PBB150 LITTELFUSE | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 5
Technical content
Features
Description
Ordering Information
3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Surface Mount, Tape & Reel Versions Available Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Switching Characteristics of Normally Closed Devices Form-B IF 10% 90% ILOAD toff ton + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 PBB150 is a dual single-pole, normally closed (1-Form-B) solid state relay comprising two independently controlled, optically coupled MOSFET switches that use optically coupled MOSFET technology to provide 3750V rms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package. UL Recognized Component: File E76270 TUV EN 62368-1: Certificate # B 082667 0008
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R09 PBB150 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Parameter Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage I L=1AV DRM 250 - - V P Load Current Continuous 1 -I L - - 250 mA rms / mADC Peak t=10ms I LPK - - ±500 mA P On-Resistance 2 IL=250mA R ON -- 7 Off-State Leakage Current V L=250VP ILEAK -- 1 A Switching Speeds T urn-On I F=5mA, VL=10V ton - - 2.5 ms T urn-Off t off - - 2.5 Output Capacitance I F=5mA, VL=50V , f=1MHz C OUT - 110 - pF Input Characteristics Input Control Current to Activate I L=250mA I F -- 5m A Input Control Current to Deactivate - I F 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.36 1.5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Input to Output Capacitance V IO=0V , f=1MHz C IO -3 - p F 1 If both poles operate simultaneously, then the load current must be derated in order not to exceed the package power dissipati on value. 2 Measurement taken within one second of on-time. Parameter Ratings Units Blocking Voltage 250 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature, Ambient -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION PBB150 www.ixysic.com 3R09 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation PBB150S MSL 1 PBB150P MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classifi cation Temperature (Tc) Dwell Time (t P) Max Refl ow Cycles PBB150S 250ºC 30 seconds 3 PBB150P 245ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles PBB150 260ºC 250ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R09 PBB150 Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7 .239 TYP . (0.285) 7 .620 ± 0.254 (0.300 ± 0.010)
4.064 TYP
(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Notes: 1 . Controlling dimension: Inches 2. Leadframe thickness does not include solder plating (1000μinches max) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7 .620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1 .65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Notes: 1 . Controlling dimension: Inches 2. Coplanarity = 0.004” (0.102 mm) max 3. Leadframe thickness does not include solder plating (1000μinches max) Dimensions mm (inches) PCB Land Pattern 9.398 ± 0.127 (0.370 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7 .620 ± 0.254 (0.300 ± 0.010) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.286 MAX. (0.090 MAX.) 0.203 ± 0.013 (0.008 ± 0.0005) 0.635 ± 0.127 (0.025 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 0.457 ± 0.076 (0.018 ± 0.003) 2.159 ± 0.025 (0.085 ± 0.001) 2.54 (0.10) 8.70 (0.3425)1 .55 (0.0610) 0.65 (0.0255) 0.864 ± 0.120 (0.034 ± 0.004) Pin 1 Notes: 1 . Controlling dimension: Inches 2. Coplanarity = 0.004” (0.102 mm) max 3. Leadframe thickness does not include solder plating (1000μinches max) 3. Sum of package height, standoff, and coplanarity shall not exceed 0.090” (2.286 mm) PBB150 PBB150S PBB150P Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION PBB150 Specification: DS-PBB150-R09 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/2025 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. Dimensions mm (inches)User Direction of Feed NOTES: 1 . Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1=4.20 (0.165) K0=4.90 (0.193) P1=12.00 (0.472) 16.0±0.3 (0.63±0.012) B0=10.30 (0.406) A0=10.30 (0.406) 4.0 (0.16) 2.0 (0.08) 7. 5 (0.30) Dimensions mm (inches) NOTES: 1 . All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm User Direction of Feed Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) P1 = 12.00 (0.472) W = 16.00 (0.63)B0 = 10.30 (0.406) A0 = 10.30 (0.406) K1 = 2.00 (0.079) K0 = 2.70 (0.106) 7 .50 (0.295) 2.00 (0.079) 4.00 (0.157) PBB150STR Tape & Reel PBB150PTR Tape & Reel