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9.1-9.5GHz 400W SOLID STATE POWER AMPLIFIER MtronPTI P/N: PA4002P
FEATURES
Small form factor rack mounted system High power GaN pulse devices Instantaneous bandwidth Suitable for linear pulse applications Built-in protection circuits High reliability and ruggedness ELECTRICAL SPECIFICATIONS Parameter Specification Notes Operating Frequency Range 9.1 - 9.5 GHz Peak Output Power 400 Watt Min 20% Duty Cycle Output Power Flatness 0 to +2 dB Over operating & Temp Range Input Power 0 - 5 dBm Pulsed Saturated Gain 56 dB Min Output Power Control 6 dB, 50 - 56 dBm, 1 dB steps Pulse Width 0.35 µSec - 50 µSec Measured @ 50% pt. Duty Cycle 20% Max Pulse Repetition Frequency (PRF) 5 KHz Max, ±5% staggering Rise / Fall Time 75 nsec Droop <0.8 dB Max 50 µSec PW, 20% duty Input / Output VSWR 1.5 : 1 Relative to 50 Ohm Harmonics -60dBc Max Internal Harmonics Filter Phase drift within pulse 7.5° Max (Linear) Out of Band Spurious levels -65 dBc Max Over Temp. Alarm ON: TTL Low >75°C OFF: TTL High <70°C Load VSWR 2.5 : 1 Without damage Gate Control Inputs PA OFF: TTL High PA ON: TTL Low TTL pulse precedes RF by 2 µSec AC Input Voltage 230 VAC, ±10%, 50 Hz ±3 Hz <1kVA Noise Figure <10dB Detected RF Output Pout = 0: VDET = 0 - 5 VDC Pout = Max: VDET = 4 - 4.5 VDC Continuous DC Voltage Phase Noise -70 dBc/Hz @ 100 Hz from carrier ENVIRONMENTAL CHARACTERISTICS Parameter Specification Notes Operating Ambient Temperature -20 to +55°C MIL-STD 810F, 502.4/501.4 Storage Temperature -30 to +70°C MIL-STD 810F, 502.4/501.4 Relative Humidity 95% @ 40°C MIL-STD 810F, Method 507.4 Shock (Bump) 25 g for 6 msec, 2-3 Bumps/Sec. 400 Bumps MIL-STD 810F, Method 516.5 Vibrations 2m/S2 from 20 -50 Hz 2m/S2 from 20 -500 Hz MIL-STD 810F, Method 514.5 Altitude 5160 m MIL-STD 810F, Method 500.4 EMI/EMC Conducted Susceptibility, Radiated Emissions MIL STD 461E, Method CS101 MIL STD 461E, Method RE102
9.1-9.5GHz 400W SOLID STATE POWER AMPLIFIER MtronPTI P/N: PA4002P MECHANICAL SPECIFICATIONS Parameter Specification Notes Dimensions W x H x D 430 x 560 x 133.3 mm Standard 3U Weight 20 Kg. Max RF Input Connector SMA (F) Jack RF Output Connector WR 90 UG 136B/U (Choke Flange) Aluminum w threaded holes RF Sample Port SMA (F) Jack 0 – 6 dBm Detected RF Power BNC (F) Pulsed DC AC Power Amphenol, 97 – 3102A-2209 P (3 pin) or equivalent Transmit Gating Signal 3 pin D38999 SERIES III (M) Circular connector RS422, 1 rtn Monitor & Control Ethernet RJ-45 circular connector TCP/IP RS422/485 D-sub 9S port for redundancy Remote Bluetooth application Cooling Built in Fan Cooling Poly phase coded waveform (20 MHz bandwidth) Poly phase coded waveform (20 MHz bandwidt h 350 ns 20µs/50 µs 350 ns 20µs/50 µs 24 µS/54 µS 200µs /500 µs Fig.1 TYPICAL I/P RF WAVEFORM (DETECTOR O/P)
9.1-9.5GHz 400W SOLID STATE POWER AMPLIFIER MtronPTI P/N: PA4002P OUTLINE DRAWING