PD85006L-E STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Electrical data
  • 1.1 Maximum ratings
  • 1.2 Thermal data
  • 2 Electrical characteristics
  • 2.1 Static
  • 2.2 Dynamic
  • 2.3 ESD protection characteristics
  • 2.4 Moisture sensitivity level
  • 3 Impedances
  • 4 DC curves
  • 5 RF curves
  • 6 Schematic and BOM
  • 7 Demoboard photo
  • 8 Package mechanical data
  • 9 Revision history

Features

■ Excellent thermal stability ■ Common source configuration ■ POUT = 6 W with 15 dB gain @ 870 MHz / 13.6 V ■ Plastic package ■ ESD protection ■ In compliance with the 2002/95/EC european directive

Description

The PD85006L-E is a common source N-channel, enhancement-mode lateral Field- Effect RF power transistor. It is designed for high gain, broadband commercial and industrial applications. It operates at 13.6 V in common source mode at frequencies of up to 1 GHz. PD85006L-E boasts the excellent gain, linearity and reliability of ST’s latest LDMOS technology mounted in leadless SMD plastic RF power package , PowerFLAT™. PD85006L-E’s superior linearity performance makes it an ideal solution for mobile radio applications. Figure 1. Pin connection Table 1. Device summary

1 Electrical data

1.1 Maximum ratings

1.2 Thermal data

Table 2. Absolute maximum ratings (TCASE = 25°C) Table 3. Thermal data

2 Electrical characteristics

2.1 Static

2.2 Dynamic

2.3 ESD protection characteristics

2.4 Moisture sensitivity level

Table 4. Static Table 5. Dynamic Table 6. ESD protection characteristics Table 7. Moisture sensitivity level

3 Impedances

Figure 2. Impedances Table 8. Broadband impedances

4 DC curves

Figure 3. DC output characteristics Figure 4. ID vs V GS Figure 5. Capacitances vs drain

5 RF curves

Figure 6. Output power and efficiency vs

13.6 V / 200 mA / Pin = 21 dBm

Figure 7. Gain vs frequency

13.6 V / 200 mA

Figure 8. Input return loss vs Figure 9. Gain vs pout Figure 10. Id vs Pin Figure 11. Pout vs pin

860 MHz 900 MHz 960 MHz

Figure 12. Harmonics vs frequency

6 Schematic and bill of material

Figure 13. Schematic and bill of material

Table 9. Components part list

7 Demoboard photo

Figure 14. Demoboard photo

8 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Figure 15. PowerFLAT™ (5x5) package dimensions Table 10. PowerFLAT™ (5x5) mechanical data

Figure 16. Tape and reel dimensions Table 11. Tape and reel dimensions

Figure 17. PowerFLAT™ (5x5) recommended footprint

9 Revision history

Table 12. Document revision history 06-Dec-2007 1 Initial release.