PCS2P2309NZ PULSECORE | Alldatasheet
Document overview
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Technical content
Features
One-input to Nine-Output Buffer/Driver Supports two DIMMs or four SO-DIMMs with one additional output for feedback to an external or chipset PLL Low power consumption for mobile applications Less than 32mA at 66.6MHz with unloaded outputs 1nS Input-Output delay Buffers all frequencies from DC to 133.33MHz Output-output skew less than 250pS Multiple V DD and VSS pins for noise and electromagnetic interference (EMI) reduction Space-saving 16 pin 150 mil SOIC Package 3.3V operation Commercial and Industrial temperature parts are available Functional Description The PCS2P2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. The part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The device operates at 3.3V and outputs can run up to 133.33MHz. The PCS2P2309NZ is designed for low EMI and power optimization. It has multiple V SS and V DD pins for noise optimization and consumes less than 32mA at 66.6MHz, making it ideal for the low-power requirements of mobile systems. It is available in an ultra-compact 150 mil 16 pin Block Diagram BUF_IN OUTPUT1 OUTPUT2 OUTPUT3 OUTPUT4 OUTPUT5 OUTPUT6 OUTPUT7 OUTPUT8 OUTPUT9
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 2 of 9 Notice: The information in this document is subject to change without notice. Pin Configuration Pin Description Pin Signal Description 4, 8, 13 V DD 3.3V Digital Voltage Supply 5, 9, 12 GND Ground
1 BUF_IN Input Clock
2, 3, 6, 7, 10, 11, 14, 15, 16 OUTPUT [1:9] Outputs 9VDD OUTPUT2 VDD OUTPUT7 OUTPUT8 OUTPUT5 OUTPUT6 VDD OUTPUT9 GNDGND PCS2P2309NZ OUTPUT3 OUTPUT4 GND OUTPUT1 BUF_IN 1
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 3 of 9 Notice: The information in this document is subject to change without notice. Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V TSTG Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Parameter Description Min Max Unit VDD Supply Voltage 3.0 3.6 V (Ambient Operating Temperature), Commercial 0 70 °C TA (Ambient Operating Temperature), Industrial -40 85 °C Load Capacitance, Fout < 100MHz - 30 pF CL Load Capacitance,100MHz < Fout < 133.33MHz - 15 pF CIN Input Capacitance - 7 pF BUF_IN, OUTPUT [1:9] Operating Frequency DC 133.33 MHz tPU Power-up time for all VDD's to reach minimum specified voltage (power ramps must be monotonic) 0.05 50 mS
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 4 of 9 Notice: The information in this document is subject to change without notice. Electrical Characteristics for Commercial and Industrial Temperature Devices Parameter Description Test Conditions Min Max Unit VIL Input LOW Voltage 1 - 0.8 V VIH Input HIGH Voltage 1 2.0 - V IIL Input LOW Current V IN = 0V - 50.0 µA IIH Input HIGH Current V IN= VDD - 100.0 µA VOL Output LOW Voltage 2 I OL= 8 mA - 0.4 V VOH Output HIGH Voltage 2 I OH = -8 mA 2.4 - V IDD Supply Current Unloaded outputs at 66.66MHz - 32 mA Switching Characteristics for Commercial and Industrial Temperature Devices3 Parameter Name Description Min Typ Max Unit tD Duty Cycle 2= t2 ÷t1 Measured at 1.4V 40.0 50.0 60.0 % t3 Rise Time 2 Measured between 0.8V and 2.0V - - 1.50 nS t4 Fall Time 2 Measured between 0.8V and 2.0V - - 1.50 nS t5 Output to Output Skew 2 All outputs equally loaded - - 250 pS Propagation Delay, BUF_IN Rising Edge to OUTPUT Rising Edge2 Measured at VDD/2 1 5 9.2 nS Note: 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 3. All parameters specified with loaded outputs.
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 5 of 9 Notice: The information in this document is subject to change without notice. Switching Waveforms Duty Cycle Timing All Outputs Rise/Fall Time Output-Output Skew Input-Output Propagation Delay
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 6 of 9 Notice: The information in this document is subject to change without notice. Test Circuits VDD GND CLKOUT LOAD OUTPUT TEST CIRCUIT 0.1uF +3.3V 0.1uF +3.3V VDD
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 7 of 9 Notice: The information in this document is subject to change without notice.
Package Information
16-lead (150 Mil) Molded SOIC E H A D e B θ L C h Seating Plane D0.004 PI N 1 ID18 91 6 Dimensions Inches Millimeters Symbol Min Max Min Max A 0.053 0.069 1.35 1.75 A1 0.004 0.010 0.10 0.25 A2 0.049 0.059 1.25 1.50 B 0.013 0.022 0.33 0.53 C 0.008 0.012 0.19 0.27 D 0.386 0.394 9.80 10.01 E 0.150 0.157 3.80 4.00 e 0.050 BSC 1.27 BSC H 0.228 0.244 5.80 6.20 h 0.010 0.016 0.25 0.41 L 0.016 0.035 0.40 0.89 θ 0° 8° 0° 8°
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 8 of 9 Notice: The information in this document is subject to change without notice. Ordering Codes Part Number Marking Package Type Temperature PCS2P2309NZF-16-ST 2P2309NZF 16-pin 150-mil SOIC, Pb Free Commercial PCS2P2309NZF-16-SR 2P2309NZF 16-pin 150-mil SOIC, Tape and Reel, Pb Free Commercial PCS2I2309NZF-16-ST 2I2309NZF 16-pin 150-mil SOIC, Pb Free Industrial PCS2I2309NZF-16-SR 2I2309NZF 16-pin 150-mil SOIC, Tape and Reel, Pb Free Industrial PCS2P2309NZG-16-ST 2P2309NZG 16-pin 150-mil SOIC, Green Commercial PCS2P2309NZG-16-SR 2P2309NZG 16-pin 150-mil SOIC, Tape and Reel, Green Commercial PCS2I2309NZG-16-ST 2I2309NZG 16-pin 150-mil SOIC, Green Industrial PCS2I2309NZG-16-SR 2I2309NZG 16-pin 15 0-mil SOIC ,Tape and Reel, Green Industrial Device Ordering Information PCS2P2309NZ F-16-SR Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. O = SOT U = MSOP S = SOIC E = TQFP T = TSSOP L = LQFP A = SSOP U = MSOP V = TVSOP P = PDIP B = BGA D = QSOP Q = QFN X = SC-70 DEVICE PIN COUNT X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 6 = Power Management 2 = Non PLL based 7 = Power Management 3 = EMI Reduction 8 = Power Management 4 = DDR support products 9 = Hi Performance 5 = STD Zero Delay Buffer 0 = Reserved PulseCore Semiconductor Mixed Signal Product PART NUMBER F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS R = Tape & Reel, T = Tube or Tray
September 2006 PCS2P2309NZ rev 0.3 Nine Output 3.3V Buffer 9 of 9 Notice: The information in this document is subject to change without notice. © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All ot her brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors t hat may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product descri bed herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not in tended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the app lication or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, mercha ntability, or infringement of any intellec tual property rights, except as express agreed to in PulseCore’ s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusiv ely according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellect ual property rights of PulseCore or third partie s. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseC ore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: PCS2P2309NZ Document Version: 0.3 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003