RF POWER transistor, LdmoST plastic family N-channel enhancement-mode, lateral MOSFETs

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 21

Technical content

Datasheet sections

  • 1 Electrical data
  • 1.1 Maximum ratings
  • 1.2 Thermal data
  • 2 Electrical characteristics
  • 2.1 Static
  • 2.2 Dynamic
  • 2.3 Moisture sensitivity level
  • 3 Impedances
  • 4 Typical performance
  • 5 Test circuit
  • 6 Common source s-parameter
  • 7 Package mechanical data
  • 8 Revision history

Features

■ Excellent thermal stability ■ Common source configuration ■ POUT = 60 W with 14.3dB gain@ 945 MHz/28 V ■ New RF plastic package

Description

The device is a common source N-channel, enhancement-mode lateral field-effect RF power MOSFET. It is designed for high gain, broad band commercial and industrial applications. It operates at 28 V in common source mode at frequencies up to 1 GHz. The device boasts the excellent gain, linearity and reliability of ST’s latest LDMOS technology mounted in the first true SMD plastic RF power package, PowerSO-10RF . Device’s superior linearity performance makes it an ideal solution for base station applications. The PowerSO-10 plastic package, designed to offer high reliability, is the first ST JEDEC approved, high power SMD package. It has been specially optmized for RF needs and offers excellent RF performances and ease of assembly. Mounting recommendations are available in www.st.com/rf/ (look for application note AN1294). Figure 1. Pin connection Table 1. Device summary

1 Electrical data

1.1 Maximum ratings

1.2 Thermal data

Table 2. Absolute maximum ratings (TCASE = 25°C) Table 3. Thermal data

2 Electrical characteristics

2.1 Static

2.2 Dynamic

2.3 Moisture sensitivity level

Table 4. Static Table 5. Dynamic Table 6. Moisture sensitivity level

3 Impedances

Figure 2. Current conventions Table 7. Impedance data

4 Typical performance

Figure 3. Capacitance vs supply voltage Figure 4. Drain current vs gate source Figure 5. Gate-source voltage vs Figure 6. Output power vs input power

5 Test circuit

Figure 15. Test circuit schematic Note: 1 Dimensions at component symbols are reference for component placement. 3 Dimensions of input and output component from edge of transmission lines.

Table 8. Test circuit component part list

6 Common source s-parameter

Table 9. S-parameter for PD57060S-E (V DS = 28 V IDS = 1.5 A)

Table 10. S-parameter PD57060S-E (V DS = 28 V IDS = 150 mA)

Table 11. S-parameter for PD57060S-E (V DS = 13.5 V IDS = 75 mA)

7 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Figure 18. Package dimensions for PowerSO-10RF formed lead Table 12. PowerSO-10RF formed lead (gull wing) mechanical data

Figure 19. Package dimensions for PowerSO-10RF straight lead Table 13. PowerSO-10RF straight lead mechanical data

Figure 20. Tube information

Figure 21. Reel information

8 Revision history

Table 14. Document revision history 23-Jan-2007 3 Update V GS(Q) in Table 4. 03-Jun-2010 4 Added: Table 6: Moisture sensitivity level.