PC814

UPC814G2-A NEC | Alldatasheet

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DUAL J-FET INPUT LOW-OFF SET OPERATIONAL AMPLIFIER DESCRIPTION FEATURES Dual operational amplifier uPC814 is a high-speed © High slew rate: 25 V/us (TYP.) version of the uPC812. NEC’s unique high-speed PNP © Stable operation with 220 pF capacitive load transistor (fr = 300 MHz) in the output stage yields a © Low input offset voltage high slew rate of 25 V/us under voltage-follower +3 mV (MAX.) conditions without an oscillation problem. Zener-zap +7 pV/°C (TYP.) temperature drift resistor trimming in the input stage produces excellent © Very low input bias and offset currents offset voltage and temperature drift characteristics. © Low noise: en = 19 nV//Hz (TYP.) Having AC performance characteristics that are two © Output short circuit protection times better than conventional bi-FET op amps, the © High input impedance ... J-FET Input Stage uPC814 is ideal for fast integrators, active filters, and © Internal frequency compensation other high-speed circuit applications. CONNECTION DIAGRAM EQUIVALENT CIRCUIT (1/2 Circuit) (Top View) ve HPC814C /uPC814G2 4 | ® ® out: [1] ls] v* q A

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ORDERING INFORMATION

PART NUMBER PACKAGE QUALITY GRADE uPC814C 8 PIN PLASTIC DIP (300 mil) uPCB14G2 8 PIN PLASTIC SOP (225 mil) Please refer to “Quality grade on NEC Semiconductor Devices” (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1983A (O.D. No. IC-6795) Date Published March 1993 M Printed in Japan © NEC Corporation 1987

ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) PARAMETER SYMBOL uPC814 UNIT. Power Dissipation Pr Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/offetc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4, Thermal derating factor is -5.0 mV / °C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV /°C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS cuaRAcrEnismic syweot [wn [ve [max | own a

ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15 V) [earacrenere [swe] wns [rr [wax [unr] conomions Frew otevonse | we | [a fas | ww [wewe [ioronsercuranemn” | w | | sae | soo | oe | ne srl vonecan [a | @ | ae | [nv [aprimvesswy [soevcwen | mw |_| a6 | a+ | ma [ween temangie [commence onsinhows [eww | ve [we | [we] senate Ramen to | om | vo [we | w | socom [foe [ee] fe [ame Ered de fctarmerion| ve fn [at] pe) a [unr cantcamey ww | [* | pw | Pretec ims omiy| en | | w | nw tll moonarnine | [cnmtsownn || wf fe] Sid [row onerveinwe | w | |_| = | wv [wswatr mere | [aap vetenpeneoin [awa | ao | [wre [namwrne | fms otercuriee | mw || [a2 | ma [nemo | Penwtercovovmnn |» | | [7 | [remnwrme | Note 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the ambient temperature.

a TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 € 500 P| tp 100f/-——+-S Ru = 2 kO 2 gol 7 A) fT TT S IN ’ 5 ao |] 1 TSA TT & 6 IN q Fe a SN 3 9 IN a EA CCCP Zio | | Py rr Tr 2 49 : “EEE Cs ee 0 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M 10M Te Ambient Temperature ~ °C Frequency -— Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING 30 40 es ne a LT , = Vis st5V s Ri=10kQ 1 i 2 g 30 Zz 20 3 / pes a | a

2 Vi =+10V 2

2 £ 2 y $ $ 2 3 Sd a g 4 ae i Lane 5 5 > > 0 \\ 100. ik 10k 100k 1M 10M 0 =10 =20 f — Frequency — Hz V* — Supply Voltage - V OUTPUT SOURCE CURRENT LIMIT OUTPUT SINK CURRENT LIMIT +15 -15 > Pee Vi = s15V > Vi = 215V i i 5 aso NN Bg |__| 3 ai = 70°C Ay) 3 Ta= 70°C \\) a § asec_| \\ a 25°C oy lo} ry ° 4 of Q cy 2 +5 720°C Kt FA +5 720°C — [| : =] } sy U 1 * | $ a 0 10 20 30 0 70 20 30 losource - Source Current = mA lose Sink Current = mA,

VOLTAGE FOLLOWER PULSE RESPONSE INPUT EQUIVALENT NOISE VOLTAGE DENSITY > A= +1 rs rf TO Bia | | vis sisy

3 Vi = +15V gs

pJ/] iN) |) og 3 32 = 8 \\ 3 20 f Fo ——| ee £0 es _ i Ht i’ Fo | 35 é FL] [| tt Tf 0 0 05 1 15 2 10 700 Tk 10k 700 k Time - ps #~ Frequency — Hz INPUT BIAS CURRENT SUPPLY CURRENT 100 3.5 Vr =+15V 3.0 rs Pl < 1 10 os s S

3 LL £ 20

a 1.0 y Z| 3 2 ym Sis A a = os 4 7 10 7 0 i 4 ool | Ts ~ Ambient Temperature - °C V* ~ Supply Voltage ~ V

8PIN PLASTIC DIP (300 mil) 8 5 1 4 A . K p =| > YU {\\ SN oF | \\ FH mi cB M 0~15° D P8C-100-3008,¢ NOTES ITEM | MILLIMETERS. INCHES 1) Each lead centerline is located within 0.25 | mm (0.01 inch) of its true position (T.P.) at A 10.16 MAX maximum material conditon. 8 127 MAK. 2) Item “K" to center of leads when formed pF eT = jf [namin T0066 win. | low 0.51 MIN. 0.020 MIN. i 4.31 MAX 0.170 MAX L 6.4 0.252 M 0.25 8:48 0.0108 885 Pp 0.9 MIN. 0.035 MIN

: 8 PIN PLASTIC SOP (225 mil) 8 5 HHA: [|] Ti {) Tt a Oa Woe e L} th O Oo 1 4 A HK o) : J a fo | 8 . uw D S8GM-50-225B-2 NOTE ‘imem| MILUMETERS | INCHES | Each lead centerline is located within 0.12 f Le | F 1.8 MAX. 0.071MAX. G 1.49 0.059 6540.3 0.256#0.012 K 0.152358 0.00673:883 N 0.15 0.006

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). [ uPC814G2 ] Soldering . on Recommended Sotdering conditions Infrared ray reflow Peak package's surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), 1R30-00-1 Number of reflow process: 1, Exposure limit*: None VPS Peak package's surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), VP15-00-1 Number of reflow process: 1, Exposure limit*: None Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below, WS15-00-1 Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method.” TYPES OF THROUGH HOLE DEVICE { uPC814C ] Soldering Solderi diti Recommended method joldering conditions condition symbol Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below

[MEMO]

[MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use “Standard” quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6