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(Mobile Triton II) chipset Up to five general-purpose I/Os A 208-pin Low-Profile QFP (PDV), 209-terminal MicroStar BGA package Programmable output select for CLKRUN (GHK), or the 209-terminal lead-free (Pb, Multifunction PCI device with separate atomic number 82) MicroStar BGA package configuration space for each socket (ZHK). Five PCI memory windows and two I/O 3.3-V core logic with universal PCI interfaces windows available for each socket compatible with 3.3-V and 5-V PCI signaling Two I/O windows and two memory windows environments available to each CardBus socket Mix-and-match 5-V/3.3-V 16-bit PC Cards and Exchangeable Card Architecture (ExCA) 3.3-V CardBus Cards compatible registers are mapped in memory Two PC Card or CardBus slots with hot and I/O space insertion and removal Intel 82365SL-DF and 82365SL register Uses serial interface to TI TPS2206/2216 compatible dual-slot PC Card power switch Distributed DMA (DDMA) and PC/PCI DMA Burst transfers to maximize data throughput 16-Bit DMA on both PC Card sockets with CardBus Cards Ring indicate, SUSPEND PCI CLKRUN and Parallel PCI interrupts, parallel ISA IRQ and CardBus CCLKRUN parallel PCI interrupts, serial ISA IRQ with Socket activity LED pins parallel PCI interrupts, and serial ISA IRQ and PCI Bus Lock LOCK PCI interrupts Advanced Submicron, Low-Power CMOS Serial EEPROM interface for loading Technology subsystem ID and subsystem vendor ID Internal Ring Oscillator The TI PCI1420, the industry s first 208-pin controller to meet the PCI Bus Power Management Interface Specification for PCI to CardBus Bridges is a high-performance PCI-to-CardBus controller that supports two independent card sockets compliant with the 1997 PC Card Standard The PCI1420 provides computers. The 1997 PC Card Standard retains the 16-bit PC Card specification defined in PCI Local Bus Specification and defines the new 32-bit PC Card, CardBus, capable of full 32-bit data transfers at MHz. The PCI1420 supports any combination of 16-bit and CardBus PC Cards in the two sockets, powered at V or 3.3 as required. The PCI1420 is compliant with the PCI Local Bus Specification and its PCI interface can act as either a PCI master device or a PCI slave device. The PCI bus mastering is initiated during 16-bit PC Card DMA transfers or CardBus PC Card bridging transactions. The PCI1420 is also compliant with the latest PCI Bus Power Management Interface Specification All card signals are internally buffered to allow hot insertion and removal without external buffering. The PCI1420 is register compatible with the Intel 82365SL-DF and 82365SL ExCA controllers. The PCI1420 internal data path logic allows the host to access 8-, 16-, and 32-bit cards using full 32-bit PCI cycles for maximum performance. Independent buffering and a pipeline architecture provide an unsurpassed performance level with sustained bursting. The PCI1420 can also be programmed to accept fast posted writes to improve system-bus utilization. Please be aware that an important notice concerning availability, standard warranty, and use in critical
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sheet. MicroStar BGA, TI are trademarks of Texas Instruments. Intel is a trademark of Intel Corporation. PRODUCTION DATA information is current as of publication date. Copyright 2003, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com PCI1420 GHK/PDV SLLA228 MONTH 2003 Multiple system-interrupt signaling options are provided, including: parallel PCI, parallel ISA, serialized ISA, and serialized PCI. Furthermore, general-purpose inputs and outputs are provided for the board designer to implement sideband functions. Many other PCI1420, such as socket activity light-emitting diode (LED) outputs, are discussed in detail throughout the design specification. An advanced complementary metal-oxide semiconductor (CMOS) process achieves low system power consumption while operating at PCI clock rates up to MHz. Several low-power modes enable the host power management system to further reduce power consumption. NOTE: This product is for high-volume PC only. For a complete datasheet or more information contact support@ti.com. Submit Documentation Feedback
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) PCI1420GHK NRND BGA MI CROSTA R GHK 209 90 TBD SNPB Level-3-220C-168 HR PCI1420PDV NRND LQFP PDV 208 36 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCI1420PDVG4 NRND LQFP PDV 208 36 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCI1420ZHK NRND BGA MI CROSTA R ZHK 209 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2009 Addendum-Page 1
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