enabled. Set Mode Command : F3h Data : Write 2 bytes The Set Mode command is followed by two data writes. The first byte contains the configuration byte values. The second byte is the clock division factor byte. Configuration Byte POWER ON VALUE REMOTE WAKEUP NO LAZYCLOCK SV00827 CLOCK RUNNING DEBUG MODE SoftConnect RESERVED; WRITE 0 FUTURE MODE 76 5432 11X01X Remote Wakeup A ‘1’ indicates that a remote wakeup feature is ON. Bus reset will set this bit to ‘1’. No LazyClock A ‘1’ indicates that CLKOUT will not switch to LazyClock. A ‘0’ indicates that the CLKOUT switches to LazyClock 1ms after the Suspend pin goes high. LazyClock frequency is 30KHz ±40%. The programmed value will not be changed by a bus reset. Clock Running A ‘1’ indicates that the internal clocks and PLL are always running even during Suspend state. A ‘0’ indicates that the internal clock, crystal oscillator and PLL are stopped whenever not needed. To meet the strict Suspend current requirement, this bit needs to be set to ‘0’. The programmed value will not be changed by a bus reset. Debug Mode A ‘1’ indicates that all errors and “NAKing” are reported and a ‘0’ indicates that only OK and babbling are reported. The programmed value will not be changed by a bus reset. SoftConnect A ‘1’ indicates that the upstream pull-up resistor will be connected if VBUS is available. A ‘0’ means that the upstream resistor will not be connected. The programmed value will not be changed by a bus reset. FutureMode Write a ‘1’.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 8

Clock Division Factor Byte SV00828 76 5432 POWER ON VALUE CLOCK DIVISION FACTOR RESERVED 10XXXX Clock Division Factor The value indicates clock division factor for CLKOUT. The output frequency is

48 MHz/(N+1) where N is the Clock Division

Factor. The reset value is 11. This will produce the output frequency of 4 MHz which can then be programmed up (or down) by the user. The minimum value is one giving the range of frequency from 4 to 24 MHz. The PDIUSBD11 design ensures no glitching during frequency change. The programmed value will not be changed by a bus reset. Data Flow Commands Data flow commands are used to manage the data transmission between the USB endpoints and the monitor. Much of the data flow is initiated via an interrupt to the microcontroller. The microcontroller utilizes these commands to access and determine whether the endpoint FIFOs have valid data. Read Interrupt Register Command : F4h Data : Read 2 bytes Interrupt Register Byte 1 POWER ON VALUE RESERVED CONTROL OUT ENDPOINT CONTROL IN ENDPOINT ENDPOINT INDEX 4 ENDPOINT INDEX 5 ENDPOINT INDEX 6 ENDPOINT INDEX 7 76 5432 X X 000000 SV00829 This command indicates the origin of an interrupt. A ‘1’ indicates an interrupt occurred at this endpoint. The bits are cleared by reading the endpoint status register through the Read Endpoint Status command. After a bus reset, an interrupt will be generated and bit 6 of the Interrupt Register Byte 2 will be ‘1’. The interrupt is internally cleared by reading the interrupt register. A bus reset is completely identical to the hardware reset through the RESET_N pin with the sole difference of interrupt notification. Interrupt Register Byte 2 POWER ON VALUE ENDPOINT INDEX 8 ENDPOINT INDEX 9 RESERVED BUS RESET RESERVED 765432 XXXXX0 SV00830 Select Endpoint Command : 00-0Dh Data : Optional Read 1 byte The Select Endpoint command initializes an internal pointer to the start of the Selected buffer. Optionally, this command can be followed by a data read, which returns ‘0’ if the buffer is empty and ‘1’ if the buffer is full. 76 5432 X POWER ON VALUE FULL/EMPTY RESERVED XXXXXX SV00831 Full/Empty A ‘1’ indicates the buffer is full, ‘0’ indicates an empty buffer.

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read that returns the status of the last transaction of the endpoint. interrupt register, and clears the status, indicating that it was read. or transmitted successfully. Error Code See Table 1, Error Codes. (this will always read ‘0’ for IN buffers). before the previous status was read. Table 1. ERROR CODES

0000 No Error

0001 PID encoding Error; bits 7–4 are not the inversion of

0010 PID unknown; encoding is valid, but PID does not exist

0100 Token CRC Error

0101 Data CRC Error

0110 Time Out Error

0111 Babble Error

1000 Unexpected End-of-packet

1001 Sent or received NAK

1010 Sent Stall, a token was received, but the endpoint was

1011 Overflow Error, the received packet was longer than

1101 Bitstuff Error

1111 Wrong DATA PID; the received DATA PID was not the

STALL A ‘1’ indicates the endpoint is stalled. Buffer Full A ‘1’ indicates that the buffer is full. each read, the internal buffer pointer is incremented by 1.

• byte 0: Reserved: can have any value
• byte 1: Number/length of data bytes
• byte 2: Data byte 1
• byte 3: Data byte 2 Write Buffer Command : F0h Data : Write multiple bytes (max 10) The Write Buffer command is followed by a number of data writes, which load the endpoints buffer. The data must be organized in the same way as described in the Read Buffer command. The first byte (reserved) should always be ‘0’. As in the Read Buffer command, the data can be split up into different I 2C data transactions. WARNING: There is no protection against writing or reading over a buffer’s boundary or against writing into an OUT buffer or reading from an IN buffer. Any of these actions could cause an incorrect operation. Data in an OUT buffer are only meaningful after a successful transaction.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 10

Command : F2h Data : None When a packet is received completely, an internal endpoint buffer full flag is set. All subsequent packets will be refused by returning a NAK. When the microcontroller has read the data, it should free the buffer by the Clear Buffer command. When the buffer is cleared, new packets will be accepted. Validate Buffer Command : FAh Data : None When the microprocessor has written data into an IN buffer, it should set the buffer full flag by the Validate Buffer command. This indicates that the data in the buffer are valid and can be sent to the host when the next IN token is received. Set Endpoint Status Command : 40–4Dh Data : Write 1 byte A stalled control endpoint is automatically unstalled when it receives a SETUP token, regardless of the content of the packet. If the endpoint should stay in its stalled state, the microcontroller can re-stall it. When a stalled endpoint is unstalled (either by the Set Endpoint Status command or by receiving a SETUP token), it is also re-initialized. This flushes the buffer and if it is an OUT buffer it waits for a DATA 0 PID, if it is an IN buffer it writes a DATA 0 PID. Even when unstalled, writing Set Endpoint Status to ‘0’ initializes the endpoint. 76 5432 X POWER ON VALUE STALLED RESERVED XXXXXX SV00834 Stalled A ‘1’ indicates the endpoint is stalled. Acknowledge Setup Command : F1h Data : None The arrival of a SETUP packet flushes the IN buffer and disables the Validate Buffer and Clear Buffer commands for both IN and OUT endpoints. The microcontroller needs to re-enable these commands by the Acknowledge Setup command. This ensures that the last SETUP packet stays in the buffer and no packet can be sent back to the host until the microcontroller has acknowledged explicitly that it has seen the SETUP packet. The microcontroller must send the Acknowledge Setup command to both the IN and OUT endpoints. GENERAL COMMANDS Send Resume Command : F6h Data : None Sends an upstream resume signal for 10 ms. This command is normally issued when the device is in suspend. The RESUME command is not followed by a data read or write. Read Current Frame Number Command : F5h Data : Read One or Two Bytes This command is followed by one or two data reads and returns the frame number of the last successfully received SOF. The frame number is returned Least Significant Byte first. 765432 X X LEAST SIGNIFICANT BYTEXXXXXX 765432 X X MOST SIGNIFICANT BYTEXXXXXX SV00835

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

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RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER TEST CONDITIONS MIN MAX UNIT VCC DC supply voltage 3.0 3.6 V VI DC input voltage range 0 5.5 V VI/O DC input voltage range for I/O 0 5.5 V VAI/O DC input voltage range for analog I/O 0 VCC V VO DC output voltage range 0 VCC V Tamb Operating ambient temperature range in free airSee DC and AC characteristics per device–40 85 °C ABSOLUTE MAXIMUM RATINGS 1 SYMBOL PARAMETER TEST CONDITIONS MIN MAX UNIT VCC DC supply voltage –0.5 +4.6 V IIK DC input diode current VI < 0 –50 mA VI DC input voltage Note 2 –0.5 +5.5 V VI/O DC input voltage range for I/O –0.5 VCC + 0.5 V IOK DC output diode current VO > VCC or VO < 0 ±50 mA VO DC output voltage Note 2 –0.5 VCC + 0.5 V IO DC output sink or source current for other pinsVO = 0 to VCC ±15 mA IO DC output sink or source current for D+/D– pinsVO = 0 to VCC ±50 mA IGND , ICC DC V CC or GND current ±100 mA TSTG Storage temperature range –60 +150 °C PTOT Power dissipation per package NOTES: 1. Stresses beyond those listed may cause damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those listed in the RECOMMENDED OPERATING CONDITIONS table is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. DC CHARACTERISTICS (Digital pins) SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input Levels VIL LOW level input voltage 0.6 V VIH HIGH level input voltage 2.7 V VTLH LOW to HIGH threshold voltage ST (Schmitt Trigger) pins 1.4 1.9 V VTHL HIGH to LOW threshold voltage ST pins 0.9 1.5 V VHYS Hysteresis voltage ST pins 0.4 0.7 V Output Levels VO LOW level output voltage IOL = rated drive 0.4 V VOL LOW level output voltage IOL = 20 µA 0.1 V VO HIGH level output voltage IOH = rated drive 2.4 V VOH HIGH level output voltage IOH = 20 µA VCC – 0.1 V Leakage Current IOZ OFF state current OD (Open Drain) pins ±5 µA IL Input leakage current ±5 µA IS Suspend current Oscillator stopped & inputs to GND/VCC 15 µA IO Operating current I2C operating 10 mA

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 12

DC CHARACTERISTICS (AI/O pins) SYMBOL PARAMETER TEST CONDITIONS MIN MAX UNIT Leakage Current ILO Hi-Z state data line leakage 0V < VIN < 3.3V ±10 µA Input Levels VDI Differential input sensitivity |(D+) – (D–)|1 0.2 V VCM Differential common mode range Includes VDI range 0.8 2.5 V VSE Single-ended receiver threshold 0.8 2.0 V Output Levels VOL Static output LOW R L of 1.5k/C0087 to 3.6V 0.3 V VOH Static output HIGH R L of 15k/C0087 to GND 2.8 3.6 V Capacitance C IN Transceiver capacitance Pin to GND 20 pF Output Resistance ZDRV /C0050Driver output resistance Steady state drive 29 44 /C0087 Integrated Resistance ZPU Pull-up resistance SoftConnect = ON 1.1 1.9 k/C0087 ZPD Pull-down resistance Pull-down = ON 11 19 k/C0087 NOTES: 1. D+ is the symbol for the USB positive data pin: DP. D– is the symbol for the USB negative data pin: DM. 2. Includes external resistors of 22 /C0087 ± 1% each on D+ and D–. LOAD FOR D+/D– SV00836 D. U. T. TEST POINT C L VCC UPSTREAM: 1.5k /C0087 IS INTERNAL C L = 50pF, FULL SPEED C L = 50PF, LOW SPEED (MIN TIMING) C L = 350PF, LOW SPEED (MAX TIMING) * 1.5k/C0087 ON D– (LOW SPEED) OR D+ (FULL SPEED) ONLY TEST S1 D–/LS CLOSE D+/LS OPEN D–/FS OPEN D+/FS CLOSE 1.5k/C0087/C0042 15k/C0087 22/C0087

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tJR1 To next transition Characterized and not tested. Figure 1. Differential data to EOP transition skew and EOP width

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be ordered using the Philips order number 9398 393 40011. Figure 2. I2C-bus timing diagram

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 15

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

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DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

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This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations, reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260°C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. M ANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300°C, it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400°C, contact may be made for up to 5 seconds. Surface mount packages R EFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor-type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds, depending on heating method. Typical reflow peak temperatures range from 215 250°C. The top-surface temperature of the packages should preferably be kept below 230°C. W AVE SOLDERING Conventional single-wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems, the double-wave soldering method was specifically developed. If wave soldering is used, the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement, and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive has cured. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. M ANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low-voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 18

SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS Mo nting Package Soldering Method Mo unting Package Wave Reflow 1 Dipping Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable 2 – suitable BGA, SQFP, not suitable suitable – HLQFP, HSQFP, HSOP, SMS not suitable 3 suitable – Surface mount PLCC, SO, SOJ suitable suitable – LQFP, QFP, TQFP not recommended 4, 5 suitable – SSOP, TSSOP, VSO not recommended 6 suitable – NOTES: 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so-called “popcorn” effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) cannot be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

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Philips Semiconductors Product specification PDIUSBD11USB device with serial interface

1999 Jul 22 20

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors

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P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Date of release: 07-99 Document order number: 9397–750–06219 /C0080 /C0115 /C0111/C0110/C0111 /C0115 Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Production Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Data sheet status [1] Please consult the most recently issued datasheet before initiating or completing a design.