CSDM65295 TI | Alldatasheet
Document overview
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Technical content
CSDM65295x Dual-Phase Buck Smart Power Stage Module
1 Features
- Topside-cooled 9 mm x 10 mm x 5 mm LGA package, industry common footprint
- Integrated inductor
- High output current capability: – Peak current: 180A – Continuous current: 130A RMS – (Subject to thermal boundary condition)
- Operating VIN input voltage: 4.5V to 16V
- Operating VDD Bias: 4.5V to 5.5V
- High-frequency operation (up to 2MHz)
- Integrated clamping circuitry for avalanche free operation
- Temperature compensated bi-directional current sense with current mode reporting (5μA/A)
- Body braking mode (BB)
- Forced continuous conduction mode (FCCM) operation
- Green, RoHS compliant without exemption, and completely Pb free
- Fault detection – High-side short (HSS)
- Fault protection – Over temperature (OT) – Cycle-by-cycle negative over current limiting (NOC) – Over current protection (OCP) – BOOT UVLO
2 Applications
- Data center and enterprise computing rack server
- Hardware accelerator
- Network interface card (NIC)
- ASIC and high performance client
- ASIC power for networking and communications
- High phase count buck regulator solutions
3 Description
The CSDM65295x family of devices are 2-phase smart power stage modules with high peak current capability. The device family is highly optimized design for use in high-power, high-density synchronous buck converter applications. This product family integrates the driver IC and power MOSFETs into one Pb-free monolithic design to complete the power stage switching function. There are VIN and VDD bypass capacitors integrated into the package for minimum loop inductance and improved ringing. This combination produces high-current, high- efficiency, and high-speed switching capability in a small industry standard 9mm × 10mm × 5 mm footprint. CSDM65295x integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. This power stage module also includes cycle-by-cycle current limiting, over temperature and short circuit protection, and is designed to be compatible with TPS537xx series controllers.
Package Information
PART NUMBER INTEGRATED INDUCTOR PACKAGE SIZE(1) CSDM65295 Traditional inductor (VR) LGA 9mm × 10mm x 5 mmCSDM65295T Coupled inductor (TLVR) (1) The package size (length x width x height) is a nominal value and includes pins, where applicable. CSDM65295x VOUT_A VOUT_B V O U T PWM_A PWM_B IOUT_A IOUT_B TAO PGND PVIN +12V To Multiphase Controller 180° phase shift Simplified Application Diagram CSDM65295, CSDM65295T SLVSK71 – FEBRUARY 2026 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
4 Device and Documentation Support
4.1 Device Support
4.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
4.2 Documentation Support
4.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
4.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
4.5 Trademarks
TI E2E™ are trademarks of Texas Instruments. All trademarks are the property of their respective owners.
4.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES February 2026 * Initial Release CSDM65295, CSDM65295T SLVSK71 – FEBRUARY 2026 www.ti.com
2 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated
Product Folder Links: CSDM65295 CSDM65295T
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com CSDM65295, CSDM65295T SLVSK71 – FEBRUARY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: CSDM65295 CSDM65295T
www.ti.com 21-Feb-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) PCSDM65295TVCQ Preview Preproduction QFN-FCMOD (VCQ) | 72 2500 | LARGE T&R - Call TI Call TI -40 to 125 PCSDM65295VCQ Preview Preproduction QFN-FCMOD (VCQ) | 72 2500 | LARGE T&R - Call TI Call TI -40 to 125 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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