PCS3P2191A_1 PULSECORE | Alldatasheet
Document overview
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- PDF pages: 8
Technical content
Features
- Generates four 4X low EMI spread spectrum clocks
- Input frequency: 15MHz
- Output frequency: 60MHz
- Internal loop filter minimizes external components and board space
- Selectable Centre Spread frequency deviation:
- 3.3V ± 0.3V Operating Voltage
- Commercial and Industrial temperature range
- 16-pin TSSOP Package
- Advanced low power CMOS process Product Description PCS3P2191A is a versatile spread spectrum frequency modulator that generates four low EMI 4x clocks at the output. PCS3P2191A offers seven selectable centre spread options of ±0.5% to ±2.0%, and a no spread option. (Refer Spread Deviation Selection Table). PCS3P2191A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The PCS3P2191A allows significant system co st savings by reducing the number of circuit board layers, ferrite beads, and shielding that are traditionally required to pass EMI regulations. The PCS3P2191A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method. The Device is available in 16 Pin TSSOP package, in Commercial and Industrial temperature range. Application PCS3P2191A is targetted for LCD panel application Block Diagram ModOUT CLKIN / XIN GND Frequency Divider Feedback Divider Modulation Phase Detector Loop Filter VCO Output Divider PLL VDD XOUT Crystal Oscillator S2 S0 S1
rev 0.2 Spread Spectrum Clock Generator 2 of 8 Notice: The information in this document is subject to change without notice. Pin Configuration Pin Description Pin# Pin Name Type Description 1 V DD power Power Supply Voltage Pin. Connect to +3.3V. 2 GND power Ground Connection. Connect to system ground. 3 S2 Input Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Table). This pin has an internal pull-up resistor. 4 GND power Ground Connection. Connect to system ground. 5 CLK1 Output Low EMI 4x clock output. 6 CLK2 Output Low EMI 4x clock output. 7 GND power Ground Connection. Connect to system ground. 8 XIN/CLKIN Input Crystal connection or external reference frequency input. It can be connected to a 15MHz fundamental mode crystal. 9 XOUT Output Crystal connection. If using an external reference, this pin must be left unconnected. 10 GND power Ground Connection. Connect to system ground. 11 CLK3 Output Low EMI 4x clock output. 12 CLK4 Output Low EMI 4x clock output. 13 GND power Ground Connection. Connect to system ground. 14 S1 Output Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Table). This pin has an internal pull-up resistor. 15 S0 Output Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Table). This pin has an internal pull-up resistor. 16 V DD power Power Supply Voltage Pin. Connect to +3.3V. VDD CLK3 GND GND CLK4 XOUT XIN/CLKIN GND CLK2 CLK1 GND VDD GND PCS3P2191A 8 9 16Pin TSSOP
rev 0.2 Spread Spectrum Clock Generator 3 of 8 Notice: The information in this document is subject to change without notice. Spread Deviation Selection Table S2 S1 S0 Deviation 0 0 0 OFF 0 0 1 ± 0.5% 0 1 0 ± 0.75% 0 1 1 ± 1.0% 1 0 0 ± 1.25% 1 0 1 ± 1.5% 1 1 0 ± 1.75% 1 1 1 ± 2.0% Absolute Maximum Ratings Symbol Parameter Rating Unit VDD Supply Voltage pin with respect to Ground -0.5 to +4.6 V VIN Input Voltage pin with respec t to Ground VSS-0.5 to VDD+0.5 V VOUT Output Voltage pin with respect to Ground VSS-0.5 to VDD+0.5 V TSTG Storage temperature -55 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage(As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Recommended Operating Conditions Parameter Description Min Typ Max Unit VDD Operating Volt age 3.0 3.3 3.6 V TA Operating Temperature -40 +85 °C CL Load Capacitance 15 pF CIN Input Capacitance 5 pF
rev 0.2 Spread Spectrum Clock Generator 4 of 8 Notice: The information in this document is subject to change without notice. Symbol Parameter Min Typ Max Unit VIL Input low voltage VSS – 0.3 0.8 V VIH Input high voltage 2.0 VDD+ 0.3 V IIL Input low current -35 IIH Input high current (XIN / CLKIN) +35 µA IIL Input low current -50 IIH Input high current (S0:S1:S2) +50 µA IXOL X OUT output low current ( VXOL @ 0.4V, VDD = 3.3V) 3 mA IXOH X OUT output high current ( VXOH @ 2.5V, VDD = 3.3V) 3 mA VOL Output low voltage I OL = 12mA VSS 0.4 V VOH Output high voltage I OH = -12mA 2.4 V DD V ICC Dynamic supply current , 60 MHz Output, no load 15 mA IDD Static supply current standby mode* 8 mA VDD Operating volta ge 3.0 3.3 3.6 V tON Power up time (first locked clo ck cycle after power up)** 5 mS ZOUT Clock output impedance 27 Ω CIN Input Capacitance 5 pF CL Load Capacitance 15 pF *CLKIN pulled Low **VDD and CLKIN inputs are stable Symbol Parameter Min Typ Max Unit XIN/ CLKIN Input fr equency 15 MHz CLKOUT Output frequency (Pin 5,6,11,12) 60 MHz FMOD Spread Spectrum Modulation Rate 39 KHz tLH* Output rise time ( Measured from 20% to 80% ) 1.5 nS tHL* Output fall time ( Measured from 80% to 20% ) 1.0 nS Output frequency Synthesis error 0 ppm tJC* Cycle to Cycle Jitter 275 pS tD* Output duty cycle 45 50 55 % *tLH and tHL are measured with a capacitive load of 15pF
rev 0.2 Spread Spectrum Clock Generator 5 of 8 Notice: The information in this document is subject to change without notice. Typical Crystal Oscillator Circuit Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 15MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -45°C to +90°C Load capacitance 18pF Shunt capacitance 7pF maximum ESR 25 Ω R1 = 510Ω C1 C2 Crystal
rev 0.2 Spread Spectrum Clock Generator 6 of 8 Notice: The information in this document is subject to change without notice.
Package Information
16-lead Thin Shrunk Small Outline Package (4.40-MM Body) D E H D A Be θ L CA2 PIN 1 ID 9 16 Seating Plane Dimensions Inches Millimeters Symbol Min Max Min Max A 0.043 1.20 A1 0.002 0.006 0.05 0.15 A2 0.031 0.041 0.80 1.05 B 0.007 0.012 0.19 0.30 C 0.004 0.008 0.09 0.20 D 0.193 0.201 4.90 5.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.030 0.50 0.75 θ 0° 8° 0° 8°
rev 0.2 Spread Spectrum Clock Generator 7 of 8 Notice: The information in this document is subject to change without notice. Ordering Codes Part Number Marking Package Type Temperature PCS3P2191AG-16TT 3P2191AG 16-Pin TSSOP, TUBE, Green Commercial PCS3P2191AG-16TR 3P2191AG 16-Pin TSSOP, TAPE & REEL, Green Commercial PCS3P2191AF-16TT 3P2191AF 16-Pin TSSOP, TUBE, Pb Free Commercial PCS3P2191AF-16TR 3P2191AF 16-Pin TSSOP, TAPE & REEL, Pb Free Commercial PCS3I2191AG-16TT 3I2191AG 16-Pin TSSOP, TUBE, Green Industrial PCS3I2191AG-16TR 3I2191AG 16-Pin TSSOP, TAPE & REEL, Green Industrial PCS3I2191AF-16TT 3I2191AF 16-Pin T SSOP, TUBE, Pb Free Industrial PCS3I2191AF-16TR 3I2191AF 16-Pin TSSOP, TAPE & REEL, Pb Free Industrial Device Ordering Information PCS3P2191AG-16TR Licensed under U.S Patent Nos 5,488,627 and 5,631,921 O = TSOT23 U = MSOP J=TSOT26 S = SOIC E = TQFP T = TSSOP L = LQFP A = SSOP U = MSOP V = TVSOP P = PDIP B = BGA D = QSOP Q = QFN X = SC-70 DEVICE PIN COUNT X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 6 = Power Management 2 = Non PLL based 7 = Power Management 3 = EMI Reduction 8 = Power Management 4 = DDR support products 9 = Hi Performance 5 = STD Zero Dela y Buffer 0 = Reserved PulseCore Semiconductor Mixed Signal Product PART NUMBER G = GREEN PACKAGE, LEAD FREE, and RoHS R = Tape & Reel, T = Tube or Tray
rev 0.2 Spread Spectrum Clock Generator 8 of 8 Notice: The information in this document is subject to change without notice. Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All ot her brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors t hat may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product descri bed herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not in tended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the app lication or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, mercha ntability, or infringement of any intellec tual property rights, except as express agreed to in PulseCore’ s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusiv ely according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellect ual property rights of PulseCore or third partie s. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseC ore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: PCS3P2191A Document Version: v0.2