PBYL3025CT PHILIPS | Alldatasheet

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Technical content

Philips Semiconductors Product specification Rectifier diodes PBYL3025CT, PBYL3025CTB series Schottky barrier FEATURES SYMBOL QUICK REFERENCE DATA

  • Low forward volt drop
  • Fast switching VR = 20 V/ 25 V
  • Reverse surge capability
  • High thermal cycling performance IO(AV) = 30 A
  • Low thermal resistance VF ≤ 0.43 V GENERAL DESCRIPTION Dual schottky rectifier diodes intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The PBYL3025CT series is supplied in the SOT78 (TO220AB) conventional leaded package. The PBYL3025CTB series is supplied in the SOT404 surface mounting package. PINNING SOT78 (TO220AB) SOT404 PIN DESCRIPTION 1 gate 2 drain 1 3 source tab drain LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT PBYL30 20CT 25CT PBYL30 20CTB 25CTB VRRM Peak repetitive reverse - 20 25 V voltage VRWM Working peak reverse - 20 25 V voltage VR Continuous reverse voltage Tmb ≤ 120 ˚C - 20 25 V IO(AV) Average rectified output square wave; δ = 0.5; Tmb ≤ 123 ˚C - 30 A current (both diodes conducting) IFRM Repetitive peak forward square wave; δ = 0.5; Tmb ≤ 123 ˚C - 30 A current per diode IFSM Non-repetitive peak forward t = 10 ms - 135 A current per diode t = 8.3 ms - 150 A sinusoidal; Tj = 125 ˚C prior to surge; with reapplied VRRM(max) IRRM Peak repetitive reverse pulse width and repetition rate - 1 A surge current per diode limited by Tj max Tj Operating junction - 150 ˚C temperature T stg Storage temperature - 65 175 ˚C 1. It is not possible to make connection to pin 2 of the SOT404 package. k a1 a2 12 3 tab tab March 1998 1 Rev 1.000

Philips Semiconductors Product specification Rectifier diodes PBYL3025CT, PBYL3025CTB series Schottky barrier THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-mb Thermal resistance junction per diode - - 2 K/W to mounting base both diodes - - 1.5 K/W R th j-a Thermal resistance junction SOT78 package, in free air - 60 - K/W to ambient SOT404 package, pcb mounted, minimum - 50 - K/W footprint, FR4 board

ELECTRICAL CHARACTERISTICS

All characteristics are per diode at Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V F Forward voltage I F = 15 A; Tj = 150˚C - 0.35 0.43 V IF = 15 A; Tj = 125˚C - 0.38 0.46 V IF = 30 A; Tj = 125˚C - 0.52 0.6 V IF = 30 A - 0.6 0.67 V IR Reverse current V R = VRWM -15 m A VR = VRWM ; Tj = 100˚C - 22 40 mA C d Junction capacitance V R = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C - 700 - pF March 1998 2 Rev 1.000

Philips Semiconductors Product specification Rectifier diodes PBYL3025CT, PBYL3025CTB series Schottky barrier Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.4. Typical reverse leakage current per diode; IR = f(VR ); parameter Tj Fig.5. Typical junction capacitance per diode; C d = f(VR ); f = 1 MHz; Tj = 25˚C to 125 ˚C. Fig.6. Transient thermal impedance per diode; Zth j-mb = f(tp). 0 5 10 15 20 25 D = 1.0 0.5 0.2 0.1 PBYL3025CT Rs = 0.009 Ohms Vo = 0.32 V Average forward current, IF(AV) (A) Forward dissipation, PF (W) Tmb(max) / C 150 T I D = tp tp T t 146 142 138 134 130 126 0 5 10 15 20 2510uA 100uA 1mA 10mA 100mA 1A PBYR2025CT VR / V IR / A 100 Tj = 150 C 125 0 5 10 15 a = 1.57 1.9 2.2 2.8 PBYL3025CT Rs = 0.009 Ohms Vo = 0.32 V Average forward current, IF(AV) (A) Forward dissipation, PF (W) Tmb(max) / C 150 146 142 138 134 130 1 10 100100 1000

10000 PBYR2025CT

0 0.2 0.4 0.6 0.8 10 PBYR2025CT VF / V IF / A Tj = 125 C Tj = 25 C typ max 1us 10us 100us 1ms 10ms 100ms 1s 10s0.001 0.01 0.1 PBYL3025CTpulse width, tp (s) Transient thermal impedance, Zth j-mb (K/W) D = tp tp T TP t D March 1998 3 Rev 1.000

Philips Semiconductors Product specification Rectifier diodes PBYL3025CT, PBYL3025CTB series Schottky barrier MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.7. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10,3 max 3,7 2,8 3,03,0 max not tinned 1,3 max (2x) 123 2,4 0,6 4,5 max 5,9 min 15,8 max 1,3 2,54 2,54 0,9 max (3x) 13,5 min March 1998 4 Rev 1.000

Philips Semiconductors Product specification Rectifier diodes PBYL3025CT, PBYL3025CTB series Schottky barrier MECHANICAL DATA Dimensions in mm Net Mass: 1.4 g Fig.8. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm Fig.9. SOT404 : soldering pattern for surface mounting. Notes 1. Epoxy meets UL94 V0 at 1/8". 11 max 4.5 max 1.4 max 10.3 max 0.5 15.4 2.5 0.85 max (x2) 2.54 (x2) 17.5 11.5 9.0 5.08 3.8 2.0 March 1998 5 Rev 1.000

Philips Semiconductors Product specification Rectifier diodes PBYL3025CT, PBYL3025CTB series Schottky barrier DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.  Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1998 6 Rev 1.000