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1-Port PSE PoE Controller Datasheet Introduction Microchip's PD69101 device is a single-port, mixed-signal, and high-voltage Power over Ethernet (PoE) driver. It is utilized in Ethernet switches and enables the network devices to share power and data over the same cable. It enables detection of IEEE® 802.3af-2003 compliant powered devices (PDs) and IEEE 802.3at high-power devices, ensuring safe power feeding and disconnection of ports, with full digital control and a minimum of external components. A plug-and-play device, the PD69101 executes all real-time functions as specified in the IEEE 802.3af-2003 (AF) and IEEE 802.3at high-power (AT) standards, including load detection, AF and AT classification, and multiple classification attempts (MCA). Integrating power, analog, and state-of-the-art logic, the PD69101 fits into a single 24-pin plastic QFN package. The chip includes built-in internal thermal protection, and two LEDs provide port state and port type (AF/AT) indication. PD69101 device offer the following important features.

  • Designed to detect and disable disconnected ports, utilizing DC disconnection methods as specified in the AF and IEEE802.3 af/at standards.
  • Low-power device using an internal 0.34Ω MOSFET and an external 0.5Ω sense resistor.
  • Optionally detects legacy/pre-standard PD devices.
  • Provides overload, underload, overvoltage, overtemperature, and short-circuiting PD protection.
  • Supports supply voltages ranging from 32V to 57 VDC with no need for additional power supply sources. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 1

Features

The PD69101 device has the following key features.

  • Fully AF and AT compliant
  • Includes two-event classification
  • Supports pre-standard PD detection
  • Single DC voltage input (32V–57 VDC)
  • Supports 2-pairs
  • V MAIN out-of-range protection
  • Wide temperature range: –40°C to 85°C
  • Overtemperature protection
  • Low thermal dissipation (0.5Ω sense resistor)
  • Includes on/off command pin
  • 2× direct LEDs drive
  • Continuous port monitoring and system data
  • Configurable load current setting
  • Configurable AT/AF modes
  • Configurable standard and legacy detection mode
  • Power soft-start mechanism
  • On-chip thermal protection
  • Voltage monitoring and protection
  • Built-in 3.3 VDC regulator
  • Internal power-on-reset
  • RoHS compliant
  • Low Rdson FET: 0.3Ω
  • MSL3 PD69101 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 2

through AF/AT and current-set pins (DGND or DVDD). Figure 1. Typical 2-Pair Application © 2021 Microchip Technology Inc.

© 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 4

  1. Functional Description The PD69101 device has two sections, listed as follows:
  • A digital section that controls and monitors the logical PoE functions (state machines, timings, and so on)
  • An analog section that performs the front-end analog PoE functionality The following figure shows the internal functional blocks of the PD69101 device. Figure 1-1. PD69101 Internal Block Diagram

1.1 Logic Main Control Module

The logic main control block includes the following digital timing mechanisms and state machines, synchronizing, and activating the PoE functions.

  • Real-Time Protection (RTP)
  • Start-up macro (DVDT)
  • Load signature detection (RES DET)
  • Classification macro (CLASS)
  • Voltage and current monitoring registers (VMC)
  • LEDs stream out control indications
  • ADC interfacing
  • Direct digital signals with analog block PD69101 Functional Description © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 5

1.1.1 Line Detection Generator

Upon request from the main control module, four different voltage levels are generated by the line detection generator, ensuring robust AF/AT line detection functionality.

1.1.2 Classification Generator

Upon request from the main control module, the state machine applies a regulated class event and mark event voltage to the ports, as required by the IEEE standard.

1.1.3 Current Limiter

This circuit continuously monitors the current of powered ports and limits the current to a specific value, according to the pre-defined limits set by AF/AT and current_set pins. In cases where the current exceeds this specific level, the system starts measuring the elapsed time. If this time period is greater than a preset threshold, the port is disconnected.

1.1.4 Main MOSFET

Main power switching FET, used to control PoE current into the load.

1.1.5 Analog-to-Digital Converter (ADC)

A 10-bit analog-to-digital converter, used to convert analog signals into digital registers for the logic control module.

1.1.6 Power-on Reset (POR)

This circuit monitors the internal 3.3 VDC levels. If this voltage drops below specific thresholds, a reset signal is generated and the PD69101s are reset.

1.1.7 Voltage Regulator

The voltage regulator generates 3.3 VDC and 5 VDC for the internal circuitry. These voltages are derived from the VMAIN supply.

1.1.8 CLK

CLK is an internal 8 MHz clock oscillator.

1.2 Application Information

The PD69101 performs IEEE 802.3af and IEEE 802.3at functionality as well as legacy (capacitor) and Cisco PD detection, in addition to protections such as short circuit and dV/dT protection upon startup.

1.2.1 Line Detection

The line detection feature detects a valid AF or AT load, as specified in the AF/AT standard. The resistor value should range from 19 KΩ to 26.5 KΩ. Line detection is based on four different voltage levels generated over the PD (the load), as shown in the following figure. PD69101 Functional Description © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 6

Figure 1-2. Typical PoE Voltage Timing Diagram

1.2.2 Legacy (Capacitor) Detection

In cases where pin 24 is set to 0, the PD69101's detection mechanism is configured to detect and power-up legacy PDs, as well as AF/AT compliant. This mechanism also detects and powers up Cisco legacy PDs.

1.2.3 Classification

The classification process takes place right after the resistor detection, is successfully completed. The main goal of the classification process is to detect the PD class, as specified in the IEEE802.3af and IEEE 802.3at standards. In IEEE 802.3af mode, the classification mechanism is based on a single voltage level (single class event). In IEEE 802.3at mode, the classification mechanism is based on two voltage levels (dual class event) as defined in IEEE 802.3at 2009. In IEEE 802.3at mode, when the PD is class 0–3, the PD69101 generates a single class event. When the PD is class 4, the PD69101 generates two class events.

1.2.4 Port Start Up

Upon a successful detection and classification process, power is applied to the load through a controlled start-up mechanism. During this period, current is limited to 425 mA for a typical duration of 65 mS, which enables the PD load to charge and enter a steady state power condition.

1.2.5 Over-Load Detection and Port Shut Down

After power-up, the PD69101 automatically initializes its internal protection mechanisms to monitor and disconnect power from the load in cases where extreme conditions (such as over-current or short port terminal scenarios) occur, as specified in the IEEE 802.3af/at standard.

1.2.6 Disconnect Detection

The PD69101 supports the DC disconnect function as per the IEEE 802.3af/at standard. This mechanism continuously monitors the load current and disconnects power in cases where the load current is below 7.5 mA (typical) for more than 322 mS.

1.2.7 Overtemperature Protection

The PD69101 has internal temperature sensors that continuously monitor junction temperature and disconnect load power when the junction temperature exceeds 200 °C. This mechanism protects the device from extreme events such as high ambient temperature or other thermo-mechanical failures that might damage the PD69101 device.

1.2.8 VMAIN Out-of-Range Protection

The PD69101 automatically disconnects port power when VMAIN exceeds 57.5 VDC ±0.5 VDC. This is an extremely valuable feature that protects the load, if the main power source is faulty or damaged. PD69101 Functional Description © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 7

1.2.9 Serial Communication: Monitoring Mode

When MODE0 and MODE1 input pins are configured to serial monitoring mode (01), the PD69101 continuously and repeatedly transmits out the content of nine internal registers.

  • Data out stream is transmitted through LED1 (pin 14)
  • Clock out stream is transmitted through LED0 (pin 13)
  • Data stream is shifted out with a 1 MHz clock (1 μsec)
  • Total transaction packet length is 116 μsec
  • The transmission is repeated every 1 msec
  • Between transactions, the clock is held low while the data stream out is stable high/low. Note: To exploit LED1 and LED0 to communicate and monitor transmissions, use a 1 KΩ pull-up resistor to the DVDD. The following table lists the stream out data transmits of 116 bits, starting from MSB to LSB. Table 1-1. Serial Monitoring Mode MSB LSB Internal 0 Internal 1 Internal 2 Internal 3 Internal 4 VPORT VMAIN IPORT Port Status 13 bits 10 bits 23 bits 16 bits 16 bits 10 bits 10 bits 13 bits 5 bits 78 internal signals used for internal tests Port voltage measurement LSB= 58 mV V= Decimal ×58 mV VMAIN voltage measurement LSB= 58 mV V= Decimal ×58 mV Port current measurement LSB= 238 μA I= Decimal × 238 μA Real-time port status indication. For more information, see Table 1-2. PD69101 Functional Description © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 8

The following table lists the port status coding. Table 1-2. Port Status Coding Binary MSB to LSB Decimal Value Description 00000 0 PoE idle state 00001 1 00010 2 00011 3 Searching phase 00100 4 Res detection phase 00101 5 Back OFF phase 00110 6 00111 7 Class phase 01000 8 01001 9 Wait for start-up 01010 10 01100 11 01011 12 Cap detection 01101 13 Start-up 01110 14 01111 15 Ongoing 10000 16 10001 17 UDL 10010 18 Overload or short circuit 10011 19 VMAIN out of range 10100 20 PD69101 Functional Description © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 9

  1. Electrical Specifications Unless otherwise specified, the following specifications apply to the operating ambient temperature (TAMB): –40 °C to 85 °C. Table 2-1. Power Supply Parameter Symbol Test Conditions/ Comment Minimum Typical Maximum Unit Input voltage VMAIN Supports full IEEE 802.3 functionality 32 55 57 VDC Power supply current at operating mode — VMAIN = 55 V — — 10 mA Table 2-2. Digital I/O Parameter Symbol Test Conditions/Comment Minimum Typical Maximum Unit Input logic, high threshold VIH — 2.2 — — VDC Input logic, low threshold VIL — — — 0.8 VDC Input hysteresis voltage — — 0.4 0.6 0.8 VDC Input high current IIH — –10 — 10 μA Input low current IIL — –10 — 10 μA Output high voltage VOH For IOH = –1 mA 2.4 — — VDC Output low voltage VOL IOH = 1 mA — — 0.4 VDC Table 2-3. PoE Load Currents Parameter Symbol Test Conditions/Comment Minimum Typical Maximum Unit AT, high limit mode AT_LIM_HIGH (high current level, for future use) RSENSE = 0.5 Ω 1%, connected at Port_Sense pin 1.18 1.2 1.28 A AT, medium limit mode AT_LIM_MID (medium current level, for future use) 847 874 919 mA AT, low limit mode AT_LIM_LOW 706 722 767 mA AF, limit mode AF_LIM 410 425 448 mA Table 2-4. Main Power Switching FET Parameter Symbol Typical Unit On resistance RDSON 0.3 Ω Internal thermal protection threshold — 200 °C PD69101 Electrical Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 11

Table 2-5. LED0 and LED1 Drivers Parameter Symbol Typical Maximum Unit Current sink ISINK (from VMAIN to AGND) 3 5 mA

2.1 Dynamic Characteristics

The PD69101 device utilizes three current level thresholds (IMIN, ICUT, and ILIM) and three timers (TMIN, TCUT, and TLIM).

  • Loads that consume I LIM current for more than TLIM are labeled as short circuit state and shut down.
  • Loads that dissipate more than I CUT for longer than TCUT are labeled as overloads and are shut down.
  • If output power is below I MIN for more than TMIN, the PD is labeled as no load and is shut down. Automatic recovery from overload and no load conditions is attempted every TOVLREC periods (typically one second). Output power is limited to ILIM, which is a maximum peak current allowed at the port. Table 2-6. IEEE 802.3 af Mode Parameters Parameter Symbol Conditions Minimum Typical Maximum Unit Automatic recovery from no load shutdown — TUDLREC value, measured from port shutdown point (can be modified through control port) — 1 — sec Cutoff timer accuracy — Typical accuracy of Tcut — 2 — ms Inrush current IInrsh For t = 50 ms, Cload = 180 μF (max) 400 — 450 mA Output current operating range IPORT Continuous operation after startup period 10 — 375 mA Output power available operating range PPORT Continuous operation after startup period, at port output 0.57 — 15.4 W Off-mode current IMIN1 Must disconnect for T greater than TUVL 0 — 5 mA IMIN1 May or may not disconnect when T is greater than TUVL 5 7.5 10 mA PD power maintenance request drop-out time limit TPMDO Buffer period to handle transitions 300 — 400 ms Over-load current detection range ICUT Time limited to TOVL 350 — 400 mA Over-load time limit TOVL — 50 — 75 ms Turn-on rise time TRISE From 10% to 90% of Vport (specified for PD load consisting of 100 μF capacitor in parallel to 200 Ω) 15 — — μs Turn-off time TOFF From VPORT to 2.8 VDC — — 500 ms Time maintain power signature TMPS DC modulation time for DC disconnect — 49 — ms PD69101 Electrical Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 12

Table 2-7. IEEE 802.3at Mode Parameters Parameter Symbol Conditions Minimum Typical Maximum Unit Automatic recovery from no load shutdown — TUDLREC value, measured from port shutdown point (can be modified through control port) — 1 — sec Cutoff timer accuracy — Typical accuracy of Tcut — 2 — ms Inrush current IInrsh For t = 50 ms, Cload = 180 μF (max) 400 — 450 mA Output current operating range IPORT Continuous operation after startup period 10 — 725 mA Output power available operating range PPORT Continuous operation after startup period, at port output 0.57 — 36.25 W Off-mode current IMIN1 Must disconnect for T greater than TUVL 0 — 5 mA IMIN2 May or may not disconnect when T is greater than TUVL 5 7.5 10 mA PD power maintenance request drop-out time limit TPMDO Buffer period to handle transitions 300 — 400 ms Over-load current detection range ICUT Time limited to TOVL — — 600 mA Over-load time limit TOVL — 50 — 75 ms Turn-on rise time TRISE From 10% to 90% of Vport (specified for PD load consisting of 100 μF capacitor in parallel to 200 Ω). 15 — — μs Turn-off time TOFF From VPORT to 2.8 VDC — — 500 ms Time maintain power signature TMPS DC modulation time for DC disconnect — 49 — ms

2.2 Absolute Maximum Ratings

The following table lists the absolute maximum ratings for the PD69101. Exceeding these ratings can cause damage to the device. Pin Port_Sense is ESD sensitive and passes 500V HBM. All voltages are with respect to ground. Currents are marked positive when flowing into a specified terminal and marked negative when flowing out of a specified terminal. Table 2-8. Absolute Maximum Ratings Parameter Rating Supply input voltage (VMAIN) –0.3 VDC to 74 VDC Port_Neg pin, LED0, LED1 –0.3 VDC to 74 VDC Port_Sense pin –0.3 VDC to 3.6 VDC QGND, AGND pins –0.3 VDC to 0.3 VDC VAUX5 –0.3 V to 5.5V All other pins –0.3 VDC to 3.6 VDC Operating ambient temperature range –40 °C to 85 °C PD69101 Electrical Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 13

Maximum operating junction temperature 150 °C Storage temperature range –65 °C to 150 °C ESD protection at all I/O pins ±2 KV (HBM)

2.3 Moisture Sensitivity

This device is rated moisture sensitivity level 3 as specified in the joint IPC and JEDEC® standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.

2.4 Power Dissipation Information

Table 2-9. Power Dissipation Parameter Value Rsense power dissipation 0.5 Ω × IPORT2 Rds_ON power dissipation 0.3 Ω × IPORT2 Pport_AF = 15.4 W PRsense = 51 mW (320 mA) PRds_ON 31 mW (320 mA) Pport_AT = 30 W PRsense = 180 mW (600 mA) PRds_ON 108 mW (600 mA) Typical PD69101 self power dissipation (including internal regulations) 0.5W (50 VDC) Typical PD69101 2-pairs AF application power dissipation 0.5W + 51 mW + 31 mW = 0.582W Typical PD69101 2-pairs AT application power dissipation 0.5W + 180 mW + 108 mW = 0.788W PD69101 Electrical Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 14

  1. Pin Descriptions The following figure shows the device pin diagram from the top and bottom views. Figure 3-1. PD69101 Pinout The following table lists the pin descriptions for the PD69101 device. Table 3-1. Pin Descriptions Number Name Type Description

0 Exposed PAD Analog ground Exposed pad; metal plate

ground. A high-quality ground plane (about 500 mil. inch over 500 mil. inch) should be deployed around this pin whenever possible. PD69101 Pin Descriptions © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 15

Number Name Type Description

1 CURRENT_SET Digital input User input to set AF/AT and

maximum current limit. Use pull-up resistors to DVDD or pull-down resistors to DGND to set the mode of operation as shown in Table 3-2.

2 AF/AT

3 DVDD Power in Regulated input voltage

(3.3V) for internal digital circuitry. Must be externally connected to pin 4. 4 VAUX3P3 Power in Voltage regulation in 3.3 VDC. Connect to pin 5. A 4.7 μF capacitor to AGND is recommended.

5 DRV_VAUX3P3 Power out Internal voltage regulator

out, 3.3 VDC. It must be externally connected to pin 4.

6 VAUX5 Power Regulated 5 VDC voltage

filter. A 1 μF capacitor to AGND is recommended. 7 AGND Power Analog ground.

8 V_MAIN Power Supply voltage for the

internal analog circuit. Place a low-ESR bypass capacitor with low impedance trace as close as possible to AGND and this pin (not less than 1 μF). 9 PORT_NEG Analog I/O Negative output of the port.

10 PORT_SENSE Analog input Sense resistor port input

(connected to 0.5, 1% Ω resistor to GND).

11 QGND Power Quiet analog ground; used

for sensitive analog cells. 12 I_REF Analog I/O Resistor reference. Connect 30.1K 1% resistor to QGND. PD69101 Pin Descriptions © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 16

Number Name Type Description

13 LED0 Open-drain I/O Port status direct LED

indications. For details, see Table 3-4. This is a high- voltage, open-drain, active low (SINK) output pin. Connection to LED and VMAIN through a ~18.2 KΩ (~3 mA) resistor is recommended.

14 LED1

15 N/C Analog I/O Test pin (for production

use only); keep open (not connected).16 N/C

17 TRIM Analog input Zapping input for IC

production trimming. It must be connected to DVDD.

18 SYNC Digital I/O Synchronization open-drain

client. In 2-pair mode (switch), this pin should be pulled down to DGND through a 4.7 KΩ resistor. 19 DGND Digital I/O Digital ground.

20 RESET_N Digital input Reset input/on-off

command (active low). 21 MODE 0 Test I/O Configuration input pins. Used to set mode of operation and test mode at production. Typically connected to DGND. For details, see Table 3-3.

22 MODE 1

23 Host/Client Digital input If connected to DVDD (3.3 VDC): host mode. If connected to GND: client mode.

24 STD_DET/LEGACY Digital input User input pin to set the

chip mode of operation. 1: DVDD= IEEE 802.3af- compliant resistor detection only. 0: DGND= IEEE 802.3af/at detection and legacy (non- standard) line detection. Note: 0= Connect to DGND and 1= connect to DVDD. PD69101 Pin Descriptions © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 17

3.1 CURRENT_SET and AF/AT

The following table lists the pins that determine the typical PD load output current. Table 3-2. CURRENT_SET and AF/AT Pins AT/AF Pin Current_Set Pin Max. Current ICUT [mA] Typical ILIM [mA] IEEE 802.3 0 0 350 425 AF mode (standard) 1 0 600 722 AT mode (standard) 1 1 720 874 AT mode (high power) 0 1 1000 1200 AT mode (extra high power)

3.2 Mode of Operation Coding

The following table lists the mode of operation coding options related to pins 21 and 22. Table 3-3. Configuration Coding Mode 0 Mode 1 Mode Description 0 0 Normal operation mode Standard operation PoE mode. LED0 and LED1 outputs are used for direct LED drive as described in the following section. 0 1 Serial monitoring mode Standard operation PoE mode. LED0 and LED1 are used to continuously stream out internal logic signals for PoE monitoring. 1 0 Test mode Internal IC test mode; used in production only. 1 1 Test mode Internal IC test mode; used in production only.

3.3 LED I/Os Behavior

The following tables list the LED I/Os behavior related to pins 13 and 14 in 2-pair application. In both application types, the LED pin is a high-voltage, open-drain, output pin, and an active low (sink) pin. That is, LED is “ON” when the I/O is pulled low. Table 3-4. 2-Pair Behavior Status Indications LED0 LED1 Notes AF mode—port ON ON OFF Useful for bi-color LED connected from LED0 to LED1. PD69101 Pin Descriptions © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 18

Status Indications LED0 LED1 Notes AT mode (class AT was detected)—port ON ON ON — AF mode—over-load or short Blink 1 Hz OFF Blinking continues for ~2 seconds. AT mode—over-load or short Blink 1 Hz Blink 1 Hz Blinking continues for ~2 seconds. VMAIN voltage is out of range or IC overtemperature Blink 4 Hz OFF Blinking continues as long as overvoltage or overtemperature state exists. AF mode—port OFF OFF ON Useful for bi-color LED connected from LED0 to LED1. AT mode—port OFF OFF OFF — PD69101 Pin Descriptions © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 19

  1. Package Specifications This section provides the package drawing, RoHS and solder reflow information, and thermal specifications for the PD69101 device. The following figure shows PD69101 package is a 4 mm × 5 mm, 24-pin QFN. Figure 4-1. QFN Package Dimensions do not include protrusions. It must not exceed 0.155 mm (0.006”) on any side. Lead dimension must not include solder coverage. The following table lists the dimensions for the QFN package. Table 4-1. Package Dimensions Dimension Millimeters Inches — Minimum Maximum Minimum Maximum A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0 0.002 A3 0.20 REF 0.008 REF K 0.20 MIN 0.008 MIN e 0.50 BSC 0.02 BSC L 0.30 0.50 0.012 0.02 b 0.18 0.30 0.007 0.012 D2 2.50 2.75 0.098 0.108 E2 3.50 3.75 0.138 0.148 D 4.00 BSC 0.158 BSC E 5.00 BSC 0.197 BSC PD69101 Package Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 20

4.1 RoHS and Solder Reflow Information

The PD69101 device is rated RoHS 6/6. The package is lead (Pb)-free, with a 100% matte tin finish. The package peak temperature for solder reflow (40 seconds maximum exposure) is 260 °C (0 °C, –5 °C). The following table lists the classification reflow profile information. Table 4-2. Classification Reflow Profiles Profile Feature Pb-Free Assembly Average ramp-up rate (TSmax to Tp) 3 °C/second max Pre-heat: Temperature minimum (TSmin) Temperature maximum (TSmax) Time (TSmin to TSmax) 150 °C 200 °C 60 seconds–180 seconds Time maintained above: Temperature (TL) Time (tL) 217 °C 60 seconds–150 seconds Peak/classification temperature See Figure 4-2 Time within 5 °C of actual peak temperature (tp) 20 seconds–40 seconds Ramp-down rate 6 °C/second max Time 25 °C to peak temperature 8 minutes max Note: All temperatures refer to the top-side of the package, measured on the package body surface. The following illustration shows the classification reflow profile of the PD69101 device. Figure 4-2. Classification Reflow Profile Diagram Note: Exceeding these ratings can damage the device. PD69101 Package Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 21

4.2 Thermal Specifications

The following table lists the thermal specifications for the PD69101 device. Table 4-3. Thermal Specifications Parameter Value Typical thermal resistance: junction to ambient 25 °C/W Typical thermal resistance: junction to case 4 °C/W Typical thermal resistance: junction to board 2 °C/W The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All specifications assume no ambient airflow.

4.3 Tape and Reel—Packaging Information

The following section provides the tape and reel packaging information. The following figure shows the tape specification. Figure 4-3. Tape Specification The following table lists the tape mechanical data. Table 4-4. Tape Mechanical Data Dimension Millimeters A0 4.25 ±0.10 B0 5.40 ±0.10 K0 1.20 ±0.10 K1 — Pitch 8.00 ±0.10 PD69101 Package Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 22

Width 12.00 ±0.30 The following figure shows the reel specification. Figure 4-4. Reel Specification PD69101 Package Specifications © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 23

  1. Ordering Information The following table lists the ordering information for the PD69101 device. Table 5-1. Ordering Information Part Number Package Packaging Type Temperature Part Making PD69101ILQ-TR Plastic 24-pin QFN: 4 mm × 5 mm Tape and reel – 40 °C to 85 °C MSC 69101 ZZ e31 YYWWNNN2 Notes: 1. ZZ e3: ZZ = Random character with no meaning and e3 = Second level interconnect. 2. YY = Year, WW = Week, NNN = Trace Code. PD69101

Ordering Information

© 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 24

  1. Revision History Revision Date Description A 11/2021 The following is a summary of changes in revision A of this document:
  • The document was updated to latest Microchip template.
  • The document number was changed from PD-000308061 to DS00004280A. 3.0 8/2019 The following is a summary of changes in revision 3.0 of this document.
  • Changed package marking of Figure 3-1.
  • Part marking was updated. For more information, see 5. Ordering Information. 2.0 3/2018 The following is a summary of changes in revision 2.0 of this document.
  • Document format was updated.
  • MSL level was updated from 1 to 3.
  • 4-pair application was removed.
  • Tape and Reel—Packaging Information section was added. For more information, see 4.3. Tape and Reel—Packaging Information.
  • Part marking is updated. For more information, see the 5. Ordering Information. 1.9 3/2014 The following is a summary of changes in revision 1.9 of this document.
  • TETA JB was added.
  • A typo in the ESD parameter was corrected.
  • V Main out-of-range information was corrected. 1.8 10/2013 The following is a summary of changes in revision 1.8 of this document.
  • The extended input voltage range was updated to 32V–57V. PD69101

Revision History

© 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 25

1.7 7/2013 The following is a summary of changes in revision 1.7 of this document.

  • TETA JC data was added. 1.6 7/2013 The following is a summary of changes in revision 1.6 of this document.
  • The IC marking was updated. 1.5 12/2010 The following is a summary of changes in revision 1.5 of this document.
  • Parameters were updated. 1.4 9/2010 The following is a summary of changes in revision 1.4 of this document.
  • Parameters were updated. 1.3 6/2010 The following is a summary of changes in revision 1.3 of this document.
  • Parameters were updated. 1.2 6/2010 The following is a summary of changes in revision 1.2 of this document.
  • Package drawing was updated. 1.1 3/2010 The following is a summary of changes in revision 1.1 of this document.
  • The wave forms and functionality were updated according to evaluation results. 1.0 3/2010 Revision 1.0 was the first publication of this document. PD69101

© 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 26

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  • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. Legal Notice This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/ design-help/client-support-services. PD69101 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 27

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM- ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. ISBN: 978-1-5224-9285-6 PD69101 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 28

For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. PD69101 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00004280A-page 29

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