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Technical content

Features

  • Designed to Support IEEE 802.3af and IEEE 802.3at standards
  • PD Detection & Programmable Classification Signature
  • Two-events Classification Flag
  • Signature Resistor Disconnection after Detection
  • Integrated 0.6 Ω Isolating Switch and Inrush Current Limiter.
  • 4-pairs support with a single PD70200 IC for up to 48 W
  • 4-pairs support with two PD70200 ICs for up to 96 W
  • Less than 10 μA Offset Current during Detection
  • Single DC Voltage Input (37 V – 57 V)
  • Wide Operating Temperature Range: −40 to 85 °C
  • On-chip Thermal Protection
  • 12-pin 3 × 4mm Package
  • RoHS Compliant
  • MSL3 © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 1

Table 1. Microchip Powered Device Products Offerings

Applications

  • Power over Ethernet Powered Devices
  • IEEE 802.3af/at 10/100/1000 BASE-T
  • 4-pair extra power applications
  • Indoor and outdoor applications PD70100/PD70200 © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 2

The following illustration shows a basic block diagram using PD70100 or PD70200. Figure 1. Basic PD Block Diagram please try our MPLAB Analog Designer (MAD) tool at www.microchip.com/mad-poe.

© 2020 Microchip Technology Inc. Datasheet DS00003639A-page 4

1.1 Detail Description

PD70100/PD70200 IC provides IEEE 802.3af/at compliant PD Front-End functions including Detection, Physical Layer Classification, Two-Events Classification (PD70200 only), Auxiliary Voltage Output, Power Good, Soft Start Current Limiting, Over-Current Protection, and Bulk Capacitor Discharge.

1.1.1 Detection

IEEE 802.3af/at compliant detection is provided by a 24.9 KΩ resistor connected between VPP and RDET pin. RDET pin is connected to VPNIN via an open drain MOSFET with a maximum specified RDSON of 50 Ω. Internal logic monitors VPP to VPNIN and connects the RDET pin to VPNIN when the rising VPP to VPNIN voltage is between 2.5 V falling VPP to VPNIN voltage between 2.45 V and 4.85 V will reconnect RDET pin to VPNIN.

1.1.2 Physical Layer Classification

Physical Layer (hardware) Classification per IEEE 802.3af/at is generated via a regulated reference voltage of 1.2 V, switched onto the RCLASS pin. Internal logic monitors the VPP to VPNIN voltage and connects the 1.2 V reference to RCLASS pin at a rising VPP to VPNIN voltage threshold between 11.1 V and 13.5 V. Once VPP to VPNIN has exceeded the rising threshold, there is a 1 V minimum hysteresis between the VPP rising (turn-on) threshold and the VPP falling (turn-off) threshold. The 1.2 V reference stays connected to the RCLASS pin until the VPP to VPNIN rising voltage exceeds the upper turn- off threshold of 20.9 V to 23.9 V. The 1.2 V reference voltage is disconnected from the RCLASS pin at VPP to VPNIN voltages above the upper threshold. Classification current signature is provided via a resistor connected between RCLASS pin and VPNIN. The classification current is therefore the current drawn by the PD70100/PD70200 IC during the classification phase, and is simply the 1.2 V reference voltage divided by the RCLASS resistor value. The maximum current available at the RCLASS pin is current limited to 55 mA (typical).

1.1.3 Two-Events Detection and AT Flag

The PD70200 IC provides IEEE 802.3at Type 2 compliant detection of the “Two Events Classification Signature”, and generation of the AT flag. This feature is available on the PD70200 IC only. Simply put, the “Two Events Classification Signature” is a means by which an IEEE 802.3at Type 2 Power Source can inform a compliant Power Device (PD) that it is AT Type 2 compliant, and as such is capable of providing AT Type 2 power levels. The Power Source communicates with a Type 2 compliant signature by toggling the VPP to VPNIN voltage twice (2 “events”) during the Physical Layer Classification phase. The VPP to VPNIN voltage is toggled from the Physical Layer Classification’s voltage level (13.5 V to 20.9 V) down to a voltage “Mark” level. Voltage “Mark” level is specified as a VPP to VPNIN voltage of 4.9 V to 10.1 V. PD70200 IC recognizes a VPP to VPNIN falling edge from Classification level to Mark level as being one event of the Two-Events Signature. If two such falling edges are detected, PD70200 will assert AT flag by means of an open drain MOSFET connected between AT_FLAG pin and VPNOUT. AT_FLAG pin is active low; a low impedance state between AT_FLAG and VPNOUT indicates a valid Two-Events Classification Signature was received, and the Power Source is AT Type 2 compliant. AT_FLAG MOSFET is capable of 5 mA of current and can be pulled up to VPP.

1.1.4 Soft Start and Inrush Current Protection

PD70100/PD70200 IC contains an internal isolation switch, that provides ground isolation between Power Source and PD application during Detection and Classification phases. The isolation switch is a N-channel MOSFET, wired in a common source configuration where the MOSFET’s Source is connected to Power Source ground at VPNIN, and the MOSFET’s Drain is connected to application’s primary ground at VPNOUT. Internal logic monitors VPP to VPNIN voltage and keeps the MOSFET in a high impedance state until VPP to VPNIN voltage reaches turn-on threshold of 36 V to 42 V. Once VPP to VPNIN voltage exceeds this threshold, the MOSFET is switched into one of two modes. PD70100/PD70200 Functional Descriptions © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 6

The mode into which the MOSFET is switched is determined by the voltage developed across the MOSFET, or put another way, the VPNOUT to VPNIN differential voltage. Two modes are defined below: Table 1-1. Isolation Switch Modes VPNOUT to VPNIN Mode Description >0.7 V Soft Start Mode Limits VPNOUT current to 240 mA (typical) ≤0.7 V Normal Operating Mode Limits VPNOUT current to 1.8 A (typical) By controlling the MOSFET current based on VPNOUT to VPNIN voltage, inrush currents generated by fully discharged bulk capacitors can be limited. This method limits current to a maximum of 350 mA, compliant with IEEE 802.3af/at specification. Soft Start current limiting is required to reduce occurrences of voltage sag at the PD input during device power-up. A comparison is shown in the following figure. Figure 1-3. Startup Comparison Once bulk capacitance has charged up to a point where VPNOUT to VPNIN differential voltage is less than 0.7 V, the isolation MOSFET is switched into normal operating mode with MOSFET current limit set at 1.8 A (typical), to provide over-current protection. PD70100 and PD70200 ICs are different in their respective isolation MOSFET’s continuous current handling capability:

  • PD70100: 450 mA (max.)
  • PD70200: 1123 mA (max.) An adequate heat sink for the PD70100/PD70200 IC’s exposed pad must be provided to achieve these current levels without damaging the IC. A large, heavy copper fill area and/or a heavy ground plane with Thermal Vias is recommended. Electrically the exposed pad ground plane should be connected to VPNIN. Internal logic monitoring VPP to VPNIN will place the isolation switch MOSFET in a high impedance state if voltage between VPP and VPNIN drops below 31 V to 34 V.

1.1.5 Over-Current Protection

Over-current protection is provided on the PD70100/PD70200 IC using the Isolation MOSFET Switch, which limits the VPNOUT current to 1.8 A during normal operation. See previous description of Soft Start. PD70100/PD70200 Functional Descriptions © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 7

1.1.6 Power Good

During Soft Start mode, the PD70100/PD70200 IC monitors VPNOUT to VPNIN differential voltage. When this voltage is less than 0.7 V (max.), the IC enters normal operation mode and the isolation switch current limit is increased to 1.8 A (typical). At this same 0.7 V (max.) threshold the Power Good signal is asserted by means of an open drain MOSFET between PGOOD and VPNOUT. PGOOD pin is active low; a low impedance state between PGOOD and VPNOUT indicates the Soft Start mode has finished and the isolation switch has transitioned into normal operating mode. PGOOD MOSFET can handle current of 5 mA and can be pulled up to VPP.

1.1.7 Auxiliary Voltage Output

PD70100/PD70200 IC provides a 10.5 V (typical) regulated output to be used as a start-up supply for DC/DC controllers whose VCC is provided via a bootstrap winding. This regulated supply is available at VAUX pin, and is referenced to VPNOUT pin. VAUX supply is designed for low-duty operation, and should not be designed as a primary housekeeping supply. The current capability is continuous 2 mA, with 10 mA peak (≤10 ms). VAUX output is current- limited at 10 mA (min.). For stability, the VAUX regulator requires a minimum of 4.7 μF ceramic capacitor connected directly between VAUX and VPNOUT pins.

1.1.8 Thermal Protection

Both PD70100 and PD70200 IC include temperature sensors which individually monitor both the isolation MOSFET and the Classification Current Source for over temperature conditions. In case of an over temperature condition, the sensor will activate protection circuitry which will disconnect its respective monitored function.

1.1.9 Bulk Capacitor Discharge

The bulk capacitor discharge circuitry eliminates the need to place a diode in series with the VPP line to prevent an application’s bulk capacitance from discharging through the detection resistor and the isolation switch MOSFET’s body diode. Discharge current through the detection resistor can cause failure of the detection signature in cases where a PD is connected and the bulk capacitance is not fully discharged. During normal operation, PD70100/PD70200 IC continuously monitors voltage at VPP to VPNIN. Should VPP to VPNIN voltage fall below isolation switch turn-off threshold (31 V to 34 V), isolation switch MOSFET is immediately placed in a high-impedance state. At this point the internal logic monitors the voltage at VPP to VPNOUT. If VPP to VPNOUT voltage is between 1.5 V to 32 V, a 23 mA (min.) constant current source is connected across the VPP and VPNOUT pins. This constant current source provides bulk capacitor discharge. A 220 μF bulk capacitance can be discharged from 32 V to 1.5 V in a maximal period of 292 ms. PD70100/PD70200 Functional Descriptions © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 8

  1. Electrical Specifications

2.1 Absolute Maximum Ratings

Table 2-1. Absolute Maximum Ratings Parameter Description Supply Input Voltage (VPP) Continuous −0.3 V to 74 VDC Supply Input Voltage (VPP) 1 ms pulse −0.3 V to 88 VDC Port Negative Out Voltage (VPNOUT) −0.3 V to 74 VDC RDET Continuous −0.3 V to 74 VDC RDET 1 mS pulse −0.3 V to 88 VDC RCLASS, RREF −0.3 V to 5 VDC VAUX −0.3 V to 30 VDC PGOOD, AT_FLAG (with respect to VPNOUT) Continuous −0.3 V to 74 VDC PGOOD, AT_FLAG (with respect to VPNOUT) 1 mS pulse −0.3 V to 88 VDC ESD Protection* ±1.5 kV HBM Maximum Operating Junction Temperature (TA) 150 °C Operating Ambient Temperature −40 °C to 85 °C Storage Temperature Range −65 °C to 150 °C Peak Package Solder Reflow Temp (40 seconds max exposure) 260 °C * All pins except pin 11 (VAUX). Pin 11 ESD Protection ±150 V HBM. ** No pin voltage can be higher than Vpp. Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to VPNIN except for Vaux, PGOOD and AT_FLAG with respect to VPNOUT. Currents are positive into, negative out of specified terminal. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” are not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.

2.2 Typical Electrical Performance

Unless otherwise specified, the following specifications apply over the operating ambient temperature −40 °C ≤ TAMB ≤ 85 °C. Production tests are done at 25 °C TA.

2.2.1 Power Supply

Table 2-2. Power Supply Parameter Symbol Min Typ Max Units Test Conditions/ Comment Input Voltage VPP 0 55 57 V Supports full IEEE 802.3af/at functionality PD70100/PD70200 Electrical Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 9

Parameter Symbol Min Typ Max Units Test Conditions/ Comment Power Supply Current at Operating Mode 1 3 mA VPP = 55 V

2.2.2 Detection Mode

Table 2-3. Detection Mode Parameter Symbol Min Typ Max Units Test Conditions/Comment Detection is connected. At this voltage range RDET must be on. DETRANGE 1.3 10.1 V Measured between VPP and VPNIN Detection Switch ON Resistance PD-detection RDET-on 50 Ω 2.5 V ≤ (ΔVPP to VPNIN) ≤ 10.1 V Measured between RDET and VPNIN Detection is Disconnected RDET-off 10.1 12.8 V Measured between VPP and VPNIN Detection Switch OFF Resistance RDET-off 2.0 MΩ 12.8 V ≤ (ΔVPP to VPNIN) ≤ 57.0 V Measured between RDET and VPNIN Input Offset Current IOFFSET 16 μA 1.1 V to 10.1 V IOFFSET 10 μA 1.1 V to 10.1 V

2.2.3 Classification Mode

Table 2-4. Classification Mode Parameter Symbol Min Typ Max Units Test Condition/ Comment Classification Current Source, Turn ON Threshold Range Measured at VPP VTHlow-on 11.4 13.7 V Turn on for any ICLASS while VPP increases Classification Current Source, Turn OFF ThresholdRangeMeasured at VPP VTHhigh-off 20.9 23.9 V Turn off while VPP increases Current Limit Threshold ICLASSLIM 50.0 68 80.0 mA Input Current IPP When Classification Function is Disabled ICLASSDIS 4.0 mA Class 0 RCLASS = Disconnect PD70100/PD70200 Electrical Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 10

Parameter Symbol Min Typ Max Units Test Condition/ Comment Input Current IPP When Classification Function is Enabled ICLASSEN 9.0 10.5 12.0 mA Class 1 RCLASS = 133 Ω ±1% 17.0 18.5 20.0 mA Class 2 RCLASS = 69.8 Ω ±1% 26.0 28.0 30.0 mA Class 3 RCLASS = 45.3 Ω ±1% 36.0 40.0 44.0 mA Class 4 RCLASS = 30.9 Ω ±1%

2.2.4 Mark

Table 2-5. Mark Parameter Symbol Min Typ Max Units Test Conditions/ Comment Mark, Working Voltage Range VMARK 4.9 10.1 V When voltage decreases Measured between VPP to VPNIN Mark Current IMARK 0.25 4 mA Chip current

2.2.5 Isolation Switch

Table 2-6. Isolation Switch Parameter Symbol Min Typ Max Units Test Conditions/ Comment Isolation Switch MOSFET Switches from Off to ILIM-LOW VSW-START 36 42 V Isolation Switch MOSFET Switched Off VSW-OFF 30.5 34.5 V Startup Current Limit, ILIM ILIM-LOW 105 240 325 mA VPNIN to VPNOUT Threshold Voltage for ILIM- LOW to ILIM-HIGH Switchover VDIFF 0.7 V When VPNIN to VPNOUT ≤ VDIFF, Isolating switch switches over from ILIM-LOW to ILIM-HIGH. Over Current Protection Current Limit OCP 1500 1800 2000 mA PD70100/PD70200 Electrical Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 11

Parameter Symbol Min Typ Max Units Test Conditions/ Comment Continuous Operation Load Current (PD70100) ILOAD 350 450 mA Isolating switch at ILIM- HIGH Continuous Operation Load Current (PD70200) 600 1123 Continuous Operation Total RDSON SW-RDSON 0.6 Ω Total resistance between VPNIN and VPNOUT Isolating switch at ILIM-HIGH

2.2.6 DC/DC Capacitor Discharger

Table 2-7. DC/DC Capacitor Discharger Parameter Symbol Min Typ Max Units Test Conditions/ Comment DC/DC Input Capacitance 220 μF For reference only Guaranteed by design (not tested in production) Discharge Current 22.8 32 50 mA 7.0 V ≤ VPP to VPNOUT ≤ 30 V Full Discharge Time for Full Discharge of Input Capacitance TDSC 500 ms VPP < UVLO threshold Guaranteed by design (not tested in production)

2.2.7 AT_FLAG

Table 2-8. AT_FLAG Parameter Symbol Min Typ Max Units Test Conditions/ Comment Output Low Voltage 0.4 V IOL = 0.75 mA

2.5 V IOL MAX = 5 mA

Leakage Current 1.7 μA VATFLAG = 57 V

2.2.8 PGOOD

Table 2-9. PGOOD Parameter Symbol Min Typ Max Units Test Conditions/Comment Output Low Voltage 0.4 μF IOL = 0.75 mA 2.5 mA IOL MAX = 5 mA Leakage Current 1.7 μA VPGOOD = 57 V PD70100/PD70200 Electrical Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 12

2.2.9 Thermal Shutdown

Table 2-10. Thermal Shutdown Parameter Symbol Min Typ Max Units Test Conditions/ Comment Thermal Shutdown Temperature 180 200 220 °C

2.2.10 VAUX

Reference to VPNOUT. Table 2-11. VAUX Parameter Symbol Min Typ Max Units Test Conditions/Comment VAUX Output Voltage On VAUX-on 9.5 10.5 11.8 V Isolating switch at ILIM-HIGH and PGOOD = Low Output Current Peak IVAUXP 0 10 mA Capacitor = 30 μF When TLOAD ≤ 5 mS Isolating switch at ILIM-HIGH and PGOOD = Low Output Continuous Current IVAUXC 0 2 mA When TLOAD ≤ 10 mS Isolating switch at ILIM-HIGH and PGOOD = Low VAUX Output Current Limit IVAUX 10 32 mA Isolating switch at ILIM-HIGH and PGOOD = Low PD70100/PD70200 Electrical Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 13

  1. Pin Description The following illustration shows the device pinout, from the top view and bottom view. Figure 3-1. Pinout Top View and Bottom View The following table lists the pin descriptions for the PD70100/PD70200 devices. Table 3-1. Pin Descriptions Pin Pin Name (PD70100) Pin Name (PD70200) Type Description 1 RDET RDET Valid Detection resistor. Connect external 24.9 KΩ detection resistor between RDET and VPP. 2 RREF RREF Bias current resistor. Connect a 243 k 1% resistor between this pin and VPNIN. 3 RCLASS RCLASS Power classification setting. Connect external class resistor between RCLASS and VPNIN. 4 VPNIN VPNIN Power VPort Negative input. Connected to the isolating SW input. N-channel MOSFET source. The exposed thermal pad should be connected to these pins. 6 N.C. N.C. 7 VPNOUT VPNOUT Power/Gnd Vport Negative output. Connected to the isolating SW output. N-channel MOSFET Drain. Primary side Ground. A decent ground plane should be deployed around this pin whenever is possible. PD70100/PD70200 Pin Description © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 14

(PD70100) Pin Name (PD70200) Type Description 9 N.C. AT_FLAG Open drain The two-event detector should discern between AF and AT classification waveforms and outputs the AT_FLAG (PD70200 only).

10 PGOOD PGOOD Open drain After startup, a PGOOD flag is

generated in order to optionally inform the application DC/DC converter that the power rails are ready. 11 VAUX VAUX Power Auxiliary output voltage to VPNOUT. Can be used for DC-DC startup for bootstrap initiation.

12 VPP VPP Power High voltage positive input, reference to

VPNIN and high voltage positive input, reference to VPNOUT during capacitor discharge. EP EPAD EPAD Connect to VPNIN. EPAD should be connected to a large copper area for improved thermal management. PD70100/PD70200 Pin Description © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 15

  1. Package Specifications This section provides information about the available package. Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155 mm (.006”) on any side. Lead dimension shall not include solder coverage. Dimensions are in millimeters, inches for reference only. Figure 4-1. Package Drawing Dimensions and Measurements Table 4-1. Package Dimensions: DFN Dimension Millimeters Inches Min Max Min Max A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 A3 0.20 REF 0.008 REF D 4.00 BSC 0.157 BSC E 3.00 BSC 0.118 BSC D2 3.00 3.70 0.118 0.146 E2 1.40 1.80 0.055 0.071 e 0.50 BSC 0.0197 BSC K 0.20 MIN 0.008 MIN L 0.30 0.50 0.012 0.020 b 0.18 0.30 0.007 0.012 PD70100/PD70200 Package Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 16

4.1 Thermal Specifications

The following table lists the thermal specifications for the PD70100 and PD70200 devices. Table 4-2. Thermal Specifications Parameter Value Typical thermal resistance: junction to ambient 40 °C/W Typical thermal resistance: junction to case 4 °C/W The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All specifications assume no ambient airflow. PD70100/PD70200 Package Specifications © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 17

  1. Ordering Information Table 5-1. Ordering Information Part Number Packaging Type Package Part Marking PD70100ILD-TR Tape and Reel DFN 4 mm × 3 mm 12 pins RoHS Compliant/Pb-free MSC 70100 Z Z e31 YYWWNNN2 PD70200ILD-TR Tape and Reel DFN 4 mm × 3 mm 12 pins RoHS Compliant/Pb-free MSC 70200 Z Z e31 YYWWNNN2 1. ZZ e3: ZZ = Random Character with no meaning, and e3 = 2nd level interconnect. 2. YY = Year, WW = Week, NNN = Trace Code. PD70100/PD70200

Ordering Information

© 2020 Microchip Technology Inc. Datasheet DS00003639A-page 18

  1. References
  • AN3551 PD70101 and PD70201 PD Device Layout Guidelines
  • AN3471 Designing a Type 1/2 802.3 or HDBaseT Type 3 Powered Device Using PD702x1 and PD701x1 ICs
  • AN3472 Implementing Auxiliary Power in PoE PD70100/PD70200 References © 2020 Microchip Technology Inc. Datasheet DS00003639A-page 19
  1. Revision History Revision Date Description A 11/2020 • Updated to Microchip template.
  • Updated document number from PD-000303241 to DS00003639.
  • Added Microchip Powered Device Products Offerings table.
  • Updated Figure 1.
  • Added References section. 4.0 08/2019 • The package marking details were updated in the ordering information table.
  • Figure 1 and Figure 4 were updated. 3.0 01/2018 • The formatting of this document was updated to the latest template.
  • MSL level was updated.
  • Part marking was updated.
  • Absolute Maximum Ratings were updated. 2.0 10/2015 • The IC part number was updated from PD70100A to PD70100 (PDN 152044). 1.1 10/2014 • The description of Pin 2 was updated. 1.0 03/2012 • The document address footer was updated.
  • Characteristics were updated. 0.6 07/2011 • The specification was updated. 0.5 01/2011 • Package was updated. 0.4 12/2010 • Package was updated. 0.3 11/2010 • Classification Pulse diagrams were added.
  • Catalog numbers metrology was changed.
  • Extensive changes were made to document format and Theory of Operation section.
  • Package drawing was corrected.
  • Product Highlight and Typical Characteristics were added. 0.1 04/2010 Initial Revision PD70100/PD70200

Revision History

© 2020 Microchip Technology Inc. Datasheet DS00003639A-page 20

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