PD1201 LITTELFUSE | Alldatasheet
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Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Load Current up to 1Arms Blocking Voltages up to 400VP 3750Vrms Input to Output Isolation 5mA Sensitivity Zero-Crossing Detection DC Control, AC Output Optically Isolated Low EMI and RFI Generation High Noise Immunity VDE compatible The PD1201 is an AC Solid State Switch using optical coupling with dual power SCR outputs to produce an alternative to optocoupler and Triac circuits. The PD1201 switches are robust enough to provide a blocking voltage of up to 400V P and max surge current rating of 20A. In addition, tightly controlled zero-cross circuitry ensures switching of AC loads without the generation of transients. The input and output circuits are optically coupled to provide 3750V rms of isolation and noise immunity between control and load circuits. As a result the PD1201 is well suited for industrial environments where electromagnetic interference would disrupt the operation of electromechanical relays. Approvals UL Recognized Component: UL 508 File E69938 CSA Certified Component: File 043639 161 + LED AC Load - LED AC Load ZC
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R16 PD1201 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Absolute Maximum Ratings @ 25ºC Parameter Min Max Units Blocking Voltage - 400 V P Reverse Input Voltage - 5 V Input Control Current - 100 mA Peak (10ms) - 1 A Input Power Dissipation 1 - 150 mW T otal Package Dissipation 2 - 1600 mW Isolation Voltage, Input to Output 3750 - V rms Operational T emperature -40 +85 ºC Storage T emperature -40 +125 ºC 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 16.6 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics AC Operating Voltage I F=5mA V OP 20 - 120 V rms Load Current (Continuous) V L=120-240VAC I L 0.005 - 1 A rms Maximum Surge Current t<16ms I PEAK - - 20 A Off-State Leakage Current V L=400VDC ILEAK --1 m A On-State Voltage Drop I L=1.0Arms - - - 1.2 V rms Critical Rate of Rise - dV/dt 1000 1200 - V/µs Switching Speeds T urn-On I F=5mA ton - - 0.5 Cycles T urn-Off t off - - 0.5 Zero-Cross T urn-On Voltage 1 1st half-cycle - -25 V Subsequent half-cycle - - 1 V Operating Frequency - - 20 - 500 Hz Load Power Factor for Guaranteed T urn-On 2 - PF 0.25 - - - Capacitance Input-T o-Output V IO=0V , f=1MHz C IO -3 - p F Input Characteristics Input Control Current For Normal Environment - IF --5 mA For High Noise Environment - - - 10 Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Input Dropout Voltage - - 0.8 - - V Reverse Input Current V R=5V I R - - 10 µA 1 Zero Cross 1st half-cycle @ < 100Hz. 2 Snubber circuits may be required at low power factors. Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION PD1201 www.ixysic.com 3R16 -40 1.2 1.0 0.8 0.6 0.4 0.2 05 58 5 Ambient Temperature (ºC) Load Current, Free Air RTJA=60ºC/W Load Current (Arms) 20 16 50 100 Max. Surge Current (Non-Repetitive) Pulse Duration (ms) Peak Surge Current (A) NOTE: Values apply to TJ=50ºC before Surge 1.3 1.2 1.1 1.0 10 25 40 55 70 85
0.9 Forward Voltage (V)
Ambient Temperature (ºC) Typical Forward Voltage vs. Temperature Critical Rate of Rise (V/µs) 800 600 400 200 1200 1000 25 50 85 1400 Ambient Temperature (ºC) Typical dV/dt vs. Temperature Vo 63% 10% RC dV/dt Method In accordance with EIA/NARM Standards RS-443 for Solid State Relays Vo = 300V dV dt 0.63 x 300V RC RC 189== PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R16 PD1201 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation PD1201 MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles PD1201 245ºC 30 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION Specification: DS-PD1201-R16 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/2025 For additional information please visit our website at: www.ixysic.com PD1201 IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Dimensions mm (inches) PCB Hole Pattern7.620 ± 0.254 (0.300 ± 0.010) 9.144 ± 0.508 (0.360 ± 0.020)
0.254 TYP
(0.010 TYP)
7.239 TYP
(0.285 TYP) 6.350 ± 0.127 (0.250 ± 0.005) 19.202 ± 0.381 (0.756 ± 0.015) 17.780 ± 0.127 (0.700 ± 0.005) 15.240 ± 0.127 (0.600 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.127 (0.100 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002)
4.064 TYP
(0.160 TYP) Pin 1 Pin 16 0.559 ± 0.102 (0.022 ± 0.004) Pin 1 Pin 16 17.780 (0.700) 15.240 (0.600) 7.620 (0.300)
0.800 DIA x 4
(0.031 DIA x 4) PD1201 Mechanical Dimensions