PAHP20

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 3

Technical content

Features

Magnetically Shielded Construction for power circuits using metallic magnetic material Compatible with high-density mounting RoHs Compliant and Halogen Free

• Electrical Inductance Range: .24µH to 4.7µH Tolerance: 20% over entire range Test Frequency: 1MHz Operating Temp: -40°C to +125°C MSL: Level 1 Isat: The Current at which the Inductance will drop by 30% typically. Irms: The Curren at which the Coil temperature will rise by approximately 40°C without core loss. Resistance to Soldering Heat Pre-heating: 150ºC, 1min Solder: Sn96.5% Ag3% Cu0.5% Temperature: 245±5°C Flux for lead free: Rosin. 9.5% Dip time: 4±1sec Depth: completely cover the termination Test Equipment Inductance: HP4284A, CH11025, CH3302, CH1320, CH1320S LCR Meter DCR: CH16502 ,Agilent 33420A Micro-Ohm Meter Physical Packaging: 2000 pieces per 7 inch reel. 05/24/2017 Dimensions: DCR (Ω) Typ. DCR (Ω) Max. I sat (A) Max. I rms (A) Typ. I rms (A) Max. 7.50 5.50 5.20 5.10 4.50 3.20 2.70 1.60 6.50 5.00 4.50 4.40 4.00 2.80 2.40 1.40 5.70* 6.50** 5.50* 5.60** 4.70* 5.30** 3.90* 4.20** 3.20* 3.40** 2.90* 3.10** 2.20* 2.30** 1.60* 1.80** 5.10* 5.50** 5.00* 5.20** 4.30* 4.70** 3.50* 3.80** 2.90* 3.10** 2.50* 2.70** 2.00* 2.10** 1.40* 1.60** .020 .023 .029 .044 .060 .082 .120 .216 .015 .018 .024 .036 .050 .068 .100 .180 0.24 0.33 0.47 0.68 1.0 1.5 2.2 4.7 Test Measurement PCB Data: A B C D E *Irms Material : FR4 Board Dimensions : 100 x 50 x 1.6t mm Pattern dimensions : 45 x 30 mm (Double sided board) Pattern thickness : 50µm **Irms Material : FR4 Board Dimensions : 100 x 50 x 1.6t mm Pattern dimensions : 45 x 45 mm (Double sided board) Pattern thickness : 70µm .079-.004/+.008 (2.0 -0.1/+0.2) .063-.004/+.008 (1.6 -0.1/+0.2) .039 (1.0)Max .019 (0.5)Ref .039 (1.0)Ref Reflow times: 3 times max. TEMPERATURE(°C) 60~180s 60~150s 217 150 TIME( sec.) 200 480s max. PRE-HEAT ING Reflow Soldering SOL DERING NATURAL COOL ING TP(260℃ / 10s max.) inch (mm) Reflow times: 1 time max. TEMPERATURE(°C) within 4-5s 150 TIME( sec.) Over 60s 350 PRE-HEAT ING Iron Soldering SOL DERING Gradual Cooling NATURAL COOLING H LG L G H .091 (2.3) .031 (0.8) .039 (1.0) Recommended PCB Layout

SMD ShieldedPower Inductor PAHP20 RoHS ALLIED COMPONENTS INTERNATIONAL949-356-1780 www.a llie dcompone nts.com 05/24/2017 Typical Performance Curves 0 2 4 6 8 DC Current(A) 0.1 0.2 0.3 0.4 Inductance(µH) PAHP20-R24M 0 1.5 3 4.5 6 DC Current(A) 0.15 0.3 0.45 0.6 Inductance(µH) PAHP20-R33M 0 1.5 3 4.5 6 DC Current(A) 0.2 0.4 0.6 0.8 Inductance(µH) PAHP20-R47M 0 1.5 3 4.5 6 DC Current(A) 0.3 0.6 0.9 1.2 Inductance(µH) PAHP20-R68M 0 1234 5 DC Current(A) 0.5 1.5 Inductance(µH) PAHP20-1R0M 0 1 2 3 4 DC Current(A) 0.7 1.4 2.1 2.8 Inductance(µH) PAHP20-1R5M 0 0.7 1.4 2.1 2.8 DC Current(A) Inductance(µH) PAHP20-2R2M 0 0.5 1 1.5 2 DC Current(A) Inductance(µH) PAHP20-4R7M

SMD Shielded Power Inductor PAHP20 RoHS ALLIED COMPONENTS INTERNATIONAL949-356-1780 www.a llie dcompone nts.com 05/24/2017 Reel Dimension Tape Dimension Tearing Off Force Top cover tape 165° to180° Base tape F Type A(mm) B(mm) C(mm) D(mm) 178x8mm 50 Min 13±0.8 The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. Room Temp. ( )℃ Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 8.4±1.0 Packaging Information Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. PAHP20 Series meets IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40°C and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. A B D C 178x8mm t Ko P2:2±0.05 P Bo Ao Po:4±0.1 W:8.0±0.1 Bottom View 178±2.0