PD65881GB-P02

PD65881GB-P02_15 RENESAS | Alldatasheet

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μPD65881GB-P02 μPD71051-Compliant Serial Control Unit Gate Array DATA SHEET Document No. A18499EJ2V0DS00 (2nd edition) Date Published December 2007 NS Printed in Japan © NEC Electronics Corporation 2007 The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Following the phase-out of it popular μPD71051 standard serial control unit (USART), NEC Electronics is now offering the μPD65881GB-P02 serial control unit, a functional and low-cost substitute for the μPD71051. To verify the applicability of the μPD65881GB-P02 gate array as a replacement for the μPD71051, you must first test an equivalent prototype in the system being developed. If the in-system test is deemed successful, then you may proceed to purchase mass production versions of the product.

DESCRIPTION

Internal block functions and commands are the same as those of the μPD71051. Differences between the two products are listed below. Before adopting this product, carefu lly read the disclaimer below and the caution in section 3 (CAUTIONS WHEN CONSIDERING ADOPTION OF THIS PRODUCT). The μPD65881GB-P02 integrates an NA55A IP macro in a CMOS-N5 gate array that can be used as a peripheral I/O device to transmit serial data synchronously, asynchronously, or bi-synchronously. The USART receives serial data streams and converts t hem into parallel data characters for the CPU. While receiving serial data, the USART can also accept paralle l data from the CPU, convert it to serial data, and then transmit it. The USART signals the CPU when it has receiv ed or transmitted a characte r and requires service. The CPU may read complete USART status data at any time.

FEATURES

• Synchronous operation
• One or two synchronous characters
• Internal/external synchronization
• Automatic SYNC character insertion
• Asynchronous operation
• Clock rate (baud rate): ×1, ×16, or ×64 − Send stop bits: 1, 1.5, or 2 bits − Break transmission − Automatic break detection − Valid start bit detection
• Baud rate: DC ~ 660 Kb/s at ×1 clock
• Full-duplex, double-buffered transmitter/receiver
• Error detection: parity, overrun, and framing
• Five- to eight-bit characters
• Low-power standby mode
• Compatible with standard microcontrollers
• Functionally equivalent to (except in standby mode) and can replace the μPD8251AF
• CMOS process technology
• Single +5V ±10% power supply
• Industrial temperature range (Ambient): –40 to 85°C
• 44-pin QFP package
• RoHS-compliant

Data Sheet A18499EJ2V0DS 2 μPD65881GB-P02 Disclaimer  This product is not functiona lly equivalent to any similar non-NEC Electr onics product. NEC Electronics shall assume no responsibility for any loss or damage incurred by customers or thir d parties resulting from the replacement of products similar to, but other than, the μPD71051GB-10-3B4.  NEC Electronics shall assume no responsibility for any loss or dam age incurred by customers or third parties resulting from the use of this product outside the conditi ons described in the absolute maximum ratings, recommended operation range, and quality grades. COMPARISON OF μPD65881GB-P02 AND μPD71051 Feature This Product μPD71051 Reference Part number (mark) μPD65881GB-P02-3BS-A (658N51) μPD71051GB-10-3B4 (standard NEC Electronics mark) Package type Only 44-pin QFP QF P, DIP, SOP, PLCC (QFJ) − Package shape (comparison of 44-pin QFP) The body size and package width are the same, but the pin lengths and pin bending method are different. 4. PACKAGE DRAWING Function of pin 39 IC (connec tion with external pin prohibited) NC 1. PIN LAYOUT Lead-free support Yes No ORDERING INFORMATION Recommended soldering conditions IR60-207-3, partial heating IR35-00-3, VP15-00-3, WS60-00-1, partial heating 5. RECOMMENDED SOLDERING CONDITIONS Absolute maximum ratings Power supply voltage −0.5 to +6.0 (V) −0.5 to +7.0 (V) Input voltage −0.5 to +6.0 (V) −0.5 to VDD+0.3 (V) Output voltage −0.5 to +6.0 (V) −0.5 to VDD+0.3 (V) Recommended operating range T A = −40 to +85°C, VDD = 5 V±10% This product does not guarantee operation at less than 4.5 V. DC characteristics Partially different AC characteristics This product has the following restrictions on load capacitance. D7 to D0: 100 pF or less TXDATA, SYNC/BRK, RXRDY, TXEMP, TXRDY: 40 pF or less 2. ELECTRICAL SPECIFICATIONS

ORDERING INFORMATION

μPD65881GB-P02-3BS-A 44-pin plastic QFP (10 x 10 mm) Remark Products with -A at the end of t he part number are lead-free products. QUALITY GRADES "Standard" This product is intended to be used for applications su ch as computers, office equipment, communications equipment, test and measurement equipment, and home electr onic appliances. It theref ore cannot be used for the following applications. Applications requiring special or specific grades, such as transportation equi pment (automobiles, trains, ships, etc.), traffic control systems, medical equipment, aircraft equipment, and aerospace equipment. Remark For details of quality grades, refer to Quality Grades on NEC Semiconductor Devices (document number: C11531E).

Data Sheet A18499EJ2V0DS 3 μPD65881GB-P02 BLOCK DIAGRAM (μPD71051) D7 -D0 CS RESET CLK C/D RD WR Internal 8- bit Bus TxDATA TxRDY TxEMP TxCLK RxDATA RxRDY SYNC/BRK RxCLK CTS RTS DSR DTR Status Bus Status Register Receive Data Buffer Transmit Data Buffer Control Register Control Logic Modem Control Sync Character Register Transmitter (with Transmit Buffer) Receiver (with Receive Buffer)

Data Sheet A18499EJ2V0DS 4 μPD65881GB-P02 1. PIN LAYOUT For a description of pin functions, refer to the μPD71051 Data Sheet (document number: IC-6494) (Japanese version). Pin No. I/O Pin Name Name of Pin on μPD71051 Pin No. I/O Pin Name Name of Pin on μPD71051 1 − NC ← 23 − NC ← 2 − NC ← 24 − NC ←

3 O TXD TxDATA 25 I/O D4 ←

4 I CLK ← 26 I/O D5 ←

5 I RESET ← 27 I/O D6 ←

6 − NC ← 28 − NC ←

7 I DSRB DSR 29 I/O D7 ←

8 O RTSB RTS 30 I TXCLK TxCLK

9 O DTRB DTR 31 I WRB WR

10 − NC ← 32 − NC ← 11 − NC ← 33 − NC ← 12 − NC ← 34 − NC ←

13 I RXCLK RxCLK 35 I CSB CS

14 − VDD ← 36 I CD CD

15 I/O D0 ← 37 I RDB RD

16 I/O D1 ← 38 O RXRDY RxRDY

17 − IC (GND) Note IC 39 − IC (VDD) Note NC

18 I/O D2 ← 40 O TXRDY TxRDY

19 I/O D3 ← 41 I/O SYN_BRK SYNC/BRK

20 I RXD RxDATA 42 I CTSB CTS

21 − GND ← 43 O TXEMP TxEMP 22 − NC ← 44 − NC ← Note This pin is connected to GND or VDD in the chip. To enhance the power supply to handle noise, this pin can be connected to the power supply pin of the board to improve the noise resistance performance.

Data Sheet A18499EJ2V0DS 5 μPD65881GB-P02 2. ELECTRICAL SPECIFICATIONS This section describes only the differences with the μPD71051. For electrical specifications other than those below, refer to the μPD71051 Data Sheet (document number: IC-6494). Absolute Maximum Ratings Parameter Symbol Conditions Ratings Unit Power supply voltage VDD −0.5 to +6.0 V Input voltage VI −0.5 to +6.0 V Output voltage VO −0.5 to +6.0 V Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. In other words, the absolute maximum ratings ar e values at which the product may begin to suffer degradation. The refore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Range This is the same as the μPD71051. This product does not guarantee operation at less than 4.5 V. DC Characteristics (VDD = 5 V±10%, TA = −40 to +85°C) This Product μPD71051 Parameter Symbol Unit Input voltage, high V IH 2.29 V DD 2.2 V DD+0.3 V Input voltage, low V IL 0.00 0.77 −0.5 0.8 V IOH = 0 mA VDD−0.1 Output voltage, high V OH IOH = 3 mA VDD−0.4 IOH = −400 μ A 0.7×VDD V Output voltage, low V OL I OL = 3 mA

0.4 I OL =

2.5 mA 0.4 V Output current, low I OL 3.0 2.5 mA AC Characteristics These are similar to the μPD71051 characteristics, except for the fo llowing restrictions on load capacitance. Operation outside the range of these restrictions is not guaranteed. D7 to D0: 100 pF or less TXDATA, SYNC/BRK, RXRDY, TXEMP, TXRDY: 40 pF or less

Data Sheet A18499EJ2V0DS 6 μPD65881GB-P02 3. CAUTIONS WHEN CONSIDERING ADOPTION OF THIS PRODUCT When considering the adoption of this product, note the following points. (1) Functional check using product samples Before adopting this product, make sure to request product samples from NEC Electronics to check the functions. Product samples are available free of charge. When mounting this product onto different multiple printed circuit boards, ex tensively check the functions by changing the supply voltage to be supplied to the printed circuit boards as well as the temperature conditions for all printed circuit boards. The standard number of product samples is five. W hen requesting product samples, provide the following information to your NEC Electronics sales representative. Your company name, your name, product application, the period of starting adoption, the number of products to be adopted (2) Submitting the Approval Sheet When normal operation has been confi rmed and the adoption has been decided, complete a copy of the Approval Sheet (Appendix of this document) and submit it to NEC Electronics. (3) Shipment inspection Shipment inspection is performed for this product using the μPD71051GB-10-3B4 shipment test pattern. The DC characteristics satisfy the gate array shipment inspection. (4) Order amount Orders from a minimum of 100 units, and in units of 100 are accepted. (5) Package, packing form The dimensions are partia lly different from the μPD71051GB-10-3B4. Refer to the package drawing and confirm that the product can actually be mounted. Dry pack tray packing is used for packing. (6) Price Contact your local NEC Electronics sales representative for pricing information. (7) Obtaining the μPD71051 Data Sheet Note The μPD71051 (original product) Data Sheet is available from the NEC Electronics Web site (http://www.necel.com/) at http://www.necel.com/nes dis/image/IC-6494D.pdf Note Please make this data sheet a standalone document. Do not refer customers to the data sheet for an obsolete device.

Data Sheet A18499EJ2V0DS 7 μPD65881GB-P02 4. PACKAGE DRAWING 44-PIN PLASTIC QFP (10x10) ITEM MILLIMETERS A B D G 13.2 ±0.2 10.0 ±0.2 0.8 (T.P.) 1.0 J 13.2 ±0.2 K S44GB-80-3BS-2 C 10.0 ±0.2 I 0.16 1.6 ±0.2 L 0.8 ±0.2 F 1.0 N P Q S 0.10 2.7 ±0.1 0.125 ±0.075 3.0 MAX. M 0.17 +0.06 −0.05 H 0.37 +0.08 −0.07 R3 °+7° −3° NOTE Each lead centerline is located within 0.16 mm of its true position (T.P.) at maximum material condition. 34 22 1211 SSN J detail of lead end C D A B R K M L P I S Q G F MH 5. RECOMMENDED SOLDERING CONDITIONS These products should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other t han those recommended below, please contact an NEC Electronicssales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Soldering Method Soldering Conditons Recommended Condition Symbol Infrared reflow Package peak temperature: 260°C Time: 60 seconds max. (at 220°C or higher) Count: 3 times or less Exposure limit: 7 days Note (after that, prebake at 125°C for 20 to 72 hours) IR60-207-3 Partial heating Pin temperature: 350°C max. Time: 3 seconds max. (per pin row) Note After opening the dry pack, store it at 25°C or le ss and 65% RH or less for the allowable storage period. Caution Do not use different soldering met hods together (except for partial heating).

Data Sheet A18499EJ2V0DS 8 μPD65881GB-P02 APPENDIX APPROVAL SHEET Copy this page and complete and confirm the required items. If you accept the conditions, sign and submit this sheet to NEC Electronics. Approval Sheet TO: NEC Electronics ( ) We have confirmed through sample evaluations that the device functions as stated in the specifications and agree to use the device in accordance with the boxes checked below in the “Confirmed Items” section. Company : Date (yy/mm/dd): Name: Signature: Department: Title: Applications (Set) Check the boxes below, to indicate confirmation of related matters. Device (Part-Number) μPD65881GB-P01-3BS-A (μPD71054 function compatible) μPD65881GB-P02-3BS-A (μPD71051 function compatible) μPD65881GB-P03-3BS-A (μPD71055 function compatible) Office NEC Electronics Counterpart Name Confirmed Items Confirm the contents below and check the confirmed items. All items must be confirmed and checked. 1. Differences from the original product ( μPD71051/71054/71055) and notes for use of the function-compatible device(s) in the data sheet 2. Proper operation in the actual application environment, using samples 3. Necessity of re-evaluation before using in a new or different board or application set 4. Necessity of using the board with at l east four layers and a stable power supply. Conventionally ignored noise entering chips may be interpreted as being normal signals when the function-equivalent product is employed in a more advanced design process. Additional Information required: Demand/Forecast M/P starting time (yy/mm/dd) Monthly Run-Rate (units) Comment

Data Sheet A18499EJ2V0DS 9 μPD65881GB-P02 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V IL (MAX) and V IH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between V IL (MAX) and VIH (MIN). HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. NOTES FOR CMOS DEVICES

μPD65881GB-P02 The information in this document is current as of December, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific":