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FENG-JUI TECHNOLOGY CO., LTD EMI SOLUTION-RoHS Your Perfect Inductor R E V . 1 6 0 1 PBF1008R1 TYPE

  • FEATURE 1. SMD Power inductor 2. High current power bead.
  • Applications 1. Filtering of power input pi ns of oscillators or logic devices using high speed clocks 2. Preventing oscillations in high frequency amplifiers
  • Shape and Dimension ●Schematics and Land Patterns(mm) D=2.54 m/m REF.; E=2.30 m/m REF.
  • Specification Part Number Ls(nH) @100KHz DCR (mΩ)±10% Isat (A) (@25℃) Irms(A) (Max) PBF1008R1-R115 115±20% 0.29 75 41 PBF1008R1-R15 150±20% 0.29 72 41 PBF1008R1-R175 175±20% 0.29 62 41 PBF1008R1-R215 215±20% 0.29 48 41 PBF1008R1-R23 230±20% 0.29 43 41 PBF1008R1-R27 270±20% 0.29 37 41 PBF1008R1-R30 300±20% 0.29 32 41 Note1. Measurement frequency of Inductance value : at 100KHz, 0.25V Note2. Measurement ambient temperature of L, DCR and IDC : at 25℃ Note3. Irms: DC current for an approximate temperature rise of 40℃ without core loss. Note4. Isat: Peak current for approximately 20% roll off at +25℃ Note5. Inductance tolerance: M: ±20%

FENG-JUI TECHNOLOGY CO., LTD EMI SOLUTION-RoHS Your Perfect Inductor R E V . 1 6 0 1 GENERAL CHARACTERISTICS 1. Operating temperature range: -40 TO + 125 (I ncludes temperature when the coil is heated)℃ 2. External appearance: On visual inspection, the coil has no external defects. 3. Terminal strength: After soldering. Between copper plat e and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec. 4. Insulating resistance: Over 100M Ω at 100V D.C. between coil and core. 5. Dielectric strength: No dielectric breakdow n at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics: I nductance coefficient (0~2,000)x10-6/ (℃ -25~+80 ).℃ 7. Humidity characteristics(Moisture Resistance): Indu ctance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2 and 1 hour drying under normal condition.℃ 8. Vibration resistance: Inductance deviation within ±5%, af ter vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance: Inductance deviation within ±5 %, after being dropped once with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260 , 10 seconds(See attached recommend reflow)℃ 11. Storage environment: Storage condition: Temper ature Range: 10 ~ 35 (Generally: 21 ~ 31 ) , ℃℃ ℃℃ Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) ; Transportation condition: Temperature Range: -35 ~ 85 , Humidity Range: 50% ~ 95% RH℃℃ 12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use. 13. Reflow profile recommend: 260 ℃ 230 ℃ 300 250 200 150 100 T( ℃ ) T(s 300240180120600 Lead-free heat endurance test 245℃ Peak 230℃ 170±10℃,60-120 S 300 250 200 150 100 T(℃) T(s) 300240180120600 Lead-free the recommended reflow condition