PC33882EK

33882_11 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

• Outputs clamped for switching inductive loads
• Very low operational bias currents (< 2.0 mA)
• CMOS input logic compatible with 5.0 V logic levels
• Load dump robust (60 V transient at V PWR on OUT0 – OUT5)
• Daisy chain operation of multiple devices possible
• Switch outputs can be paralleled for higher currents
• R DS(ON) of 0.4 Ω per output (25 °C) at 13 V VPWR
• SPI operation guaranteed to 2.0 MHz VPWR VDD CS SCLK SI SO IN0 MODE IN1 IN2 IN3 IN4 IN5 IN6 IN7 OUT0 OUT1 OUT3 OUT4 OUT5 OUT6 OUT7 IN0 & IN1 IN2 & IN3 IN4 & IN5 GND 33882 MCU VDD VPWR Optional Parallel Control of Outputs 0 through 7 High Power Outputs Low Power LED Outputs Optional Control of Paired Outputs

Figure 1. 33882 Simplified Application Diagram

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01234567 GND (Heat Sink)

Note Pin numbers shown in this figure are applicable only to the 30-lead HSOP package. Figure 2. 33882 Simplified Internal Block Diagram

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30 PIN HSOP

32 PIN QFN

32 PIN SOIC

Figure 3. HSOP, QFN, and SOIC Pin Connections Table 1. HSOP Pin Function Description

30 Pin

32 Pin

have internal active 25 μA pull-downs. an internal active 25 μA pull-up.

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Output 0 – Output7 Each pin is one channel's drain, sinking current for the respective load. 2,31 NC No Connect Not connected. μA pull-down and requires CMOS logic levels. command transfers. It is 50% duty cycle, and has CMOS levels. μA pull-up and requires CMOS logic levels. capacitor is required from VDD to ground. be electrically connected to GND.

1. The exposed pad on this package provides the circuit ground connection for the IC.

Table 1. HSOP Pin Function Description (continued)

Analog Integrated Circuit Device Data Freescale Semiconductor 5 33882

ELECTRICAL CHARACTERISTICS

Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted.

1. Transient capability with external 100 Ω resistor in series with the VPWR pin and supply.
2. Exceeding these voltages may cause a malf unction or permanent damage to the device.
3. Exceeding the limits on any paral lel inputs or SPI pins may cause permanent damage to the device.
4. ESD1 testing is performed in accor dance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
5. ESD2 testing is performed in acco rdance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
6. Maximum output clamp energy c apability at indicated junction temperature using a single pulse method.
7. Serial Frequency Specificati ons assume the IC is driving 8 tri-stated devices (20 pF each).
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

1. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

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THERMAL RESISTANCE (12), (13) Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (14) HSOP QFN SOIC RθJA °C/W Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p) (15) HSOP QFN SOIC(17) RθJMA TBD °C/W Junction-to-Board (Bottom) HSOP QFN SOIC(17) RθJB 3.0 TBD °C/W Junction-to-Case (Top) (16) HSOP QFN SOIC RθJC 0.2 1.2 1.0 °C/W Notes 12. Junction temperature is a function of on- chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 13. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 14. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. 15. Per JEDEC JESD51-6 with the board horizontal. 16. Indicates the average thermal resistance between the die and the ca se top surface as measured by the cold plate method (MIL SPEC 883, Method 1012.1) with the cold plate temperature used for the case temperature. 17. This value will be included when available. Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted.

Analog Integrated Circuit Device Data Freescale Semiconductor 7 33882 STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics

Analog Integrated Circuit Device Data

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STATIC ELECTRICAL CHARACTERISTICS DIGITAL INTERFACE SI Logic High SIV IH 4.0 – – V SI Logic Low SIV IL – – 2.0 V CS and SCLK Logic High CSV IH 3.0 – – V CS and SCLK Logic Low CSV IL – – 3.0 V Input Logic High V IH 3.15 – – V Input Logic Low V IL – – 1.35 V Input Pull-down Current (25) VIN = 1.5 V I IN (PD) 5.0 – 25 μA Input Pull-up Current (26) VIN = 3.5 V I IN (PU) -25 – -5.0 μA SO and High-state Output Voltage IOH = -1.0 mA V SOH 3.5 – – V SO and Low-state Output Voltage IOL = 1.0 mA V SOL 0 – 0.4 V SO and Tri-state Leakage Current CS = 0.7 VDD, VSO = 0.3 VDD CS = 0.7 VDD, VSO = 0.7 VDD I SOT -10 μA Input Capacitance (27) 0 = VIN = 5.5 V C IN – – 12 pF SO and Tri-state Capacitance (28) 0 = VIN = 5.5 V C SOT – – 20 pF Notes 18. Outputs of device functionally turn-on (R DS(ON) = 0.95 Ω @125 °C). SPI / parallel inputs and power outputs are operational. Fault detection and reporting may not be fully operational within this range. 20. An over-voltage condition wi ll cause any enabled outputs to latch OFF (disabled). 21. This parameter is guaranteed by design; however, it is not production tested. 22. For V DD less than the Power-ON Reset voltage, all outputs are disabled and the serial fault register is reset to all 0s. 23. Drain current per output with V PWR = 24 V and VLOAD = 9.0 V. 24. Drain current per output with V PWR = 13 V, VLOAD = 9.0 V. 25. Inputs SI, IN0 & IN1, IN2 & IN3, IN4 & IN5, and IN0 to IN7 in corporate active internal pull-down current sinks for noise immunity enhancement. 26. The MODE and CS inputs incorporate active internal pull-up current sources for noise immunity enhancement. 27. This parameter applies to inputs SI, CS, SCLK, MODE, IN0 & IN1, IN2 & IN3, IN4 & IN5, and IN0 to IN7. It is guaranteed by design; however, it is not production tested. 28. This parameter applies to the OFF state (tri-stated) conditi on of SO and is guaranteed by design; however, it is not production tested. Table 3. Static Electrical Characteristics (continued)

Analog Integrated Circuit Device Data Freescale Semiconductor 9 33882 DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics

1. Output Rise and Fall time measured at 10% to 90% and 90% to 10% voltage points respectively across 15 Ω resistive load to a VBAT
2. Output Turn-ON Delay Time measured from rising edge (3.0 V) VIN (CS for serial) to 90% VO using a 15 Ω load to a VBAT of 15 V,
3. Output Turn-OFF Delay Time measured from falling edge (1.0 V) VIN (3.0 V rising edge of CS for serial) to 10% VO using a 15 Ω load

to a VBAT of 15 V, VPWR = 15 V.

1. The shorted output is turned ON during t SS to retry and check if the short has cleared. The shorted output is in current limit during tSS.

The tSS is measured from the start of current limit to the end of current limit.

1. The Short Fault Refresh Time is the waiting period between t SS retry signals. The shorted output is disabled during this refresh time.

The tREF is measured from the end of current limit to the start of current limit.

1. The t OS(OFF) is measured from the time the faulted output is turned OFF until the fault bit is available to be loaded into the internal fault

register. To guarantee a fault is reported on SO, the falling edge of CS must occur at least 100 μs after the faulted output is off.

1. The t OS(ON) is measured from the time the faulted output is turned ON until the fault bit is available to be loaded into the internal fault

register. To guarantee a fault is reported on SO, the falling edge of CS must occur at least 12 ms after the faulted output is ON.

1. Percent Output Short Fault ON Duty Cycle is defined as (t SS) ÷ (tREF) x 100. This specification item is provided FYI and is not tested.
2. Parameter is not tested and values suggested are for system de sign consideration only in preventing the occurrence of double pulsing.

Analog Integrated Circuit Device Data

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DYNAMIC ELECTRICAL CHARACTERISTICS SI Setup to Rising Edge (2.0 V) of SCLK (at 3.2 MHz) Required Setup Time (38) t SISU – – 45 ns SO Setup to SCLK Rising (2.0 V) / Falling (0.8 V) Edge Required Setup Time (38) t SOSU 90 – – ns SI Hold After Rising Edge (2.0 V) of SCLK (at 3.2 MHz) Required Hold Time (38) t SIHOLD – – 45 ns SO Hold After SCLK Rising (2.0 V) / Falling (0.8 V) Edge Required Hold Time (38) t SOHOLD 90 – – ns SO Rise Time CL = 200 pF t RSO – – 50 ns SO Fall Time CL = 200 pF t FSO – – 50 ns Falling Edge of CS (0.8 V) to SO Low-impedance (39) t SOEN – – 110 ns Rising Edge of CS (2.0 V) to SO High-impedance (40) t SODIS – – 110 ns Falling Edge of SCLK (0.8 V) to SO Data Valid CL = 200 pF at 3.2 MHz (41) t SOVALID – 65 80 ns CS Rising Edge to Next Falling Edge (38) Xfer DELAY – – 1.0 μs Notes 38. Parameter is not tested and values suggested are for system de sign consideration only in preventing the occurrence of double pulsing. 39. Enable time required for SO. Pull-up resistor = 10 kΩ. 40. Disable time required for SO. Pull-up resistor = 10 kΩ. 41. Time required to obtain valid data out of SO following the falling edge of SCLK. Table 4. Dynamic Electrical Characteristics (continued)

Analog Integrated Circuit Device Data Freescale Semiconductor 11 33882 GATE X = COMMAND SIGNAL AT THE GATE OF DRIVER X FAULT BIT X = INTERNAL FAULT REGISTER BIT STATE TREF x = FIRST REFRESH TIME MAY BE LESS THAN TREF ILOAD = 1A NORMAL OPERATION INPUT X GATE X OUT X FAULT BIT X FAULT FAULT ILOAD TREFTREFTREFTREF IDLIM TSSA ON OFF SHORTED LOAD / SHORT - TO - VBAT SHORT OCCURS WHILE ON, ENDS DURING REFRESH NPUT X GATE X OUT X FAULT BIT X IDLIM ILOAD ON OFF CSB TSSD TSSD Input X Gate X IOUT X 5.0 V 0 V ON OFF ILOAD 0 A IO(LIM) Fault Bit X Shorted Load/Short-to-VPWR tREF tREF tSSD tSSA tSSD tREF tREF FaultFault Input X Gate X IOUT X 5.0 V 0 V ON ILOAD 0 A IO(LIM) Fault Bit X OFF OFF CB Gate X = Command Signal at the Gate of Driver X Fault Bit X = Internal Fault Register Bit State tREF X = First Refresh Time may be less than tREF ILOAD = 1.0 A Normal Operation Shorted Operation Figure 4. Short Occurring While On, Ending During Refresh (ILOAD = 1.0 A)

GATE X = COMMAND SIGNAL AT THE GATE OF DRIVER X FAULT BIT X = INTERNAL FAULT REGISTER BIT STATE TREF x = FIRST REFRESH TIME MAY BE LESS THAN TREF ILOAD = 1A NORMAL OPERATION INPUT X GATE X IOUT X FAULT BIT X FAULT FAULT ILOAD TREFTREFTREFTREF IDLIM TSSA ON OFF SHORTED LOAD / SHORT - TO - VBAT SHORT OCCURS WHILE ON, ENDS DURING RETRY INPUT X GATE X IOUT X FAULT BIT X IDLIM ILOAD ON OFF CSB TSSD TSSD Gate X = Command Signal at the Gate of Driver X Fault Bit X = Internal Fault Register Bit State tREF X = First Refresh Time may be less than tREF ILOAD = 1.0 A Input X Gate X IOUT X 5.0 V 0 V ON ILOAD 0 A IO(LIM) Fault Bit X Input X Gate X IOUT X 5.0 V 0 V ON ILOAD 0 A IO(LIM) Fault Bit X OFF CB Shorted Load/Short-to-VPWR tSSD tREFtREF tSSDtSSA tREFtREF FaultFault Shorted Operation Normal Operation OFF Analog Integrated Circuit Device Data

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Figure 5. Short Occurring While On, Ending During Retry (ILOAD = 1.0 A) Figure 6. Short Occurring While On, Ending During Refresh (ILOAD = 20 mA)

GATE X = COMMAND SIGNAL AT THE GATE OF DRIVER X FAULT BIT X = INTERNAL FAULT REGISTER BIT STATE TREF x = FIRST REFRESH TIME MAY BE LESS THAN TREF ILOAD = 20mA NORMAL OPERATION INPUT X GATE X IOUT X FAULT BIT X FAULT FAULT ILOAD TREFTREFTREFTREF IDLIM TSSD ON OFF SHORTED LOAD / SHORT - TO - VBAT SHORT OCCURS WHILE ON, ENDS DURING RETRY INPUT X GATE X IOUT X FAULT BIT X IDLIM ILOAD ON OFF CSB TSSDTSSA Gate X = Command Signal at the Gate of Driver X Fault Bit X = Internal Fault Register Bit State tREF X = First Refresh Time may be less than tREF ILOAD = 20 mA Input X Gate X IOUT X 5.0 V 0 V ON ILOAD 0 A IO(LIM) Fault Bit X OFF CB Input X Gate X IOUT X 5.0 V 0 V ON ILOAD 0 A IO(LIM) Fault Bit X OFF Fault Fault tREFtREFtREFtREF tSSA tSSD tSSD Shorted Load/Short-to-VPWR Shorted Operation Normal Operation Analog Integrated Circuit Device Data Freescale Semiconductor 13 33882 Figure 7. Short Occurring While On, Ending During Retry (ILOAD = 20 mA)

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ELECTRICAL PERFORMANCE CURVES ELECTRICAL PERFORMANCE CURVES 0.37 0.38 AMBIENT TEMPERATURE (°C) OHMS 55 70 11540 85 100 130 0.39 0.4 0.41 0.42 0.36 0.35 0.43 RDS(ON) RDS(ON) Figure 8. Output RDS(ON) Versus Temperature Figure 9. Output Clamp Voltage Versus Temperature Table 5. Logic Table 0011XXYY = Serial (SPI) commands and status bytes (8-bit operation mode) MSB to LSB. 0 = Off command, SO OK status. 1 = On command, SO FAULT status. H = High-voltage level: Active state for inputs / gates, inactive state for outputs. L = Low-voltage level: Inactive state for inputs / gates, active state for outputs.

Analog Integrated Circuit Device Data Freescale Semiconductor 15 33882 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 33882 incorporates six 1.0 A low side switches using both Serial Peripheral Interface (SPI) I /O as well as optional parallel input control to each output. There are also two low- power (30 mA) low side switches with SPI diagnostic feedback, but parallel-only input control. The 33882 incorporates SMARTMOS technology with CMOS logic, bipolar / MOS analog circuitry, and DMOS power MOSFETs. Designed to interface directly with a microcontroller, it controls inductive or incandescent loads. Each output is configured as an open drain transistor with dynamic clamping. FUNCTIONAL PIN DESCRIPTION VPWR PIN The VPWR pin is connected to battery voltage. This supply is provided for over-voltage shutdown protection and for added gate drive capabilities. A decoupling capacitor is required from VPWR to ground. IN0 & IN1, IN2 & IN3, AND IN4 & IN5 PINS These input pins control two output channels each when the MODE pin is pulled high: IN0 & IN1 controls OUT0 and OUT1, IN2 & IN3 controls OUT2 and OUT3, while IN4 & IN5 controls OUT4 and OUT5. These pins may be connected to PWM outputs of the control IC and pulled high or pulled low to control output channel states while the MODE pin is high. The states of these pins are ignored during normal operation (MODE pin low) and override the normal inputs (serial or parallel) when the MODE pin is high. These pins have internal active 25 μA pull-downs. MODE PIN The MODE pin is connected to the MODE pin of the control IC. This pin has an internal active 25 μA pull-up. When pulled high, the MODE pin does the following:

• Disables all serial control of the outputs while still reading any serial input commands.
• Disables parallel inputs IN0, IN1, IN2, IN3, IN4, and IN5 control of the outputs.
• Selects IN0 & IN1, IN2 & IN3, and IN4 & IN5 input pins for control of OUT0 and OUT1, OUT2 and OUT3, OUT4 and OUT5, respectively.
• Turns off OUT6 and OUT7.
• Tri-states the SO pin. IN0 TO IN7 PINS These are parallel input pins connected to output pins of the control IC. Each parallel input is logic high with the corresponding SPI control bit to control each output channel. These pins have internal 25 μA active pull-downs. OUT0 TO OUT7 PINS Each pin is one channel's low side switch output. OUT0 to OUT5 are actively clamped to handle inductive loads. SI PIN The Serial Input pin is connected to the SPI Serial Data Output pin of the control IC from where it receives output command data. This input has an internal active 25 μA pull- down and requires CMOS logic levels. The serial data transmitted on this line is an 8- or 16-bit control command sent MSB first, controlling the six output channels. Bits A5 through A0 control channels 5 through 0, respectively. Bits A6 and A7 enable ON open load fault detection on channels 5 through 0. The control IC will ensure that data is available on the rising edge of SCLK. Each channel has its serial control bit high with its parallel input to determine its state. SCLK PIN The SCLK pin of the control IC is a bit (shift) clock for the SPI port. It transitions one time per bit transferred when in operation. It is idle between command transfers. It is 50% duty cycle and has CMOS levels. This signal is used to shift data to and from the device. For proper fault reporting operation, the SCLK input must be low when CS transitions from high to low. CS PIN The CS pin is connected to a chip select output of the control IC. The control IC controls which device is addressed by pulling the CS pin of the desired device low, enabling the SPI communication with the device, while other devices on the serial link keep their serial outputs tri-stated. This input has an internal active 25 μA pull-up and requires CMOS logic levels.

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FUNCTIONAL PIN DESCRIPTION SO PIN The Serial Output pin is connected to the SPI Serial Data Input pin of the control IC or to the SI pin of the next device in a daisy chain. This output will remain tri-stated unless the device is selected by a low CS pin or the MODE pin goes low. The output signal generated will have CMOS logic levels and the output data will transition on the falling edges of SCLK. The serial output data provides fault information for each output and is returned MSB first when the device is addressed. Fault bit assignments for return data are as follows: MSB-0 through MSB-7 are output fault bits for OUT7 to OUT0, respectively. In 8-bit SPI mode, under normal conditions, the SO pin (not daisy chained) returns all 0s, representing no faults. If a fault is present, a 1 is returned for the appropriate bit. In 16-bit SPI mode, sending a double command byte will provide a command verification byte following the fault status byte returned from the SO pin (non- daisy chained). With the MODE pin high, the serial output pin tri-states. If nothing is connected to the SO pin except an external 10 kΩ pull-up resistor, data is read as all [1]s by the control IC. VDD PIN This pin is connected to the 5.0 V power supply of the system. A decoupling capacitor is required from VDD to ground. PERFORMANCE FEATURES NORMAL OPERATION OUT0 to OUT7 are independent during normal operation. OUT0 to OUT5 may be driven serially or by their parallel input pins. OUT6 and OUT7 can only be controlled by their parallel input pins. Device operation is considered normal only if the following conditions apply:

• V PWR of 5.5 V to 24 V, and VDD voltage of 4.75 V to 5.25 V.
• Junction temperatures less than 150 °C.
• For each output, drain voltage exceeds the Open Load OFF Detection Voltage, specified in the specification table, while the output is OFF. For open load detection, an open condition existing for less than the Open Load Detection time, specified in the specification table, is not considered a fault nor is it reported to the fault status register.
• T h e MODE pin is held at the logic low level, keeping the serial channel / parallel input pins in control of the eight outputs. SERIAL / PARALLEL INPUT CONTROL Input control is accomplished by the serial control byte sent via the SPI port from the control IC or by the parallel control pins for each channel. For channels 0 to 5 with serial and parallel control the output state is determined by the OR of the serial bit and the parallel input pin state. Serial communication is initiated by a low state on the CS pin and timed by the SCLK signal. After CS switches low, the IC initiates eight or 16 clock pulses with the control bits being available on the SI pin at the rising edge of SCLK. The bits are transferred in descending bit-significant order. Any fault or MODE indications on bits returned are logic [1]s. The last six bits are the command signals to the six outputs. Upon completion of the serial communication the CS pin will switch high. This terminates the communication with the slave device and loads the control bits just received to the output channels. Upon device power-up, the serial register is cleared. In the application for non-daisy chain configurations, the number of SPI devices available to be driven by the SO pin is limited to eight devices. SERIAL STATUS OUTPUT Serial output information sent on the SPI port is a check on the fault status of each output channel as well as a check for MODE initiation. Serial command verification is also possible. SO PIN OPERATION The SO pin provides SPI status, allowing daisy chaining. The status bits returned to the IC are the fault register bits with logic [1]s indicating a fault on the designated output or MODE if all bits return logic [1] (with a 10 kΩ pull-up resistor on the SO pin). A command verification is possible if the SPI mode is switched to 16 bits. The first byte (8 bits) returned would be the fault status, while the second byte returned would be the first byte sent feeding through the 33882 IC. The second command byte sent would be latched into the 33882 IC. The CS pin switching low indicates the device is selected for serial communication with the IC. Once CS switches low, the fault status register cannot receive new fault information and serial communication begins. As the control bits are clocked from the IC MSB first, they are received on rising SCLK edges at the SI pin. The fault status bits transition on the SO pin on falling SCLK edges and are sampled on rising SCLK edges at the input pin of the IC SPI device. When the command bit transmissions for serial communication are complete, the CS pin is switched high. This terminates communication with the device. The SO pin tri-states, the fault status register is opened to accept new fault information, and the transmitted command data is loaded to the outputs. At the same time, the IC can read the status byte it received. DAISY CHAIN OPERATION (ONLY POSSIBLE WITH SO PIN) Daisy chain configurations can be used with the SO pin to save CS outputs on the IC. Clocking and pin operations are as defined in the SO Pin Operation paragraph. For daisy chaining two 8-bit devices, a 16-bit SPI command is sent, the first command byte for the second daisy chain device and the second command byte for the first daisy chain device. A command verification is possible if the SPI mode is switched

Analog Integrated Circuit Device Data Freescale Semiconductor 17 33882 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION to 32 bits. The first word sent is command verification data fed through the two 33882 ICs. Data returned in the 32 bits is the two fault status bytes, followed by the first word sent. Bits sent out are sampled on rising SCLK edges at the input pin of the next IC in the daisy chain. Note Because SO pins of the 33882 ICs are tri-stated, any device receiving its SPI data from a previous 33882 IC SO pin in a daisy chain will not receive data if the MODE pin is low. This prohibits setting SPI-controlled channels ON with a SPI command while the MODE pin is low. Therefore, all channels remain OFF when the MODE pin changes from low to high at vehicle power-up. MODE OPERATION During normal operation output channels are controlled by either the Serial Input control bits or the parallel input pins. If the MODE pin is pulled high:

• Serial input control is disabled.
• Parallel input pins IN0 to IN5 are ignored.
• The SO pin is tri-stated. OUT0 and OUT1, OUT2 and OUT3, and OUT4 and OUT5 are controlled by the IN0 & IN1, IN2 & IN3, and IN4 & IN5 pins, respectively. When a 10 kΩ pull-up resistor is used, a logic high on the MODE pin or an open serial output pin is flagged by the SPI when all bits are returned as logic [1]s. Although a logic high on the MODE pin disables serial control of outputs, data can still be clocked into the serial input register. This allows programming of a desired state for the outputs taking effect only when the MODE pin returns to a logic low. For applications using the SO pin, daisy chaining is permitted, but if the MODE pin is high, writing to other than the first IC in a daisy chain is not possible because the serial outputs are tri-stated. OUTPUT DRIVERS The high power OUT0 to OUT5 outputs are active clamped, low side switches driving 1.0 A typical or less loads. The low-power OUT6 and OUT7 outputs are unclamped low- side switches driving 30 mA typical or less loads. All outputs are individually protected from short circuit or short-to-battery conditions and transient voltages. The outputs are also protected by short-circuit device shutdown. Each output individually detects and reports open load /short-to-ground and short-circuit /short-to-battery faults. FAULT SENSE / PROTECTION CIRCUITRY Each output channel individually detects shorted loads / short-to-battery while the output is ON and open load /short- to-ground while the output is OFF. OUT0 to OUT5 may also be programmed via SPI bits 6 and 7 to detect open loads and shorts-to-ground while the output is ON. Whenever a short or open fault condition is present on a particular output channel, its fault bit in the internal fault register indicates the fault with a logic [1]. When a fault ends, its fault bit remains set until the SPI register is read, then it returns to a logic [0], indicating a normal condition. When the CS pin is pulled low for serial communication, the fault bits in the internal fault register latch, preventing erroneous status transmissions and the forthcoming communication reports this latched fault status. The SO pin serial output data for 8-bit SPI mode are the fault status register bits. For 16-bit SPI mode and SO pin (non-daisy chained) use, a transmitted double command provides the fault byte followed by the first byte of the double command, becoming a command verification. The status is sent back to the IC for fault monitoring. Diagnostic interpretation of the following fault types can be accomplished using the procedure described in the paragraph entitled Extensive Fault Diagnostics:
• Communication error
• Open load /short-to-ground
• Short-to-battery or short-circuit When serial communication is ended, the CS pin returns high, opening the fault status register to new fault information and tri-stating the SO pin. Two fault conditions initiate protective action by the device:
• A short-circuit or short-to-battery on a particular output will cause that output to go into a low duty cycle operation until the fault condition is removed or the input to that channel turns OFF.
• A short-circuit condition causes all channels to shut down, ignoring serial and parallel inputs to the device. To be detected and reported as a fault, a fault condition must last a specified time (fault sense time or fault mask time). This prevents any normal switching transients from causing inadvertent fault status indications. Fault status information should be ignored for VBAT levels outside the 9.0 V to 17 V range. The fault reporting may appear to function properly but may not be 100 percent reliable. SHORT-CIRCUIT /SHORT-TO-BATTERY SENSING AND PROTECTION When an output is turned ON, if the drain current limit is reached, the current remains at the limit until the short-circuit sense time, tSS, has elapsed. At this time, the affected output will shut down and its fault status bit switches to a logic [1]. The output goes into a low duty cycle operation as long as the short-circuit condition exists and the input to that channel is ON. This duty cycle is defined by the sense and refresh times. If a short occurs after the output is ON, the fault sense time indicates the fault and enters the low duty cycle mode at much less than t SS. The duty cycle is low enough to keep the driver from exceeding its thermal capabilities. When the short is removed, the driver resumes normal operation at the next retry, but the fault status bit does not return to a normal logic [0] state until it is read from the SPI. When the CS pin of this device is pulled low, the fault status bits are latched, after which any new fault information is not a part of this serial communication event.

Analog Integrated Circuit Device Data

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FUNCTIONAL PIN DESCRIPTION The low duty cycle operation for a short-circuit condition is required to protect the output. It is possible to override this duty cycle if the input signal (parallel or SPI) turns the channel ON and OFF faster than 10 kHz. For this reason control signals should not exceed this frequency. OPEN LOAD / SHORT-TO-GROUND WHILE OFF SENSING If the drain voltage falls below the Open Load OFF Detection Voltage at turn OFF for a period of time exceeding the Open Load Sense Time, the fault status bit for this output switches to a logic [1]. If a drain voltage falls below the Open Load OFF Detection Voltage threshold when the output has been OFF, a fault is indicated with a delay much less than the Open Load Sense Time. When the fault is removed, normal operation resumes and the fault status bit will return to a normal logic [0] state. When the CS pin of this device is pulled low, the fault status bits are latched, after which any new fault information is not part of this serial communication event. OVER-VOLTAGE SENSING AND PROTECTION When VPWR exceeds the Over-voltage Shutdown Threshold, all channels are shut down. Serial input data and parallel inputs are ignored. The device resumes normal operation when the V PWR voltage drops below the Over- voltage Shutdown Hysteresis voltage. During over-voltage shutdown, some faults may appear to report accurately; however, fault sensing operation is only guaranteed for battery voltage levels from 9.0 V to 17 V. FAULT STATUS MONITORING REQUIREMENTS FOR SERIALLY CONTROLLED OUTPUTS, SO PIN Fault monitoring over the serial channel by the IC requires a minimal amount of overhead for normal operation. Each status byte received consists of all logic [0]s when faults are not present. If any logic [1]s are returned, a communication error occurred, an output fault occurred, or the MODE pin has been set low. Upon receiving any logic [1] bits, the IC must resend the last command, verifying the returned logic [1]s, or correct any communication error. A 16-bit SPI transmission with a double command byte to this 8-bit device allows verification of the command (second byte returned) in addition to the fault byte (first byte returned). The command (second) byte returned should mirror the bits sent unless a communication error occurred, in which case the command resent should accomplish the correction. If the returned logic [1] validates, it may indicate a MODE pin high or a confirmed output fault. If it was a confirmed output fault, extensive diagnostics could be performed, determining the fault type, especially if vehicle service is being performed. If all bits return high and verify such, the IC must verify sending a logic low to the MODE pin. It should then resend the command, verifying the MODE pin is at a logic low level, allowing resumption of a normal operation. If all logic [1]s are again returned, there is an open SO line, an open MODE line, or the SPI is not functioning. If the fault does not verify on the command resend, normal operation is resumed. The error could be a communication mistake, a momentary output fault, or a fault condition no longer sensed due to switching the state of the output. For the first two cases, normal operation is resumed and the software continues its normal functions. However in the third case, additional commands are required for extensive diagnosis of the fault type, if this information is mandatory. EXTENSIVE FAULT DIAGNOSTICS More extensive diagnosis may be required under the following conditions:

• When the fault type of a c onfirmed fault is desired, the following scenarios are possible: – If MSB-2 to MSB-7 indicates a fault, it is an open load / short-to-ground fault if the output is OFF when the fault is reported because only open load / short- to-ground sensing remains operable while an output is OFF. – If the output is ON when the fault is reported, the fault is a short-circuit /short-to-battery if ON open load detection is not enabled via SPI. If ON open load detection is enabled, it must be disabled and the fault status reread. If the fault remains, it is a short-circuit / short-to-battery or it is an open load / short-to-ground. – If MSB-0 to MSB-2 indicates a fault, it is an open load / short-to-ground fault if the output is OFF when the fault is reported because only open load /short- to-ground sensing remains operable while an output is OFF. – If the output is ON when the fault is reported, the fault is a short-circuit /short-to-battery.
• When a fault did not confirm on resend, the fault could either be an short-circuit /short-to-battery fault, not sensed when turned OFF; an open load /short-to-ground fault, not sensed when turned ON; or a corrected communication error. To determine if it is an output fault condition, the faulted output must be turned back to its previous state with a new command. This command should be sent twice to read the status after the output is latched in this state, thus confirming the fault and reporting it again. Parallel control of outputs is a mode of control, potentially requiring extensive diagnostics if a fault is reported. This is because parallel control signals are completely asynchronous to the serial commands. Status reports for parallel controlled outputs could require additional information exchange in software to:
• Avoid status reads when outpu ts are transitioned, thereby avoiding fault masking times.
• Obtain the state of a faulted output for determining fault type (if required).

Analog Integrated Circuit Device Data Freescale Semiconductor 19 33882 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION SYSTEM ACTUATOR ELECTRICAL CHARACTERISTICS (AT ROOM TEMPERATURE) All drains should have a 0.01 μF filter capacitor connected to ground. Any unused output pin should not be energized. A 20 Ω resistor to the battery is required to prevent false open load reporting. There must also be a maximum of 100 Ω of resistance from VPWR to ground, keeping battery-powered loads OFF when the IC is powered down. However, all loads should be powered by VPWR to protect the device from full transient voltages on the battery voltage. POWER-UP The device is insensitive to power sequencing for VPWR and VDD, as well as intolerant to latch-up on all I /O pins. Upon power-up, an internal power-ON reset clears the serial registers, allowing all outputs to power up in the off-state when parallel control pins are also low. Although the serial register is cleared by this power-ON reset, software must still initialize the outputs with an SPI command prior to changing the MODE pin from a high to a low state. This assures known output states when MODE is low.

Analog Integrated Circuit Device Data

20 Freescale Semiconductor

For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. VW SUFFIX 30-PIN HSOP 98ASH70693A ISSUE A

Analog Integrated Circuit Device Data Freescale Semiconductor 21 33882 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) VW SUFFIX 30-PIN HSOP 98ASH70693A ISSUE A

Analog Integrated Circuit Device Data

22 Freescale Semiconductor

PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) VW SUFFIX 30-PIN HSOP 98ASH70693A ISSUE A

Analog Integrated Circuit Device Data Freescale Semiconductor 23 33882 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EP SUFFIX (PB-FREE) 32-PIN QFN 98ARH99032A ISSUE E

Analog Integrated Circuit Device Data

24 Freescale Semiconductor

PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EP SUFFIX (PB-FREE) 32-PIN QFN 98ARH99032A ISSUE E

Analog Integrated Circuit Device Data Freescale Semiconductor 25 33882 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EP SUFFIX (PB-FREE) 32-PIN QFN 98ARH99032A ISSUE E

Analog Integrated Circuit Device Data

26 Freescale Semiconductor

PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EP SUFFIX (PB-FREE) 32-PIN QFN 98ARH99032A ISSUE E

Analog Integrated Circuit Device Data Freescale Semiconductor 27 33882 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EK SUFFIX (PB-FREE) 32-PIN SOIC-EP 98ARL10543D ISSUE D

Analog Integrated Circuit Device Data

28 Freescale Semiconductor

PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EK SUFFIX (PB-FREE) 32-PIN SOIC-EP 98ARL10543D ISSUE D

Analog Integrated Circuit Device Data Freescale Semiconductor 29 33882 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) EK SUFFIX (PB-FREE) 32-PIN SOIC-EP 98ARL10543D ISSUE D

Analog Integrated Circuit Device Data

30 Freescale Semiconductor

REVISION HISTORY

PACKAGE DIMENSIONS (CONTINUED) REVISION DATE DESCRIPTION OF CHANGES 3.0 9/2005 • Implemented Revision History page

• Added Thermal Addendum
• Converted to Freescale format 4.0 5/2006 • Updated ordering information block on page 1 5.0 10/2006 • Updated data sheet format
• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 5. Added note with instructions to obtain this information from www.freescale.com 6.0 6/2009 • Changed Supply Voltage in Static Electric al Characteristics, Table 4, on page 9 7.0 x/2010 • New Fab transfer devices added. No electrical parameter changes.
• Removed Part Numbers MC33882FC/R2, MC33882EK/R2, MC33882VW, and MC33 882EP, and replaced with part numbers MC33882PVW, MC33882PEP.
• Added EK package to the ordering information and supporting data
• Removed all DH suffix information.
• Corrected HSOP 98A reference number and associated information
• Update the Packaging section 98A drawings

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