PD54003L-E STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 13
Technical content
Datasheet sections
- 1 Electrical Data
- 1.1 Maximum Ratings
- 1.2 Thermal Data
- 1.3 Electrical Characteristics
- 2 Typical Performance
- 2.1 Typical Performance (Broadband)
- 3 Package Mechanical Data
- 4 Revision History
Features
■ EXCELLENT THERMAL STABILITY ■ COMMON SOURCE CONFIGURATION ■ POUT = 3W WITH 20 dB GAIN @ 500MHz ■ NEW RF PLASTIC PACKAGE ■ EDS PROTECTION ■ SUPPLIED IN TAPE & REEL OF 3K UNITS ■ IN COMPLIANCE WITH THE 2002/93/EC EUROPEAN DIRECTIVE
Description
The PD54003L-E is a common source N-Channel, enhancement-mode lateral Field- Effect RF power transistor. It is designed for high gain, broad band commercial and industrial applications. It operates at 7 V in common source mode at frequencies of up to 1 GHz. PD54003L-E boasts the excellent gain, linearity and reliability of STH1LV latest LDMOS technology mounted in the innovative leadless SMD plastic package, PowerFLAT™. PD54003L-E’s superior linearity performance makes it an ideal solution for portable radio. PowerFLAT™ (5x5) Pin Connection TOP VIEW Order Codes Part Number Marking Package Packaging PD54003L-E 54003 PowerFLAT (5x5) T ape & Reel
1 Electrical Data
1.1 Maximum Ratings
Table 1. Absolute Maximum Ratings
1.2 Thermal Data
Table 2. Thermal data
1 Electrical Data PD54003L-E
1.3 Electrical Characteristics
Table 3. Static Table 4. Dynamic Table 5. ESD Protection Characteristics Table 6. Moisture Sensitivy Level
2 Typical Performance
Figure 1. Capacitance vs. Supply Voltage Figure 2. Output Power vs. Input Power Figure 3. Power Gain vs. Output Power Figure 4. Efficiency vs Output Power Figure 5. Output Power vs Bias Current
2 Typical Performance PD54003L-E
Figure 6. Efficiency vs Bias Current Figure 7. Output Power vs Supply Voltage Figure 8. Output Power vs Gate-Source Volt
2.1 Typical Performance (Broadband)
Figure 9. Power Gain vs Frequency Figure 10. Efficiency vs Frequency Figure 11. Return Loss vs Frequency
3 Package Mechanical Data PD54003L-E
3 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
Table 7. PowerFLAT™ Mechanical Data Figure 12. PowerFLAT™ Package Dimensions
Table 8. PowerFLAT™ Tape & Reel Dimensions Figure 13. PowerFLAT™ Tape & Reel
Table 9. Recommended FOOTPRINT
4 Revision History PD54003L-E
4 Revision History
Date Revision Description of Changes 04-Jan-2006 1 First Issue.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicati on are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectro nics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America