PD85025-E STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 15

Technical content

Datasheet sections

  • 1 Electrical data
  • 1.1 Maximum ratings
  • 1.2 Thermal data
  • 2 Electrical characteristics
  • 2.1 Static
  • 2.2 Dynamic
  • 2.3 ESD protection characteristics
  • 2.4 Moisture sensitivity level
  • 3 Impedance
  • 4 Typical performance
  • 5 Package mechanical data
  • 6 Revision history

Features

■ Excellent thermal stability ■ Common source configuration ■ POUT = 25 W with 15.7 dB gain @ 870 MHz / 13.6 V ■ Plastic package ■ ESD protection ■ In compliance with the 2002/95/EC European directive

Description

The PD85025-E is a common source N-channel, enhancement-mode lateral field-effect RF power transistor. It is designed for high gain, broadband commercial and industrial applications. It operates at 13.6 V in common source mode at frequencies of up to 1 GHz. PD85025-E boasts the excellent gain, linearity and reliability of ST’s latest LDMOS technology mounted in the first true SMD plastic RF power package, PowerSO-10RF . PD85025-E’s superior linearity performance makes it an ideal solution for car mobile radio. The PowerSO-10 plastic package, designed to offer high reliability, is the first ST JEDEC approved, high power SMD package. It has been specially optimized for RF needs and offers excellent RF performances and ease of assembly. Mounting recommendations are available in www.st.com/rf/ (look for application note AN1294) Figure 1. Pin connection Table 1. Device summary

1 Electrical data

1.1 Maximum ratings

1.2 Thermal data

Table 2. Absolute maximum ratings (TCASE = 25 °C) Table 3. Thermal data

2 Electrical characteristics

2.1 Static

2.2 Dynamic

2.3 ESD protection characteristics

2.4 Moisture sensitivity level

Table 4. Static Table 5. Dynamic Table 6. ESD protection characteristics Table 7. Moisture sensitivity level

3 Impedance

Figure 2. Current conventions Table 8. Impedance data

4 Typical performance

Figure 3. Capacitances vs drain voltage Figure 4. DC output characteristics Figure 5. DC output characteristics

5 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Figure 12. Package dimensions Table 9. PowerSO-10RF formed lead (gull wing) mechanical data

Figure 13. Package dimensions Table 10. PowerSO-10RF straight lead mechanical data

Figure 14. Tube information

Figure 15. Reel information

6 Revision history

Table 11. Document revision history 21-May-2007 1 Initial release.