UPC29M33A NEC | Alldatasheet

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© 2001 BIPOLAR ANALOG INTEGRATED CIRCUIT µµµµPC29M33A,µµµµPC29M05A THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR DATA SHEET Document No. G15368EJ1V0DS00 (1st edition) Date Published May 2001 NS CP(K) Printed in Japan The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.

DESCRIPTION

The µPC29M33A, µPC29M05A of low dropout voltage three terminal positive regulators is constructed with PNP output transistor. The µPC29M33A, µPC29M05A feature the ability to source 0.5 A of output current with a low dropout voltage of typically 0.5 V. The power dissipation of the µPC29M33A, µPC29M05A can be drastically reduced compared with the conventional three terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators ( µPC24M00A series).

FEATURES

  • Output current in excess of 0.5 A
  • Low dropout voltage VDIF = 0.5 V TYP. (at IO = 0.5 A)
  • On-chip overcurrent and thermal protection circuit
  • ••• On-chip output transistor safe area protection circuit PIN CONFIGURATION (Marking Side) µ µ 1: INPUT 2: GND 3: OUTPUT 12 1: INPUT 2: GND 3: OUTPUT 4: GND (Fin) µPC29M33AHF, PC29M05AHF: MP-45Gµ PC29M33A, PC29M05AT: MP-3Zµ PC29M33AHB, PC29M05AHB: MP-3µ

µµµµPC29M33A,µµµµPC29M05A BLOCK DIAGRAM Start-up circuit Reference voltage Thermal shut down Error amp. Drive circuit Saturation protection Safe operating area protection OUTPUT GND INPUT Over current protection

Data Sheet G15368EJ1V0DS 3 µµµµPC29M33A,µµµµPC29M05A

ORDERING INFORMATION

Part Number Package Output Voltage Marking Package Type µ PC29M33AHF MP-45G (Isolated TO-220)

3.3 V 29M33A • Packed in envelope

µ PC29M33AHB MP-3 (SC-64) 3.3 V 29M33A • Packed in envelope µ PC29M33AT MP-3Z (SC-63) 3.3 V 29M33A • Packed in envelope µ PC29M33AT-E1 MP-3Z (SC-63) 3.3 V 29M33A • 16 mm wide embossed taping

  • Pin 1 on drawout side
  • 2000 pcs/reel µ PC29M33AT -E2 MP-3Z (SC-63) 3.3 V 29M33A • 16 mm width embossed taping
  • Pin 1 at takeup side
  • 2000 pcs/reel µ PC29M33AT -T1 MP-3Z (SC-63) 3.3 V 29M33A • 32 mm wide adhesive taping
  • Pin 1 at drawout side
  • 1500 pcs/reel µ PC29M33AT -T2 MP-3Z (SC-63) 3.3 V 29M33A • 32 mm wide adhesive taping
  • Pin 1 at takeup side
  • 1500 pcs/reel µ PC29M05AHF MP-45G (Isolated TO-220)

5.0 V 29M05A • Packed in envelope

µ PC29M05AHB MP-3 (SC-64) 5.0 V 29M05A • Packed in envelope µ PC29M05AT MP-3Z (SC-63) 5.0 V 29M05A • Packed in envelope µ PC2905AT-E1 MP-3Z (SC-63) 5.0 V 29M05A • 16 mm wide embossed taping

  • Pin 1 at drawout side
  • 2000 pcs/reel µ PC2905AT-E2 MP-3Z (SC-63) 5.0 V 29M05A • 16 mm wide embossed taping
  • Pin 1 at takeup side
  • 2000 pcs/reel µ PC2905AT-T1 MP-3Z (SC-63) 5.0 V 29M05A • 32 mm wide adhesive taping
  • Pin 1 at drawout side
  • 1500 pcs/reel µ PC2905AT-T2 MP-3Z (SC-63) 5.0 V 29M05A • 32 mm wide adhesive taping
  • Pin 1 at takeup side
  • 1500 pcs/reel

µµµµPC29M33A,µµµµPC29M05A ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Rating Parameter Symbol µ PC29M33AHF, µ PC29M05AHF µPC29M33AHB, µPC29M05AHB µPC29M33AT, µPC29M05AT Unit Input Voltage V IN 20 V Internal Power Dissipation Note(TC = 25°C) PT 15 10 W Operating Ambient Temperature T A –30 to +85 °C Operating Junction Temperature T J –30 to +150 °C Storage Temperature T stg –55 to +150 °C Thermal Resistance (junction to case) R th(J-C) 7 12.5 °C/W Thermal Resistance (junction to ambient) R th(J-A) 65 125 °C/W Note Internally limited. When the operating junction temperature rises over 150 °C, the internal circuit shuts down the output voltage. Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the quality of the product may be degraded. In other words, absolute maximum ratings specify the values exceeding which the product may be physically damaged. Be sure to use the product with these ratings never exceeded. STANDARD CONNECTION D 1 INPUT C OUTC IN D 2+ PC29M33A , PC29M05A OUTPUT CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure to connect C IN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 µF or higher for the voltage and temperature range to be used. COUT: 47 µF or higher. Be sure to connect C OUT to prevent oscillation and improve excessive load regulation. Place CIN and C OUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low impedance characteristics if considering use at sub-zero temperatures. D 1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external.

Data Sheet G15368EJ1V0DS 5 µµµµPC29M33A,µµµµPC29M05A RECOMMENDED OPERATING CONDITIONS Parameter Symbol Type Number MIN. TYP. MAX. Unit µ PC29M33A 4.3 16 Input Voltage V IN µ PC29M05A 6 16 V Output Current I O All 0 0.5 A Operating Ambient Temperature TA All –30 +85 °C Operating Junction Temperature TJ All –30 +125 °C

ELECTRICAL CHARACTERISTICS

µµµµPC29M33A (TJ = 25°°°°C, VIN = 5 V, IO = 350 mA, CIN = 0.22 µµµµF, COUT = 47 µµµµF, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit 3.18 3.3 3.42 VOutput Voltage V O 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V,

0 A ≤ IO ≤ 350 mA

3.14 3.46 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REG IN 4.3 V ≤ VIN ≤ 16 V 8 33 mV Load Regulation REG L 0 A ≤ IO ≤ 0.5 A 10 33 IO = 0 A 1.8 3.0 mAQuiescent Current I BIAS IO = 0.5 A 15 20 VIN = 3.1 V, IO = 0 A 9 20 mAStartup Quiescent Current I BIAS (s) VIN = 3.1 V, IO = 0.5 A 50 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V 2.9 15 mA Output Noise Voltage V n 10 Hz ≤ f ≤ 100 kHz 56 µ Vr.m.s. Ripple Rejection R•R 4.3 V ≤ VIN ≤ 16 V, f = 120 Hz 48 64 dB Dropout Voltage V DIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A 0.5 1.0 V VIN = 4.5 V 0.7 1.1 1.5Short Circuit Current I Opeak VIN = 16 V 0.6 A VIN = 4.5 V 0.7 1.2 1.5 APeak Output Current I Opeak VIN = 16 V 0.6 1.0 1.5 Temperature Coefficient of Output Voltage ∆VO /∆T0 °C ≤ TJ ≤ 125°C, IO = 5 mA –0.4 mV/ °C

µµµµPC29M33A,µµµµPC29M05A µµµµPC29M05A (TJ = 25°°°°C, VIN = 8 V, IO = 350 mA, CIN = 0.22 µµµµF, COUT = 47 µµµµF, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit 4.83 5.0 5.18 VOutput Voltage V O 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V, 4.75 5.25 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REG IN 6 V ≤ VIN ≤ 16 V 26 50 mV Load Regulation REG L 0 A ≤ IO ≤ 0.5 A 17 50 mV IO = 0 A 1.9 4.0 mAQuiescent Current I BIAS IO = 0.5 A 15 20 VIN = 4.5 V, IO = 0 A 10 20 mAStartup Quiescent Current I BIAS (s) VIN = 4.5 V, IO = 0.5 A 50 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V 2.4 15 mA Output Noise Voltage V n 10 Hz ≤ f ≤ 100 kHz 87 µ Vr.m.s. Ripple Rejection R•R 6 V ≤ VIN ≤ 16 V, f = 120 Hz 46 60 dB Dropout Voltage V DIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A 0.5 1.0 V VIN = 6.5 V 0.65 1.1 1.5Short Circuit Current I Opeak VIN = 16 V 0.6 A VIN = 6.5 V 0.7 1.2 1.5 APeak Output Current I Opeak VIN = 16 V 0.6 1.1 1.5 Temperature Coefficient of Output Voltage ∆VO /∆T0 °C ≤ TJ ≤ 125°C, IO = 5 mA 0.7 mV/ °C

Data Sheet G15368EJ1V0DS 7 µµµµPC29M33A,µµµµPC29M05A TYPICAL CHARACTERISTICS (Reference Values) 25 50 75 100 125 150 P d - Total Power Dissipation - W Pd vs. TA TA - Operating Ambient Temperature - ˚C Without heatsink Solid line: µ µµ µ PC29M33AHF, PC29M05AHF Broken line: PC29M33AHB , PC29M05AHB PC29M33AT , PC29M05AT µµ With infinite heatsink 150 100 0 100 15 050 ∆VO vs TJ TJ - Operating Junction Temperature - ˚C ∆ O - Output Voltage Deviation - mVV PC29M05Aµ PC29M33Aµ IO = 5 mA –200 –50 –150 –100 –50 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 012345678 TJ = 25˚CIO = 5 mA IO = 0.35 A IO = 0.5 A VO vs. VIN ( PC29M33A) VO - Output Voltage - V VIN - Input Voltage - V µ 012345678 IO = 0.5 A IO = 0.35 A IO = 5 mA TJ = 25˚C VO vs. VIN ( PC29M05A) VO - Output Voltage - V VIN - Input Voltage - V µ 40 2 6 8 1 01 21 41 61 82 0 TJ = 25˚C IO = 0.5 A OI = 0.35 A IO = 0 A IBIAS (IBIAS(s)) vs. VIN ( PC29M33A) IBIAS - Quiescent Current - mA VIN - Input Voltage - V µ 24681 0 1 2 1 4 1 6 1 8 2 0 T = 25˚C IO = 0.5 A = 0.35 A O IO = 0 A IBIAS (IBIAS(s)) vs. VIN ( PC29M05A) IBIAS - Quiescent Current - mA VIN - Input Voltage - V µ

µµµµPC29M33A,µµµµPC29M05A 1.0 0.8 0.6 0.4 0.2 -25 25 50 75 100 125 1500 IO = 0.5 A VDIF vs. TJ VDIF - Dropout Voltage - V TJ - Operating Junction Temperature - ˚C PC29M33Aµ PC29M05Aµ 1.5 1.0 0.5 0.0 0 2010 155 JT = 0˚C TJ = 25˚C TJ = 125˚C IOpeak vs. VDIF ( PC29M33A) IOpeak - Peak Output Current - A VDIF - Dropout Voltage - V µ 1.5 1.0 0.5 0.0 0 2010 155 TJ = 125˚C TJ = 0˚C TJ = 25˚C IOpeak - Peak Output Current - A VDIF - Dropout Voltage - V IOpeak vs. VDIF ( PC2905A)µ 100 1 k 10 k 100 k R ·R vs f R ·R - Ripple Rejection - dB f - Frequency - Hz TJ = 25˚C, IO = 0.5 A

4.3 V ≤ VIN ≤ 16 V PC29M33A

6 V ≤ VIN ≤ 16 V PC29M05A

PC29M05Aµ PC29M33Aµ µ µ 40R . R - Ripple Rejection - dB IO - Output Current - A R R vs. IO. PC29M05Aµ PC29M33Aµ TJ = 25˚C, f = 120 Hz µ µ 1.0 0.1 0.2 0.3 0.5 0.8 0.6 0.4 0.2 0 0.4 TJ = 25˚C PC29M33A PC29M05A VDIF vs. IO VDIF - Dropout Voltage - V IO - Output Current - A µ µ

Data Sheet G15368EJ1V0DS 9 µµµµPC29M33A,µµµµPC29M05A 1.0 TJ = 25˚C VIN = 16 V VIN = 6 V VIN = 8 V VO - Output Voltage - V IO - Output Current - A VO vs. IO ( PC29M05A)µ 1.0 TJ = 25˚C VIN = 16 V V = 5 V V IN = 4.3 V VO - Output Voltage - V IO - Output Current - A VO vs. IO ( PC29M33A)µ

Data Sheet G15368EJ1V0DS10 µµµµPC29M33A,µµµµPC29M05A PACKAGE DRAWINGS µµµµPC29M33AHF, µµµµPC29M05AHF D 17.0 ±0.3 3PIN PLASTIC SIP (MP-45G) NOTE Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS P3HF-254B-4 G0 . 2 5 H 2.54 (T.P.) A 10.0 ±0.2 I5 . 0 ±0.3 U2 . 4 ±0.5 V Y8 . 9 ±0.7 Z1 . 3 0 ±0.2 J K L8 . 5 ±0.2 B7 . 0 ±0.2 C1 . 5 0 ±0.2 E F0 . 7 5 ±0.10 M8 . 5 ±0.2 N P2 . 8 ±0.2 3.3±0.2φ 2.46±0.2 5.0±0.2 4.5±0.2 0.65±0.10 13 2 M A B E I D L M K Y JH C FG Z N P UV

Data Sheet G15368EJ1V0DS 11 µµµµPC29M33A,µµµµPC29M05A µµµµPC29M33AHB, µµµµPC29M05AHB MP-3(SC-64) (Unit: mm) 123 2.32.3 0.75 1.1±0.1 0.5 1.6±0.2 5.0±0.2 6.5 0.2 5.5±0.27.0 MIN. +0.2 –0.1 1.5+0.2 –0.1 13.7 MIN. 2.3±0.2 0.5±0. 1 0.5+0.2 –0.1 µµµµPC29M33AT, µµµµPC29M05AT MP-3Z (SC-63) (Unit: mm ) 2.3 2.3 0.8 0.8 123 4.3 MAX. 10.0 MAX. 0.5 1.0 MIN. 1.5 TYP. +0.2 –0.1 6.5±0.2 2.3±0.2 5.0±0.2 0.5 ±0.1

Data Sheet G15368EJ1V0DS12 µµµµPC29M33A,µµµµPC29M05A RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Surface Mount Device µµµµPC29M33AT, µµµµPC29M05AT: MP-3Z (SC-63) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 2 times or less. IR35-00-2 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 2 times or less. VP15-00-2 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Through-hole devices µPC29M33AHF, µPC29M05AHF: MP-45G µPC29M33AHB, µPC29M05AHB: MP-3 Process Conditions Wave soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial heating method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each pin). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.

Data Sheet G15368EJ1V0DS 13 µµµµPC29M33A,µµµµPC29M05A NOTES ON USE When the µPC29M33A, µPC29M05A are used with an input voltage that is lower than the value indicated in the recommended operating conditions, a large quiescent current flows through the device due to saturation of the transistor of the output stage. (Refer to the I BIAS (I BIAS(S)) vs. V IN curves in TYPICAL CHARACTERISTICS ). These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts up. REFERENCE DOCUMENTS Document Name Document No. QUALITY GRADE ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E VOLTAGE REGULATOR OF SMD G11872E SEMICONDUCTOR SELECTION GUIDE – PRODUCTS AND PACKAGES X13769E

Data Sheet G15368EJ1V0DS14 µµµµPC29M33A,µµµµPC29M05A [MEMO]

Data Sheet G15368EJ1V0DS 15 µµµµPC29M33A,µµµµPC29M05A [MEMO]

µµµµPC29M33A,µµµµPC29M05A M8E 00. 4 The information in this document is current as of May, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).