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Document overview
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- PDF pages: 6
Technical content
Features
- One−Input to Nine−Output Buffer/Driver
- Buffers all Frequencies from DC to 133.33 MHz
- Low Power Consumption for Mobile Applications Less than 32 mA at 66.6 MHz with Unloaded Outputs
- Input−Output Delay: 6 nS (max)
- Output−Output Skew Less than 250 pS
- 16−pin SOIC Package
- Supply V oltage: 3.3 V ± 0.3 V
- These Devices are Pb−Free and are RoHS Compliant BUF_IN OUTPUT1 OUTPUT2 OUTPUT3 OUTPUT4 OUTPUT5 OUTPUT6 OUTPUT7 OUTPUT8 OUTPUT9
Figure 1. Block Diagram dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
SOIC−16 CASE 751B−05 2I2309NZ= Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb −Free Package 2I2309NZ AWLYWWG MARKING DIAGRAM
Figure 2. Pin Configuration Table 1. PIN DESCRIPTION
1 BUF_IN Input Clock
Table 2. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected. Table 3. OPERATING CONDITIONS
Table 4. ELECTRICAL CHARACTERISTICS performance may not be indicated by the Electrical Characteristics if operated under different conditions.
- BUF_IN input has a threshold voltage of V
- Parameter is guaranteed by design and characterization. It is not tested in production.
Table 5. SWITCHING CHARACTERISTICS (Note 3)
- All parameters specified with loaded outputs.
- Parameter is guaranteed by design and characterization. It is not tested in production.
Figure 3. Duty Cycle Timing Figure 4. All Outputs Rise/Fall Time
2 V VDD
Figure 5. Output−Output Skew Figure 6. Input−Output Propagation Delay Figure 7. Test Circuit
Table 6. ORDERING INFORMATION
http://onsemi.com PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 16 9 SEATING PLANE F JM R X 45/C0095 G
8 PLP−B−
−A− M0.25 (0.010) B S −T− D K C 16 PL SBM0.25 (0.010) A ST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 6.40 16X 0.58 16X 1.12 1.27 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidia ries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 PCS2I2309NZ/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative