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Technical content

Features

 One Upstream USB Port Terminator, EMI Filter and Transient Overvoltage Protector in a Single Surface−Mount Package  Compact SC70 or SOT23 Package Saves Board Space and Lowers Manufacturing Costs Compared to Discrete Solutions  ESD Protection to 30 kV Contact Discharge per MIL−STD−883D, Method 3015  ESD Protection to 15 kV Contact Discharge per IEC 61000−4−2 International Standard  These Devices are Pb−Free and are RoHS Compliant

Applications

 ESD Protection and Termination of USB Port  All USB Peripherals (PC Printers, Scanners, Zip Drives, etc.)  PDAs/Handheld PCs  Digital Cameras  Wireless Handsets  MP3 Players  Cable Modems http://onsemi.com MARKING DIAGRAM Device Package Shipping †

ORDERING INFORMATION

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. PACUSB−U2Y6R SOT23 −6 (Pb−Free) 3000/Tape & Reel ELECTRICAL SCHEMATIC 6R1 GND PACUSB−U3Y6R SOT23 −6 (Pb−Free) 3000/Tape & Reel PACUSB−U1R SC70 −6 (Pb−Free) 3000/Tape & Reel PACUSB−U2R SC70 −6 (Pb−Free) 3000/Tape & Reel PACUSB−U3R SC70 −6 (Pb−Free) 3000/Tape & Reel UxYR UxYR = Specific Device Code UxR = Specific Device Code x = 1, 2, 3 UxR D1_i D2_i V3.3 D1_c D2_c i = input; c = connector SOT23−6 CASE 527AJ SC70−6 CASE 419AD

Note 2: SOT23 and SC70 package sizes may differ. These drawing are not in scale. Table 1. PIN DESCRIPTIONS

1 D1_i The USB Controller side of the D+ or D− bidirectional transmission line of the differential pair

2 GND The ground reference for the PACUSB−U1/U2/U3 device.

3 D2_i The USB Controller side of the D− or D+ bidirectional transmission line of the differential pair

5 V3.3 The 3.3 V supply voltage for the PACUSB−U1/U2/U3 device. Table 2. ABSOLUTE MAXIMUM RATINGS Table 3. STANDARD OPERATING CONDITIONS

PACUSBU−S http://onsemi.com SPECIFICATIONS (Cont’d) Table 4. ELECTRICAL OPERATING CHARACTERISTICS

3.3 Pin)

  1. ESD applied to input/output/V3.3 pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter

to the ESD pin (i.e., if ESD is applied to pin 1, then clamping voltage is measured at pin 6). Unused pins are open.

APPLICATION INFORMATION

The P ACUSB−U1/U2/U3 is targeted for upstream USB ports (peripherals). It provides series termination, EMI filtering, and ESD protection for the two USB data lines D+ and D−. The USB Specification revision 1.1 provides for two data rates:  The Full Speed signaling bit rate at 12 Mbits per second, and  The Low Speed signaling bit rate at 1.5 Mbits per second. The speed is selected by connecting one of the data lines (D+ or D−) to a 3.3 V supply voltage via a 1.5 k/C0087 pull−up resistor (R2). Connections for Full Speed Operation Full Speed devices have the pull−up resistor (R2) connected to the D+ data line, as shown in Figure 1. Pin1 is tied to the D+ line of the USB controller. Pin 6 is connected to the D+ line on the USB connector. Connections for Low Speed Operation Low Speed devices have the pull−up resistor (R2) connected to the D− data line, as shown in Figure 2. Pin 1 is tied to the D− line of the USB controller; pin 6 is connected to the D− line on the USB connector.

PACUSBU−S http://onsemi.com PACKAGE DIMENSIONS SOT−23, 6 Lead CASE 527AJ−01 ISSUE A D DETAIL A L b A DETAIL A c DIM MIN MAX MILLIMETERS A1 0.00 0.15 A2 0.90 1.30 b 0.20 0.50 c 0.08 0.26 D 2.70 3.00 E 2.50 3.10 E1 1.30 1.80 e 0.95 BSC L2 0.25 BSC L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DATUM C IS THE SEATING PLANE. 0.20 0.60 A --- 1.453 E SIDE VIEW TOP VIEW END VIEW A SAM0.20 SEATING PLANE B C SBe *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 3.30 0.95 0.85 DIMENSIONS: MILLIMETERS 0.56 PITCH RECOMMENDED 0.10 C C SEATING PLANE GAGE PLANE

PACUSBU−S http://onsemi.com PACKAGE DIMENSIONS SC−88 (SC−70 6 Lead), 1.25x2 CASE 419AD−01 ISSUE A D A L L1 L2 ee b c TOP VIEW SIDE VIEW END VIEW /C01131 /C01131 Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. E /C0113 SYMBOL MIN NOM MAX θ A b c D E e L 0º 8º 0.00 0.15 0.10 0.26 1.80 1.80 1.15

0.65 BSC

0.15 BSC

1.10 0.10 0.30 0.18 0.46 2.20 2.40 1.35 0.80 θ1 4º 10º A2 0.80 1.00

0.42 REF

0.36 2.00 2.10 1.25 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 PACUSBU−S/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative