PCI6620_09 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLLA246,*1][M]
- PDF pages: 6
Technical content
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DESCRIPTION
8.0 compliant Intel 82365SL-DF register compatible PCI Bus Power Management Interface Specification 1.1 compliant Supports ring indicate, SUSPEND and PCI CCLKRUN protocol and PCI bus Lock LOCK Advanced Configuration and Power Interface (ACPI) Specification 2.0 compliant Provides VGA/palette memory and I/O, and subtractive decoding options, LED activity PCI Local Bus Specification Revision 2.3 terminals compliant Power-down
applications
include: Compliant with the PCI Bus Interface automatic device power down during Specification for PCI-to-CardBus Bridges suspend, and ultralow-power sleep mode 1.8-V core logic and 3.3-V I/O cells with Physical write posting of up to three internal voltage regulator to generate 1.8-V outstanding transactions core V CC PCI burst transfers and deep FIFOs to Universal PCI interfaces compatible with tolerate large host latency 3.3-V and 5-V PCI signaling environments External cycle timer control for customized Supports PC Card or CardBus with hot synchronization insertion and removal Extended resume signaling for compatibility Supports 132-MBps burst transfers to with legacy DV components maximize data throughput on both the PCI PCI power-management D0, D1, D2, and bus and the CardBus power states Supports serialized IRQ with PCI interrupts Advanced submicron, low-power CMOS Programmable multifunction terminals technology Serial ROM interface for loading subsystem ID and subsystem vendor ID The Texas Instruments PCI6620 device is an integrated dual-socket PC Card controller, Smart Card controller, and Secure Digital (SD)/MultiMediaCard (MMC), and Memory Stick (MS)/MS-Pro controller. This high-performance integrated solution provides the latest in PC Card, Smart Card, SD, MMC, and Memory Stick technology. The Texas Instruments PCI6420 device is an integrated dual-socket PC Card controller and SD/MMC MS/MS-Pro controller. This high-performance integrated solution provides the latest in PC Card, SD, MMC, and Memory Stick technology. For the remainder of this document, PCI6x20 refers to both devices: PCI6620 and PCI6420. The PCI6620 and PCI6420 are three-function PCI devices compliant with PCI Local Bus Specification, Revision 2.3. Functions and provide the independent PC Card socket controllers compliant with the PC Card Standard (Release 8.0). The PCI6x20 device provides bus, PC Cards, and Smart Cards and supports any combination of 16-bit, CardBus PC Cards, or Smart Card adapter in the socket powered at V or 3.3 as required. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com PCI6620/PCI6420 SLLA246 JULY 2006 There are no PCMCIA card and socket service software changes required to move systems from the existing CardBus socket controller to the PCI6x20 device. The PCI6x20 device is register compatible with the Intel 82365SL-DF ExCA controller and implements the host interface defined in the PC Card Standard The PCI6x20 internal data path logic allows the host to access 8-, 16-, and 32-bit cards using full 32-bit PCI cycles for maximum performance. Independent buffering and the pipeline architecture provide an unsurpassed performance level with sustained bursting. The PCI6x20 device can be programmed to accept posted writes to improve bus utilization. All card signals are internally buffered to allow hot insertion and removal without external buffering. The PCI configuration header is accessed through configuration cycles specified by PCI, and it provides plug-and-play (PnP) compatibility. Furthermore, the PCI6x20 device is compliant with the PCI Bus Power Management Interface Specification The PCI6x20 device supports the D0, D1, D2, and power states. The PCI6x20 design provides PCI bus master bursting, and is capable of transferring a cacheline of data at 132M bytes/s after connection to the memory controller. Because PCI latency can be large, deep FIFOs are provided to buffer the data. The PCI6x20 device provides physical write posting buffers and a highly-tuned physical data path for SBP-2 performance. The PCI6x20 device also provides multiple isochronous contexts, multiple cacheline burst transfers, advanced internal arbitration, and bus-holding buffers. Function of the PCI6620 and PCI6420 devices is a dedicated socket that supports SD, MMC, Memory Stick, and Memory Stick-Pro cards. The Flash Media dedicated socket provides separate terminals for SD/MMC and Memory Stick signals so that both an SD/MMC card and a Memory Stick/Memory Stick-Pro card can be used concurrently. Various implementation specific functions and general-purpose inputs and outputs are provided through eight multifunction terminals. These terminals present a system with options in PCI LOCK serial and parallel interrupts, PC Card activity indicator LEDs, and other platform specific signals. PCI-compliant general-purpose events may be programmed and controlled through the multifunction terminals, and an ACPI-compliant programming interface is included for the general-purpose inputs and outputs. The PCI6x20 device is compliant with the latest PCI Bus Power Management Specification and provides several low-power modes, which enable the host power system to further reduce power consumption. The PCI6x20 device also has a three-pin serial interface compatible with both the Texas Instruments TPS2226 and TPS2228 power switches. The TPS2226 or TPS2228 power switch provides power to the two CardBus sockets on the PCI6x20 device. The power to each dedicated socket is controlled through separate power control terminals. Each of these power control pins can be connected to an external 3.3-V power switch. NOTE: This product is for high-volume PC only. For a complete datasheet or more information contact support@ti.com. Submit Documentation Feedback
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) PCI6620GHK OBSOLETE BGA MI CROSTA R GHK 288 TBD Call TI Call TI PCI6620ZHK OBSOLETE BGA MI CROSTA R ZHK 288 TBD Call TI Call TI (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 6-Jan-2009 Addendum-Page 1
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