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Technical content
Features
- 1008 EIA Size
- Molded Construction
- Expanded Solderability Characteristics Electrical Inductance range: 0.24 to 2.2uH Tolerance: 20% Test Frequency: 2MHz, 0.2v Operating Temp: -40ºC to +125ºC will drop by no more than 30º% of its initial value without current. Pre heat: 150ºC. 1minute Solder composition: Sn/Ag3/Cu0.5 Solder temp: 260ºC±5ºC Immersion time: 10 sec ± 1 sec. Resistance to solder heat: 10/08/2015 reel. Isat: The current at which the inductance (L): Agilent E4991A/HP4287A+16197A DCR: Chen Hwa 502BC Isat: Aligent E4980A+HP42841A Test Equipment: 5.5(6.5) Irms(A) Max (Typ) 2, 0.2v Test Freq. (MHz) Irms: Aligent 6641 Terminal Electrode Core .099±.011 (2.5±0.03) .079±.011 (2.0±0.03) .023±.008 (0.6±0.2) .04 (1.0)
- High Current Capacity Irms: The current at which the Temp will will Rise by 40ºC from its Ambient Temp without current No Damage with more than 75% coverage inductance within 20% of initial value. Marking: None 2, 0.2v Inductance vs. DC Current 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0 1 2 345 6 7 8 9 10 DC Curren t(A) L(uH) R47 2R2 1R5 1R0 R68 R33 R24 Temperature Change vs. DC Current 01234567 8 DC Curren t(A) ΔT(℃) 1R5 1R0 R68 R47 R33 R24 2R2 .110 2.8 .047 1.2 .078 2.0 Recommended Land Pattern: