PD84006L-E STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 16

Technical content

Datasheet sections

  • 1 Electrical data
  • 1.1 Maximum ratings
  • 1.2 Thermal data
  • 2 Electrical characteristics
  • 2.1 Static
  • 2.2 Dynamic
  • 2.3 ESD protection characteristics
  • 2.4 Moisture sensitivity level
  • 3 Impedance
  • 4 Typical performance
  • 5 Test circuit
  • 6 Circuit layout and photo
  • 7 Package mechanical data
  • 8 Revision history

Features

■ Excellent thermal stability ■ Common source configuration ■ Broadband performances: POUT = 6 W with 13 dB gain @ 870 MHz ■ Plastic package ■ ESD protection ■ Supplied in tape and reel ■ In compliance with the 2002/95/EC european directive

Description

The PD84006L-E is a common source N-channel, enhancement-mode lateral Field-Effect RF power transistor. It is designed for high gain, broad band commercial and industrial applications. It operates at 7 V in common source mode at frequencies up to 1 GHz. PD84006L-E’s superior gain and efficiency makes it an ideal solution for portable radio and UHF RFID reader. Figure 1. Pin connection Table 1. Device summary

1 Electrical data

1.1 Maximum ratings

1.2 Thermal data

Table 2. Absolute maximum ratings (TCASE = 25°C) Table 3. Thermal data

2 Electrical characteristics

2.1 Static

2.2 Dynamic

2.3 ESD protection characteristics

2.4 Moisture sensitivity level

Table 4. Static Table 5. Dynamic Table 6. ESD protection characteristics Table 7. Moisture sensitivity level

3 Impedance

Figure 2. Current conventions Table 8. Impedance data

4 Typical performance

Figure 3. Output power and efficiency vs Figure 4. Gain vs output power Figure 5. Input return loss vs frequency Figure 6. Harmonics vs frequency Vdd=7.2 V,

740 MHz

850 MHz

950 MHz

Figure 7. Output power vs frequency and

5 Test circuit

Figure 8. Test circuit schematic Table 9. Part list

Table 9. Part list (continued)

6 Circuit layout and photo

Figure 9. Circuit layout Figure 10. Demoboard photo

7 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Figure 11. Tape and reel dimensions Table 10. Tape and reel dimensions

Figure 12. PowerFLAT™ (5x5) recommended footprint

Figure 13. PowerFLAT™ (5x5) package dimensions Table 11. PowerFLAT™ (5x5) mechanical data

8 Revision history

Table 12. Document revision history