PBB190 LITTELFUSE | Alldatasheet
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5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Surface Mount, Tape & Reel Version Available Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Switching Characteristics of Normally Closed Devices Form-B IF 10% 90% ILOAD toff ton + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Approvals PBB190 is a dual single-pole, normally closed (1-Form-B) solid state relay with two independently controlled switches that use optically coupled MOSFET technology to provide 5000V rms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package. UL Recognized Component: File E76270 TUV EN 62368-1: Certificate # B 082667 0008
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 PBB190 Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Parameter Ratings Units Blocking Voltage 400 V P Reverse Input Voltage 5 V LED Forward Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output (60 Seconds) 5000 V rms ESD Rating, Human Body Model 8 kV Operational T emperature, Ambient -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage I L=1AV DRM 400 - - V P Load Current 1 Continuous I F=0mA IL - - 130 mA rms / mADC Peak I F=0mA, t=10ms - - ±400 mA P On-Resistance 2 IF=0mA, IL=130mA R ON --2 5 Off-State Leakage Current I F=2mA, VL=400VP ILEAK -- 1 A Switching Speeds T urn-On I F=5 mA, VL=10V ton -- 1 ms T urn-Off t off - - 2.5 Output Capacitance I F=5mA, VL=50V , f=1MHz C OUT -1 1 - p F Input Characteristics LED Forward Current T o Activate 3 IL=130mA IF - 0.38 2 mA T o Deactivate - 0.2 0.35 - Input Voltage Drop I F=5mA V F 0.9 1.36 1.5 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance V IO=0V , f=1MHz C IO -3 - p F 1 If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is no t exceeded. 2 Measurement taken within 1 second of on-time. 3 For high temperature operation (>60ºC), a minimum LED drive current of 4mA is recommended.
INTEGRATED CIRCUITS DIVISION PBB190 www.ixysic.com 3R05 LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) LED Forward Current (mA) Device Count (N) Typical LED Forward Current to Activate (N=50, IL=100mA) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) Blocking Voltage (VP) 460 465 470 475 480 485 490 495 Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 300 400 500 600 700 800 900 Turn-On Time vs. Temperature (IL=75mA) IF=5mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 1000 1500 2000 2500 3000 3500 4000 4500 5000 Turn-Off Time vs. Temperature (IL=75mA) IF=2mA IF=5mA Temperature (ºC) -50 -25 0 25 50 75 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Typical LED Forward Voltage Drop vs. Temperature IF=10mA IF=5mA IF=2mA LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 710 715 720 725 730 735 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (Ps) 1000 2000 3000 4000 5000 6000 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 PBB190 Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Current (mA) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 LED Forward Current to Activate vs. Temperature (IL=75mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On Resistance (:) On-Resistance vs. Temperature (IF=0mA, IL=75mA) Load Voltage (V) Load Current (A) -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 Typical Load Current vs. Load Voltage (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (A) 0.08 0.09 0.10 0.11 0.12 0.13 0.14 Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) 440 445 450 455 460 465 470 475 480 Typical Blocking Voltage vs. Temperature (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage (nA) 100 150 200 250 300 350 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (IF=5mA, VL=400V) Load Voltage (V) 0 50 100 150 200 Output Capacitance (pF) 100 120 140 Output Capacitance vs. Load Voltage (IF=5mA, f=1MHz) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) 0.0 0.2 0.4 0.6 0.8 1.0 Energy Rating Curve PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION PBB190 www.ixysic.com 5R05 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation PBB190S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classifi cation Temperature (Tc) Dwell Time (t P) Max Refl ow Cycles PBB190S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles PBB190 260ºC 250ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R05 PBB190 PBB190 PBB190S Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7 .239 TYP . (0.285) 7 .620 ± 0.254 (0.300 ± 0.010)
4.064 TYP
(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Notes: 1 . Controlling dimension: Inches 2. Leadframe thickness does not include solder plating (1000μinches max) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7 .620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1 .65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Notes: 1 . Controlling dimension: Inches 2. Coplanarity = 0.004” (0.102 mm) max 3. Leadframe thickness does not include solder plating (1000μinches max) Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION Specification: DS-PBB190-R05 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/20257 PBB190 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. Dimensions mm (inches)User Direction of Feed NOTES: 1 . Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1=4.20 (0.165) K0=4.90 (0.193) P1=12.00 (0.472) 16.0±0.3 (0.63±0.012) B0=10.30 (0.406) A0=10.30 (0.406) 4.0 (0.16) 2.0 (0.08) 7. 5 (0.30) PBB190STR Tape & Reel