LP87561-Q1_V08 TI | Alldatasheet

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Technical content

Output Current (A) Efficiency (%) 0.001 0.01 0.1 1 10 20 20 100 D530 4PH, Vout=1.8V, Vin=3.7V 3PH, Vout=1.8V, Vin=3.7V 2PH, Vout=1.8V, Vin=3.7V 1PH, Vout=1.8V, Vin=3.7V SW_B0 SW_B1 SW_B2 SW_B3 FB_B0 FB_B1 Configurable multi-phase 1 - 4 Outputs FB_B2 FB_B3 VIN_B0 VIN_B1 VIN_B2 VIN_B3 VANA VIN NRST SDA SCL nINT CLKIN EN1 (GPIO1) EN2 (GPIO2) EN3 (GPIO3) GNDs PGOOD Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LP87561-Q1 LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 LP8756x-Q116-ABuckConverterWithIntegratedSwitches

1 Features

1• Qualified for Automotive Applications

  • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B
  • Input Voltage: 2.8 V to 5.5 V
  • Output Voltage: 0.6 V to 3.36 V
  • Four High-Efficiency Step-Down DC/DC Converter Cores: – Maximum Output Current: 16 A (4 A per Phase) – Programmable Output Voltage Slew-Rate: 0.5 mV/µs to 10 mV/µs
  • Switching Frequency: 2 MHz
  • Spread-Spectrum Mode and Phase Interleaving
  • Configurable General Purpose I/O (GPIOs)
  • I2C-Compatible Interface That Supports Standard (100 kHz), Fast (400 kHz), Fast+ (1 MHz), and High-Speed (3.4 MHz) Modes
  • Interrupt Function With Programmable Masking
  • Programmable Power-Good Signal (PGOOD)
  • Output Short-Circuit and Overload Protection
  • Overtemperature Warning and Protection
  • Overvoltage Protection (OVP) and Undervoltage Lockout (UVLO)

2 Applications

Automotive Infotainment, Cluster, Radar, and Camera Power Applications space Simplified Schematic

3 Description

The LP8756x-Q1 device is designed to meet the power-management requirements of the latest processors and platforms in various automotive power applications. The device contains four step- down DC/DC converter cores, which are configured as a 4-phase output, 3-phase and 1-phase outputs, 2-phase and 2-phase outputs, one 2-phase and two 1-phase outputs, or four 1-phase outputs. The device is controlled by an I2C-compatible serial interface and by enable signals. The automatic pulse-width-modulation (PWM) to pulsed-frequency-modulation (PFM) operation (AUTO mode), together with the automatic phase adding and phase shedding, maximizes efficiency over a wide output-current range. The LP8756x-Q1 supports remote differential-voltage sensing for multiphase outputs to compensate IR drop between the regulator output and the point-of-load (POL) improving the accuracy of the output voltage. The switching clock can be forced to PWM mode and also synchronized to an external clock to minimize the disturbances. The LP8756x-Q1 device supports load-current measurement without the addition of external current- sense resistors. The device also supports programmable start-up and shutdown delays and sequences synchronized to enable signals. The sequences can include GPIO signals to control external regulators, load switches, and processor reset. During start-up and voltage change, the device controls the output slew rate to minimize output- voltage overshoot and in-rush current. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LP87561-Q1 VQFN-HR (26) 4.50 mm × 4.00 mm LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 (1) For all available packages, see the orderable addendum at the end of the data sheet. Efficiency vs Output Current

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Table of Contents

12.4 Receiving Notification of Documentation Updates 86

13 Mechanical, Packaging, and Orderable

4 Revision History

March 2018 * Initial Release

VIN_B3 VIN_B2VIN_B0 VIN_B1 SW_B0 SW_B1 SW_B2 SW_B3 PGND_B01 PGND_B23 9 10 11 12 13 2223242526 FB_B3 FB_B0 FB_B1 FB_B2 LP87561-Q1 LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

5 Device Comparison Table

PART NUMBER DC/DC CONFIGURATIONS LP87561-Q1 One 4-phase output LP87562-Q1 One 3-phase and one 1-phase outputs LP87563-Q1 One 2-phase and two 1-phase outputs LP87564-Q1 Four 1-phase outputs LP87565-Q1 Two 2-phase outputs

6 Pin Configuration and Functions

26-Pin VQFN-HR With Thermal Pad Top View

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin Pin Functions PIN TYPE(1) DESCRIPTION NO. NAME 1 FB_B2 A Output voltage feedback (positive) for the BUCK2 converter. 2 EN3 D/I/O Programmable enable signal for the buck regulators (can be also configured to select between two buck output-voltage levels). This pin functions alternatively as GPIO3. 3 CLKIN D/I External clock input. Connect this pin to ground if the external clock is not used. 4, 17, Thermal Pad AGND G Ground 5 SCL D/I Serial interface clock input for I2C access. Connect this pin to a pullup resistor. 6 SDA D/I/O Serial interface data input and output for I2C access. Connect this pin to a pullup resistor. 7 EN1 D/I/O Programmable enable signal for the buck regulators (can be also configured to select between two buck output voltage levels). This pin functions alternatively as GPIO1. 8 FB_B0 A Output voltage feedback (positive) for the BUCK0 converter.

9 VIN_B0 P

Input for the BUCK0 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.

10 SW_B0 A BUCK0 switch node

11 PGND_B01 G Power ground for the BUCK0 and BUCK1 converters

12 SW_B1 A BUCK1 switch node

13 VIN_B1 P

Input for the BUCK1 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed. 14 FB_B1 A Output voltage feedback (positive) for the BUCK1 converter. This pin functions alternatively as the output ground feedback (negative) for the BUCK0 converter. 15 EN2 D/I/O Programmable enable signal for the buck regulators (can be also configured to select between two buck output voltage levels). This pin functions alternatively as GPIO2.

16 PGOOD D/O Power-good indication signal

18 VANA P Supply voltage for the analog and digital blocks. This pin must be connected to the same node as VIN_Bx. 19 nINT D/O Open-drain interrupt output. This pin is active low.

20 NRST D/I Reset signal for the device

21 FB_B3 A Output voltage feedback (positive) for the BUCK3 converter. This pin functions alternatively as the output ground feedback (negative) for the BUCK2 converter.

22 VIN_B3 P

Input for the BUCK3 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.

23 SW_B3 A BUCK3 switch node

24 PGND_B23 G Power ground for the BUCK2 and BUCK3 converters

25 SW_B2 A BUCK2 switch node

26 VIN_B2 P

Input for the BUCK2 converter. The separate power pins, VIN_Bx, are not connected together internally. The VIN_Bx pins must be connected together in the application and be locally bypassed.

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2) MIN MAX UNIT Voltage on power connections VIN_Bx, VANA –0.3 6 V Voltage on buck switch nodes SW_Bx –0.3 (VIN_Bx + 0.3 with 6 V maximum V Voltage on buck voltage sense nodes FB_Bx –0.3 (VANA + 0.3 V) with 6 V maximum V Voltage on NRST input NRST –0.3 6 V Voltage on logic pins (input or output pins) SDA, SCL, nINT, CLKIN –0.3 6 V EN1 (GPIO1), EN2 (GPIO2), EN3 (GPIO3), PGOOD –0.3 (VANA + 0.3 V) with 6 V maximum V Maximum lead temperature (soldering, 10 sec.) 260 °C Junction temperature, TJ-MAX –40 150 °C Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 All pins ±500 Corner pins (1, 8, 14, and 21) ±750

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT INPUT VOLTAGE Voltage on power connections VIN_Bx, VANA 2.8 5.5 V Voltage on NRST NRST 1.65 VANA with

5.5 V maximum V

Voltage on logic pins (input or output pins) nINT, CLKIN 1.65 5.5 V Voltage on logic pins (input or output pins) ENx, PGOOD 0 VANA with Voltage on I2C interface, standard (100 kHz), fast (400 khz), fast+ (1 MHz), and high-speed (3.4 MHz) modes SCL, SDA 1.65 1.95 V Voltage on I2C interface, standard (100 kHz), fast (400 kHz), and fast+ (1 MHz) modes SCL, SDA 3.1 VANA with

3.6 V maximum V

Junction temperature, TJ –40 140 °C Ambient temperature, TA –40 125 °C

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.4 Thermal Information

THERMAL METRIC(1) LP8756x-Q1 UNITRNF (VQFN-HR)

26 PINS

RθJA Junction-to-ambient thermal resistance 34.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 16.5 °C/W RθJB Junction-to-board thermal resistance 4.7 °C/W ψJT Junction-to-top characterization parameter 0.6 °C/W ψJB Junction-to-board characterization parameter 4.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 °C/W (1) All voltage values are with respect to network ground. (2) Minimum (Min) and Maximum (Max) limits are specified by design, test, or statistical analysis. Typical (Typ) numbers are not verified, but do represent the most likely norm. (3) The output voltage slew-rate setting may limit the maximum output capacitance.

7.5 Electrical Characteristics

–40°C ≤ TJ ≤ +140°C, CPOL = 22 µF/phase, specified VVANA, VVIN_Bx , VNRST, VVOUT_Bx, and IOUT range, unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted(1) (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT EXTERNAL COMPONENTS CIN Input filtering capacitance Connected from VIN_Bx to PGND_Bx 1.9 10 µF COUT Output filtering capacitance per phase, local 10 22 µF CPOL Optional point-of-load (POL) capacitance per phase 22 µF COUT-TOTAL Total output capacitance(3) (local and POL) 4-phase output Output voltage slew-rate ≤ 1.9 mV/µs 2000 µF 3-phase output Output voltage slew-rate ≤ 1.9 mV/µs 1500 2-phase output Output voltage slew-rate ≤ 1.9 mV/µs 1000 1-phase output Output voltage slew-rate ≤ 1.9 mV/µs 500 ESRC ESR of the input and output capacitor 1 MHz ≤ f ≤ 10 MHz 2 10 mΩ L Inductance of the inductor 0.47 µH –30% 30% DCRL Inductor DCR 25 mΩ BUCK REGULATOR VVIN_Bx Input voltage range 2.8 3.7 5.5 V VVOUT_Bx Programmable output voltage range 0.6 3.36 V Output voltage step size 0.6 V ≤ VVOUT < 0.73 V 10 mV0.73 V ≤ VVOUT < 1.4 V 5 1.4 V ≤ VVOUT ≤ 3.36 V 20

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Electrical Characteristics (continued) –40°C ≤ TJ ≤ +140°C, CPOL = 22 µF/phase, specified VVANA, VVIN_Bx , VNRST, VVOUT_Bx, and IOUT range, unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted(1) (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (4) The maximum output current can be limited by the forward current limit ILIM FWD and by the junction temperature. The power dissipation inside the die depends on the length of the current pulse and efficiency and the junction temperature may increase to thermal shutdown level if the board and ambient temperatures are high. IOUT Output current(4) 4-phase output VIN ≥ 3 V 16 A

2.8 V ≤ VIN < 3 V 12

VIN ≥ 3 V 12

2.8 V ≤ VIN < 3 V 9

VIN ≥ 3 V 8

2.8 V ≤ VIN < 3 V 6

VIN ≥ 3 V 4

2.8 V ≤ VIN < 3 V 3

Input and output voltage difference Minimum voltage between VIN_x and VOUT to fulfill the electrical characteristics 0.5 V VVOUT_DC DC output voltage accuracy, includes voltage reference, DC load and line regulations, process, and temperature VOUT < 1 V, PWM mode –20 20 mV VOUT ≥ 1 V, PWM mode –2% 2% VOUT < 1 V, PFM mode –20 40 mV VOUT ≥ 1 V, PFM mode –2% 2% + 20 mV Ripple voltage 4-phase output PWM mode, ESRC < 2 mΩ, L = 0.47 µH 3 mVp-p PFM mode, L = 0.47 µH 4 3-phase output PWM mode, ESRC < 2 mΩ, L = 0.47 µH 4 PFM mode, L = 0.47 µH 5 2-phase output PWM mode, ESRC < 2 mΩ, L = 0.47 µH 6 PFM mode, L = 0.47 µH 7 1-phase output, PWM mode, ESRC < 2 mΩ, L = 0.47 µH 8 PFM mode, L = 0.47 µH 14 DCLNR DC line regulation IOUT = IOUT(max) 0.1 %/V DCLDR DC load regulation in PWM mode VOUT = 1 V, 0 A ≤ IOUT ≤ IOUT(max) 0.8%

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Electrical Characteristics (continued) –40°C ≤ TJ ≤ +140°C, CPOL = 22 µF/phase, specified VVANA, VVIN_Bx , VNRST, VVOUT_Bx, and IOUT range, unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted(1) (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TLDSR Transient load step response 4-phase output

0 A ≤ IOUT ≤ 8 A, tr = tf = 10

µs, PWM mode, COUT = 22 µF/phase, L = 0.47 µH, CPOL = 22 µF/phase –3% 3% mV

0.1 A ≤ IOUT ≤ 8 A, tr = tf = 1

µs, PWM mode, COUT = 22 µF/phase, L = 0.47 µH, CPOL = 22 µF/phase ±40 3-phase output

0 A ≤ IOUT ≤ 6 A, tr = tf = 10

µs, PWM mode, COUT = 22 µF/phase, L = 0.47 µH, CPOL = 22 µF/phase –3% 3%

0.1 A ≤ IOUT ≤ 6 A, tr = tf = 1

µs, PWM mode, COUT = 22 µF/phase, L = 0.47 µH, CPOL = 22 µF/phase ±40 2-phase output

0 A ≤ IOUT ≤ 4 A, tr = tf = 10

µs, PWM mode, COUT = 22 µF/phase, L = 0.47 µH, CPOL = 22 µF/phase –3% 3%

0.1 A ≤ IOUT ≤ 4 A, tr = tf = 1

µs, PWM mode, COUT = 22 µF/phase, L = 0.47 µH, CPOL = 22 µF/phase ±40 1-phase output

0 A ≤ IOUT ≤ 2 A, tr = tf = 10

µs, PWM mode, COUT = 22 µF, L = 0.47 µH, CPOL = 22 µF –3% 3%

0.1 A ≤ IOUT ≤ 2 A, tr = tf = 1

µs, PWM mode, COUT = 22 µF, L = 0.47 µH, CPOL = 22 µF ±40 TLNSR Transient line response VVIN_Bx stepping 3 V ↔ 3.5 V, tr = tf = 10 µs, IOUT = IOUT(max) ±5 mV ILIM FWD Forward current limit for each phase (peak for each switching cycle) Programmable range 1.5 5 A Step size 0.5 Accuracy, VVIN_Bx ≥ 3 V, ILIM ≥ 3 A –5% 7.5% 20% Accuracy, 2.8 V ≤ VVIN_Bx < 3 ILIM NEG Negative current limit per phase (peak for each switching cycle) 1.6 2 2.4 A RDS(ON) HS FET On-resistance, high-side FET Each phase, between VIN_Bx and SW_Bx pins, I = 1 A 29 65 mΩ RDS(ON) LS FET On-resistance, low-side FET Each phase, between SW_Bx and PGND_Bx pins, I = 1 A 17 35 mΩ fSW Switching frequency, PWM mode 1.8 2 2.2 MHz Current balancing for multiphase outputs Current mismatch between phases, IOUT > 1 A/phase 10% Start-up time (soft start) From ENx to VOUT = 0.35 V (slew-rate control begins), COUT_TOTAL = 44 µF/phase 200 µs

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Electrical Characteristics (continued) –40°C ≤ TJ ≤ +140°C, CPOL = 22 µF/phase, specified VVANA, VVIN_Bx , VNRST, VVOUT_Bx, and IOUT range, unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted(1) (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (5) Output capacitance, forward and negative current limits and load current may limit the maximum and minimum slew rates. The actual set fixed slew rate value for specific part number is listed in corresponding TRM document. (6) The final PFM-to-PWM and PWM-to-PFM switchover current varies slightly and is dependent on the output voltage, input voltage, and the inductor current level. Output voltage slew-rate(5) SLEW_RATEx[2:0] = 2h, COUT-TOTAL ≤ 80 µF/phase –15% 10 15% mV/µs SLEW_RATEx[2:0] = 3h, COUT-TOTAL ≤ 130 µF/phase –15% 7.5 15% SLEW_RATEx[2:0] = 4h, COUT-TOTAL ≤ 250 µF/phase –15% 3.8 15% SLEW_RATEx[2:0] = 5h, COUT-TOTAL ≤ 500 µF/phase –15% 1.9 15% SLEW_RATEx[2:0] = 6h, COUT-TOTAL ≤ 500 µF/phase –15% 0.94 15% SLEW_RATEx[2:0] = 7h, COUT-TOTAL ≤ 500 µF/phase –15% 0.47 15% IPFM-PWM PFM-to-PWM current threshold(6) 600 mA IPWM-PFM PWM-to-PFM current threshold(6) 200 mA IADD Phase adding level (multiphase rails) From 1-phase to 2-phase 1 AFrom 2-phase to 3-phase 2 From 3-phase to 4-phase 3 ISHED Phase shedding level (multiphase rails) From 2-phase to 1-phase 0.7 AFrom 3-phase to 2-phase 1.5 From 4-phase to 3-phase 2.4 Output pulldown resistance Regulator disabled 160 230 300 Ω Output voltage monitoring for PGOOD pin Overvoltage monitoring (compared to DC output- voltage level, VVOUT_DC) 39 50 64 mV Undervoltage monitoring (compared to DC output- voltage level, VVOUT_DC) –53 –40 –29 Debounce time during regulator enable PGOOD_SET_DELAY = 0h 4 10 µs Debounce time during regulator enable PGOOD_SET_DELAY = 1h 10 11 13 ms Deglitch time during operation and after voltage change 4 10 µs Power-good threshold for interrupt BUCKx_PG_INT, difference from final voltage Rising ramp voltage, enable or voltage change –20 –14 –8 mV Falling ramp voltage, voltage change 8 14 20 Power-good threshold for status bit BUCKx_PG_STAT During operation, status signal is forced to 0h during voltage change –20 –14 –8 mV

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Electrical Characteristics (continued) –40°C ≤ TJ ≤ +140°C, CPOL = 22 µF/phase, specified VVANA, VVIN_Bx , VNRST, VVOUT_Bx, and IOUT range, unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted(1) (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT EXTERNAL CLOCK AND PLL Nominal frequency of the external input clock 1 24 MHz Nominal frequency step size of the external input clock 1 MHz Required accuracy from nominal frequency of the external input clock –30% 10% Delay time for missing external clock detection 1.8 µs Delay and debounce time for external clock detection 20 µs Clock change delay (internal to external) delay from valid clock detection to use of external clock 600 µs Cycle-to-cycle PLL output clock jitter 300 ps, p- p PROTECTION FUNCTIONS Thermal warning Temperature rising, TDIE_WARN_LEVEL = 0h 115 125 135 Temperature rising, TDIE_WARN_LEVEL = 1h 127 137 147 Thermal warning hysteresis 20 °C Thermal shutdown Temperature rising 140 150 160 °C Thermal shutdown hysteresis 20 °C VANAOVP VANA overvoltage Voltage rising 5.6 5.8 6.1 V Voltage falling 5.45 5.73 5.96 VANA overvoltage hysteresis 40 mV VANAUVLO VANA undervoltage lockout Voltage rising 2.51 2.63 2.75 V Voltage falling 2.5 2.6 2.7 LOAD CURRENT MEASUREMENT Current measurement range Output current for maximum code 20.47 A Resolution LSB 20 mA Measurement accuracy IOUT > 1 A < 10% Measurement time PFM mode (automatically changing to PWM mode for the measurement) µs PWM mode 4 CURRENT CONSUMPTION Shutdown current consumption From VANA and VIN_Bx pins, NRST = 0 V, VANA = VIN_Bx = 3.7 V 1.4 µA Standby current consumption From VANA and VIN_Bx pins, NRST = 1.8 V, VANA = VIN_Bx = 3.7 V, regulators disabled 6.7 µA

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Electrical Characteristics (continued) –40°C ≤ TJ ≤ +140°C, CPOL = 22 µF/phase, specified VVANA, VVIN_Bx , VNRST, VVOUT_Bx, and IOUT range, unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted(1) (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Active current consumption in PFM mode 4-phase enabled: From VANA and VIN_Bx pins, NRST = 1.8 V, VANA = VIN_Bx = 3.7 V, IOUT = 0 mA, not switching, one regulator enabled, internal RC oscillator, PGOOD monitoring enabled µA 3-phase enabled: From VANA and VIN_Bx pins, NRST = 1.8 V, VANA = VIN_Bx = 3.7 V, IOUT = 0 mA, not switching, one regulator enabled, internal RC oscillator, PGOOD monitoring enabled 2-phase enabled: From VANA and VIN_Bx pins, NRST = 1.8 V, VANA = VIN_Bx = 3.7 V, IOUT = 0 mA, not switching, one regulator enabled, internal RC oscillator, PGOOD monitoring enabled 1-phase enabled: From VANA and VIN_Bx pins, NRST = 1.8 V, VANA = VIN_Bx = 3.7 V, IOUT = 0 mA, not switching, one regulator enabled, internal RC oscillator, PGOOD monitoring enabled Active current consumption during PWM operation Each phase 17 mA PLL and clock detector current consumption Additional current consumption when internal RC oscillator, clock detector and PLL are enabled 2 mA DIGITAL INPUT SIGNALS: NRST, EN1, EN2, EN3, EN4, SCL, SDA, GPIO1, GPIO2, GPIO3, CLKIN VIL Input low level 0.4 V VIH Input high level 1.2 V VHYS Hysteresis of Schmitt trigger inputs 10 77 200 mV ENx pulldown resistance ENx_PD = 1h 500 kΩ NRST pulldown resistance Always present 650 1150 1700 kΩ DIGITAL OUTPUT SIGNALS: nINT VOL Output low level ISOURCE = 2 mA 0.4 V RP External pullup resistor To VIO supply 10 kΩ DIGITAL OUTPUT SIGNALS: SDA VOL Output low level ISOURCE = 10 mA 0.4 V DIGITAL OUTPUT SIGNALS: PGOOD, GPIO1, GPIO2, GPIO3 VOL Output low level ISOURCE = 2 mA 0.4 V VOH Output high level, configured to push-pull ISINK = 2 mA VVANA –

0.4 VVANA V

Supply voltage for external pull-up resistor, configured to open-drain VVANA V RPU External pullup resistor, configured to open-drain 10 kΩ ALL DIGITAL INPUTS ILEAK Input current All logic inputs over pin voltage range (except NRST) −1 1 µA

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

7.6 I2C Serial Bus Timing Requirements

These specifications are ensured by design. VIN_Bx = 3.7 V, unless otherwise noted. MIN MAX UNIT ƒSCL Serial clock frequency Standard mode 100 kHz Fast mode 400 Fast mode+ 1 MHzHigh-speed mode, Cb = 100 pF 3.4 High-speed mode, Cb = 400 pF 1.7 tLOW SCL low time Standard mode 4.7 µsFast mode 1.3 Fast mode+ 0.5 High-speed mode, Cb = 100 pF 160 ns High-speed mode, Cb = 400 pF 320 tHIGH SCL high time Standard mode 4 µsFast mode 0.6 Fast mode+ 0.26 High-speed mode, Cb = 100 pF 60 ns High-speed mode, Cb = 400 pF 120 tSU;DAT Data setup time Standard mode 250 ns Fast mode 100 Fast mode+ 50 High-speed mode 10 tHD;DAT Data hold time Standard mode 10 3450 nsFast mode 10 900 Fast mode+ 10 High-speed mode, Cb = 100 pF 10 70 ns High-speed mode, Cb = 400 pF 10 150 tSU;STA Setup time for a start or a repeated start condition Standard mode 4.7 µsFast mode 0.6 Fast mode+ 0.26 High-speed mode 160 ns tHD;STA Hold time for a start or a repeated start condition Standard mode 4 µsFast mode 0.6 Fast mode+ 0.26 High-speed mode 160 ns tBUF Bus free time between a stop and start condition Standard mode 4.7 µsFast mode 1.3 Fast mode+ 0.5 tSU;STO Setup time for a stop condition Standard mode 4 µsFast mode 0.6 Fast mode+ 0.26 High-speed mode 160 ns trDA Rise time of SDA signal Standard mode 1000 ns Fast mode 20 300 Fast mode+ 120 High-speed mode, Cb = 100 pF 10 80 High-speed mode, Cb = 400 pF 20 160

These specifications are ensured by design. VIN_Bx = 3.7 V, unless otherwise noted.

5.5 V) 300

5.5 V) 120

Figure 1. I2C Timing

7.7 Typical Characteristics

DFE252012PD-R47M), COUT = 22 µF / phase, CPOL = 22 µF / phase. Figure 2. Shutdown Current Consumption vs Input Voltage Figure 3. Standby Current Consumption vs Input Voltage Figure 4. PFM Mode Current Consumption vs Input Voltage Figure 5. PFM Mode Current Consumption vs Input Voltage, Figure 6. PFM Mode Current Consumption vs Input Voltage, Figure 7. PFM Mode Current Consumption vs Input Voltage,

DFE252012PD-R47M), COUT = 22 µF / phase, CPOL = 22 µF / phase. Figure 8. PFM Mode Current Consumption vs Input Voltage, One Regulator Enabled (2+2-Phase Output)

8 Detailed Description

8.1 Overview

converter cores for automotive applications. Table 1 lists the output characteristics of the regulators. Table 1. Supply Specification the external clock can be from 1 MHz to 24 MHz with 1-MHz steps.

  • Soft start
  • Input voltage protection: – Undervoltage lockout – Overvoltage protection
  • Output voltage monitoring and protection: – Overvoltage monitoring – Undervoltage monitoring – Overload protection
  • Thermal warning
  • Thermal shutdown Three enable signals can be multiplexed to general purpose I/O (GPIO) signals. The direction and output type (open-drain or push-pull) are programmable for the GPIOs.

Enable, Roof/Floor, Slew-Rate Control Interrupts nINT SDA SCL EN1 (GPIO1) EN2 (GPIO2) VANA OTP EPROM Thermal Monitor Oscillator Buck0 ILIM Det Overload and SC Det Buck1 Buck2 Buck3 ILIM Det Pwrgood Det Overload and SC Det ILIM Det Pwrgood Det Overload and SC Det ILIM Det Pwrgood Det Overload and SC Det Ref & Bias Iload ADC Iload ADC Iload ADC Iload ADC CLKIN EN3 (GPIO3) PGOOD Copyright © 2017, Texas Instruments Incorporated Pwrgood Det LP87561-Q1 LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

8.2 Functional Block Diagram

8.3 Feature Descriptions

8.3.1 Multi-Phase DC/DC Converters

8.3.1.1 Overview

The LP8756x-Q1 includes four step-down DC/DC converter cores which can be configured for:

  • 4-phase single output
  • 3-phase and single-phase outputs
  • dual-phase and two single-phase outputs
  • four single-phase outputs
  • two dual-phase outputs The cores are designed for flexibility; most of the functions are programmable, thus allowing optimization of the regulator operation for each application. The LP8756x-Q1 has the following features:
  • DVS support with programmable slew-rate
  • Automatic mode control based on the loading (PFM or PWM mode)
  • Forced-PWM mode operation
  • Optional external clock input to minimize crosstalk
  • Optional spread spectrum technique to decrease EMI
  • Phase control for optimized EMI
  • Synchronous rectification
  • Current mode loop with PI compensator
  • Soft start
  • Power-Good flag with maskable interrupt
  • Power-Good signal (PGOOD) with selectable sources
  • Average output current sensing (for PFM entry, phase shedding/adding, and load current measurement)
  • Current balancing between the phases of the converter
  • Differential voltage sensing from point of the load for multiphase output
  • Dynamic phase shedding/adding, each output being phase shifted The following parameters can be programmed via registers:
  • Output voltage
  • Forced-PWM operation
  • Forced multiphase operation for multiphase outputs (forces also the PWM operation)
  • Peak current limit for high-side FET
  • Output voltage slew rate
  • Enable and disable delays for regulators and GPIOs controlled by ENx pins There are two modes of operation for the converter, depending on the output current required: pulse-width modulation (PWM) and pulse-frequency modulation (PFM). The converter operates in PWM mode at high load currents of approximately 600 mA or higher. When operating in PWM mode the phases of a multiphase regulator are automatically added/shedded based on the load current level. Lighter output current loads cause the converter to automatically switch into PFM mode for decreased current consumption when forced-PWM mode is disabled. The forced multiphase mode can be enabled for highest transient performance. A multiphase synchronous buck converter offers several advantages over one power stage converter. For application processor power delivery, lower ripple on the input and output currents and faster transient response to load steps are the most significant advantages. Also, because the load current is evenly shared among multiple channels in multiphase output configuration, the heat generated is greatly decreased for each channel due to the fact that power loss is proportional to square of current. The physical size of the output inductor shrinks significantly due to this heat reduction. Figure 9 shows a block diagram of a single core. Interleaving switching action of the multiphase converters is shown in Figure 10.

Figure 9. Detailed Block Diagram Showing One Core

(1) Graph is not in scale and is for illustrative purposes only. Figure 10. Example of PWM Timings, Inductor Current Waveforms, and Total Output Current in 4-Phase

8.3.1.2 Multiphase Operation, Phase Adding, and Phase-Shedding

the load. This is called phase adding/shedding. The concept is shown in Figure 11. automatically to follow the required output current.

(1) Graph is not in scale and is for illustrative purposes only. Figure 11. Multiphase Buck Converter Efficiency vs Number of Phases (Converters in PWM Mode)

8.3.1.3 Transition Between PWM and PFM Modes

modes a high efficiency is achieved over a wide output-load-current range.

8.3.1.4 Multiphase Switcher Configurations

BUCK2 is master for BUCK2, BUCK3 output.

  • BUCKx_CTRL1 register, except EN_RDISx bit
  • BUCKx_CTRL2 register, except ILIMx[2:0] bits
  • BUCKx_VOUT register
  • BUCKx_FLOOR_VOUT register
  • BUCKx_DELAY register
  • interrupt bits related to the slave buck, except BUCKx_ILIM_INT

8.3.1.5 Buck Converter Load-Current Measurement

interrupt (I_LOAD_READY bit in INT_TOP1 register) after the load current measurement sequence is finished. Load current measurement interrupt can be masked with I_LOAD_READY_MASK bit (TOP_MASK1 register). measured current is the output current of the selected phase.

8.3.1.6 Spread-Spectrum Mode

bit (PIN_FUNCTION register), and it affects all the buck cores. spectrum architecture of the LP8756x-Q1 spreads that energy over a large bandwidth. Figure 12. Spread-Spectrum Modulation

8.3.2 Sync Clock Functionality

accuracy limits (–30%/+10%) for valid clock detection.

PLL_MODE[1:0] = 01 and regulator enable (STANDBY-to-ACTIVE transition) when PLL_MODE[1:0] = 10. Figure 13. Clock and PLL Module Table 2. PLL Operation

8.3.3 Power-Up

  • VANA (and VIN_Bx) reach minimum recommended level (VVANA > VANAUVLO).
  • NRST is set to high level (or shorted to VANA). This initiates power-on-reset (POR), OTP reading and enables the system I/O interface. The I2C host must wait at least 1.2 ms before writing or reading data to the LP8756x-Q1.
  • Device goes to the STANDBY mode.
  • The host can change the default register setting by I2C if needed.
  • The regulator(s) can be enabled/disabled by ENx pin(s) and by I2C interface.

8.3.4 Regulator Control

8.3.4.1 Enabling and Disabling Regulators

  • Using EN_BUCKx bit in BUCKx_CTRL1 register (EN_PIN_CTRLx register bit is 0h)
  • Using EN1, EN2, EN3 control pins (EN_BUCKx bit is 1h AND EN_PIN_CTRLx register bit is 1 in BUCKx_CTRL1 register) If the EN1, EN2, EN3 control pins are used for enable and disable then the control pin is selected with BUCKx_EN_PIN_SELECT[1:0] bits (in BUCKx_CTRL1 register). The delay from the control signal rising edge to enabling of the regulator is set by BUCKx_STARTUP_DELAY[3:0] bits, and the delay from control signal falling edge to disabling of the regulator is set by BUCKx_SHUTDOWN_DELAY[3:0] bits in BUCKx_DELAY register. The delays are valid only for EN1, EN2, EN3 signal control. The control with EN_BUCKx bit is immediate without the delays. The control of the regulator (with 0-ms delays) is shown in Table 3. Multiphase regulators are controlled with registers of the master phase. NOTE The control of the regulator cannot be changed from one ENx pin to a different ENx pin because the control is ENx signal-edge sensitive. The control from ENx pin to register bit and back to the original ENx pin can be done during operation.

Table 3. Regulator Control using BUCKx_PG_MASK bit (in BUCKx_MASK register). host can disable those with ENx_PD bits (in CONFIG register).

Figure 14. Regulator Enable and Disable

8.3.4.2 Changing Output Voltage

and BUCKx_FLOOR_VOUT registers) or by writing to the BUCKx_VOUT and BUCKx_FLOOR_VOUT registers.

Figure 15. Regulator Output Voltage Change With ENx pin

8.3.5 Enable and Disable Sequences

  • EN_BUCKx = 1 (in BUCKx_CTRL1 register)
  • EN_PIN_CTRLx = 1 (in BUCKx_CTRL1 register)
  • EN_ROOF_FLOORx = 0 (in BUCKx_CTRL1 register)
  • BUCKx_VSET[7:0] = Required voltage when ENx is high (in BUCKx_VOUT register)
  • The ENABLE pin for control is selected with BUCKx_EN_PIN_SELECT[1:0] (in BUCKx_CTRL1 register)
  • The delay from rising edge of ENx signal to the regulator enable is set by BUCKx_STARTUP_DELAY[3:0] bits (in BUCKx_DELAY register) and
  • The delay from falling edge of ENx signal to the regulator disable is set by BUCKx_SHUTDOWN_DELAY[3:0] bits (in BUCKx_DELAY register) There are four time steps available for start-up and shutdown sequences. The delay times are selected with DOUBLE_DELAY bit in CONFIG register and HALF_DELAY bit in PGOOD_CTRL2 register as shown in Table 4.

(1) Interrupt is generated during clock detector operation, and in cases where clock is not available when clock detector is enabled.

8.3.6 Device Reset Scenarios

  • Software reset with SW_RESET register bit (in RESET register)
  • POR from rising edge of NRST signal
  • Undervoltage lockout (UVLO) reset from VANA supply An SW reset occurs when SW_RESET bit is written 1. The bit is automatically cleared after writing. This event disables all the regulators immediately, resets all the register bits to the default values, and OTP bits are loaded (see Figure 21). I2C interface is not reset during software reset. The host must wait at least 1.2 ms after writing an SW reset until making a new I2C read or write to the device. If VANA supply voltage falls below UVLO threshold level or NRST signal is set low then all the regulators are disabled immediately, and all the register bits are reset to the default values. When the VANA supply voltage rises above UVLO threshold level AND NRST signal rises above threshold level an internal POR occurs. OTP bits are loaded to the registers and a start-up is initiated according to the register settings. The host must wait at least 1.2 ms after POR until reading or writing to I2C interface.

8.3.7 Diagnosis and Protection Features

  • Information of valid regulator output voltage, which sets interrupt or PGOOD signal;
  • Warnings for diagnosis, which set interrupt;
  • Protection events that are disabling the regulators affected; and
  • Faults that are causing the device to shut down. The LP8756x-Q1 sets the flag bits indicating what protection or warning conditions have occurred, and the nINT pin is pulled low. nINT is released again after a clear of flags is complete. The nINT signal stays low until all the pending interrupts are cleared. When a fault is detected, it is indicated by a RESET_REG interrupt flag (in INT2_TOP register) after next start- up.

Table 5. Summary of Interrupt Signals

0.35 V at 1 ms after

Table 5. Summary of Interrupt Signals (continued)

8.3.7.1 Power-Good Information (PGOOD Pin)

all the sources shows active status. The status from all the voltage rails are summarized in Table 6. PGOOD_FLT register. During reading all the PGx_FLT bits are cleared that are not driving the PGOOD inactive. signal follows the status of all the monitored outputs. selected by setting EN_PGFLT_STAT bit to 1 (in PGOOD_CTRL2 register).

Figure 18. PGOOD Block Diagram Table 6. PGOOD Operation

Table 6. PGOOD Operation (continued) Figure 19. PGOOD Waveforms (PGOOD_POL = 0)

8.3.7.2 Warnings for Diagnosis (Interrupt)

8.3.7.2.1 Output Power Limit

BUCKx_STAT register) to see if the regulator is still in peak-current-regulation mode.

bit. The overload situation is shown in Figure 20. Figure 20. Overload Situation

8.3.7.2.2 Thermal Warning

TDIE_WARN_STAT bit (in TOP_STAT register), and the interrupt is cleared by writing 1 to TDIE_WARN bit.

8.3.7.3 Protection (Regulator Disable)

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8.3.7.3.1 Short-Circuit and Overload Protection

A short-circuit protection feature protects the LP8756x-Q1 device itself and its external components against short circuit at the output or against overload during start-up. The fault threshold is 350 mV, the protection is triggered, and the regulator is disabled if the output voltage is below the threshold level of 1 ms after the regulator is enabled. In a similar way the overload situation is protected during normal operation. If the voltage on the feedback pin of the regulator falls to less than 0.35 V and stays lower the threshold level for 1 ms, the regulator is disabled. In short-circuit and overload situations the BUCKx_SC_INT (in INT_BUCKx register) and the INT_BUCKx bits (in INT_TOP1 register) are set to 1, the BUCKx_STAT bit (in BUCKx_STAT register) is set to 0, and the nINT signal is pulled low. The host processor clears the interrupt by writing 1 to the BUCKx_SC_INT bit. After clearing the interrupt the regulator makes a new start-up attempt if the regulator is in enabled state.

8.3.7.3.2 Overvoltage Protection

The LP8756x-Q1 device monitors the input voltage from the VANA pin in standby and active operation modes. If the input voltage rises above VANAOVP voltage level, all the regulators are disabled, pulldown resistors discharge the output voltages (if EN_RDISx = 1 in BUCKx_CTRL1 register), GPIOs that are configured to outputs are set to logic low level, nINT signal is pulled low, INT_OVP bit (in INT_TOP1 register) is set to 1, and BUCKx_STAT bits (in BUCK_x_STAT register) are set to 0. The host processor clears the interrupt by writing 1 to the INT_OVP bit. If the input voltage is above the overvoltage detection level the interrupt is not cleared. The host can read the status of the overvoltage from the OVP_STAT bit (in TOP_STAT register). Regulators cannot be enabled as long as the input voltage is above overvoltage detection level or the overvoltage interrupt is pending.

8.3.7.3.3 Thermal Shutdown

The LP8756x-Q1 has an overtemperature protection function that operates to protect the device from short-term misuse and overload conditions. When the junction temperature exceeds around 150°C, the regulators are disabled, the TDIE_SD bit (in INT_TOP1 register) is set to 1, the nINT signal is pulled low, and the device goes to the STANDBY state. The nINT pin is cleared by writing 1h to the TDIE_SD bit. If the temperature is above thermal shutdown level the interrupt is not cleared. The host can read the status of the thermal shutdown from the TDIE_SD_STAT bit (in TOP_STAT register). Regulators cannot be enabled as long as the junction temperature is above thermal shutdown level or the thermal shutdown interrupt is pending.

8.3.7.4 Fault (Power Down)

8.3.7.4.1 Undervoltage Lockout

When the input voltage falls below VANAUVLO at the VANA pin, the buck converters are disabled immediately, and the output capacitors are discharged using the pulldown resistor, and the LP8756x-Q1 device goes to the SHUTDOWN state. When the VANA voltage is greater than the UVLO threshold level and NRST signal is high, the device powers up to STANDBY state. If the reset interrupt is unmasked by default (RESET_REG_MASK = 0 in TOP_MASK2 register) the RESET_REG interrupt (in INT_TOP2 register) indicates that the device has been in SHUTDOWN. The host processor must clear the interrupt by writing 1 to the RESET_REG bit. If the host processor reads the RESET_REG flag after detecting an nINT low signal, it knows that the input supply voltage has been below UVLO level (or the host has requested reset), and the registers are reset to default values.

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8.3.8 GPIO Signal Operation

The LP8756x-Q1 device supports up to 3 GPIO signals. The GPIO signals are multiplexed with enable signals. The selection between enable and GPIO function is set with GPIOx_SEL bits in PIN_FUNCTION register. The GPIOs are mapped to EN signals so that:

  • EN1 is multiplexed with GPIO1
  • EN2 is multiplexed with GPIO2
  • EN3 is multiplexed with GPIO3 When the pin is selected for GPIO function, additional bits defines how the GPIO operates:
  • GPIOx_DIR defines the direction of the GPIO, input or output (GPIO_CONFIG register)
  • GPIOx_OD defines the type of the output when the GPIO is set to output, either push-pull with VANA level or open-drain (GPIO_CONFIG register) When the GPIOx is defined as output, the logic level of the pin is set by GPIOx_OUT bit (in GPIO_OUT register). When the GPIOx is defined as input, the logic level of the pin can be read from GPIOx_IN bit (in GPIO_IN register). The control of the GPIOs configured to outputs can be included to start-up and shutdown sequences. The GPIO control for a sequence with ENx signal is selected by EN_PIN_CTRL_GPIOx and EN_PIN_SELECT_GPIOx bits (in PIN_FUNCTION register). The delays during start-up and shutdown are set by GPIOx_STARTUP_DELAY[3:0] and GPIOx_SHUTDOWN_DELAY[3:0] bits (in GPIOx_DELAY register) in the same way as control of the regulators. The GPIOx signals have a selectable pulldown resistor. The pulldown resistors are selected by ENx_PD bits (in CONFIG register). NOTE The control of the GPIOx pin cannot be changed from one ENx pin to a different ENx pin because the control is ENx signal edge sensitive. The control from ENx pin to register bit and back to the original ENx pin can be done during operation.

8.3.9 Digital Signal Filtering

The digital signals have a debounce filtering. The signal/supply is sampled with a clock signal and a counter. This results as an accuracy of one clock period for the debounce window.

(1) No glitch filtering, only synchronization. Table 7. Digital Signal Filtering

8.4 Device Functional Modes

8.4.1 Modes of Operation

LP8756x-Q1 device are turned off. enabled. The OTP bits are loaded to registers. interface. The regulators can be enabled if needed. host processor via the system serial interface. The operating modes and transitions between the modes are shown in Figure 21.

Figure 21. Device Operation Modes

8.5 Programming

8.5.1 I2C-Compatible Interface

8.5.1.1 Data Validity

state of the data line can only be changed when clock signal is LOW. Figure 22. Data Validity Diagram

8.5.1.2 Start and Stop Conditions

master always generates the START and STOP conditions. Figure 23. Start and Stop Sequences SDA and SCL signal timing for the I2C-compatible bus.

Figure 24. I2C-Compatible Timing

8.5.1.3 Transferring Data

Each byte put on the SDA line must be eight bits long, with the most significant bit (MSB) being transferred first. acknowledge after each byte has been received. SDA line is not pulled down. SDA line. The ACK signal and data transfer to the master is disabled at that time. data to write to the selected register. Figure 25. Write Cycle (w = write; SDA = 0), Using Example id = Device Address = 0x60 for LP8756x-Q1

When READ function is to be accomplished, a WRITE function must precede the READ function as shown above. Figure 26. Read Cycle ( r = read; SDA = 1), Using Example id = Device Address = 0x60 for LP8756x-Q1

8.5.1.4 I2C-Compatible Chip Address

After the START condition, the I2C master sends the 7-bit address followed by an eighth bit, read or write (R/W). A. Here device address is 1100000Bin = 60Hex. Figure 27. Example Device Address

8.5.1.5 Auto-Increment Feature

Table 8. Auto-Increment Example

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8.6 Register Maps

8.6.1 Register Descriptions

The LP8756x-Q1 is controlled by a set of registers through the I2C-compatible interface. The device registers, their addresses, and their abbreviations are listed in Table 9. A more detailed description is given in the OTP_REV to GPIO_OUT sections. NOTE This register map describes the default values for bits that are not read from OTP memory. The orderable code and the default register bit values are defined in part-number specific Technical Reference Manuals.

Table 9. Summary of LP8756x-Q1 Control Registers

Table 9. Summary of LP8756x-Q1 Control Registers (continued)

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8.6.1.1 OTP_REV

Address: 0x01 D7 D6 D5 D4 D3 D2 D1 D0 OTP_ID[7:0] Bits Field Type Default Description 7:0 OTP_ID[7:0] R X Identification code of the OTP EPROM version

8.6.1.2 BUCK0_CTRL1

Address: 0x02 D7 D6 D5 D4 D3 D2 D1 D0 EN_BUCK0 EN_PIN_CTRL BUCK0_EN_PIN_SELECT[1:0] EN_ROOF_FL OOR0 EN_RDIS0 BUCK0_FPWM BUCK0_FPWM _MP Bits Field Type Default Description

7 EN_BUCK0 R/W X This bit enables the BUCK0 regulator

0h = BUCK0 regulator is disabled 1h = BUCK0 regulator is enabled

6 EN_PIN_CTRL0 R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK0 regulator

0h = Only the EN_BUCK0 bit controls the BUCK0 regulator 1h = EN_BUCK0 bit AND ENx pin control the BUCK0 regulator 5:4 BUCK0_EN_PIN_S ELECT[1:0] R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK0 regulator 0h = EN_BUCK0 bit AND EN1 pin control BUCK0 1h = EN_BUCK0 bit AND EN2 pin control BUCK0 2h = EN_BUCK0 bit AND EN3 pin control BUCK0 3h = Reserved

3 EN_ROOF_FLOO

R/W 0h This bit enables the roof and floor control of the EN1, EN2, and EN3 pins if the EN_PIN_CTRL0 bit is set to 1h. 0h = Enable and disable (1/0) control 1h = Roof and floor (1/0) control

2 EN_RDIS0 R/W 1h This bit enables the output of the discharge resistor when the BUCK0 regulator is

0h = Discharge resistor disabled 1h = Discharge resistor enabled

1 BUCK0_FPWM R/W X This bit forces the BUCK0 regulator to operate in PWM mode

0h = Automatic transitions between PFM and PWM modes (AUTO mode). 1h = Forced to PWM operation

0 BUCK0_FPWM_M

P R/W X This bit forces the BUCK0 regulator to operate always in multiphase and forced-PWM operation mode 0h = Automatic phase adding and shedding 1h = Forced to multiphase operation; two phases in the 2-phase configuration, three phases in the 3-phase configuration, and four phases in the 4-phase configuration.

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8.6.1.3 BUCK0_CTRL2

Address: 0x03 D7 D6 D5 D4 D3 D2 D1 D0 Reserved ILIM0[2:0] SLEW_RATE0[2:0] Bits Field Type Default Description 7:6 Reserved R/W 0h 5:3 ILIM0[2:0] R/W X This bit sets the switch current limit of the BUCK0 regulator. Can be programmed at any time during operation. 0h = 1.5 A 1h = 2 A 2h = 2.5 A 3h = 3 A 4h = 3.5 A 5h = 4 A 6h = 4.5 A 7h = 5 A 2:0 SLEW_RATE0[2:0] R/W X This bit sets the output voltage slew rate for the BUCK0 regulator (rising and falling edges) 0h = Reserved 1h = Reserved 2h = 10 mV/µs 3h = 7.5 mV/µs 4h = 3.8 mV/µs 5h = 1.9 mV/µs 6h = 0.94 mV/µs 7h = 0.47 mV/µs

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8.6.1.4 BUCK1_CTRL1

Address: 0x04 D7 D6 D5 D4 D3 D2 D1 D0 EN_BUCK1 EN_PIN_CTRL BUCK1_EN_PIN_SELECT[1:0] EN_ROOF_FL OOR1 EN_RDIS1 BUCK1_FPWM Reserved Bits Field Type Default Description

7 EN_BUCK1 R/W X This bit enables the BUCK1 regulator

0h = BUCK1 regulator is disabled 1h = BUCK1 regulator is enabled

6 EN_PIN_CTRL1 R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK1 regulator

0h = Only the EN_BUCK1 bit controls the BUCK1 regulator 1h = EN_BUCK1 bit AND ENx pin control the BUCK1 regulator 5:4 BUCK1_EN_PIN_S ELECT[1:0] R/W X This bit enables the EN1, EN2, EN3 pin control for BUCK1 regulator 0h = EN_BUCK1 bit AND EN1 pin control the BUCK1 regulator 1h = EN_BUCK1 bit AND EN2 pin control the BUCK1 regulator 2h = EN_BUCK1 bit AND EN3 pin control the BUCK1 regulator 3h = Reserved R/W 0h This bit enables the roof and floor control of EN1, EN2, EN3 pin if the EN_PIN_CTRL1 bit is set to 1h. 0h = Enable and disable (1/0) control 1h = Roof and floor (1/0) control 2 EN_RDIS1 R/W 1h This bit enables the output discharge resistor when the BUCK1 regulator is disabled. 0h = Discharge resistor disabled 1h = Discharge resistor enabled 1 BUCK1_FPWM R/W X This bit forces the BUCK1 regulator to operate in PWM mode. 0h = Automatic transitions between PFM and PWM modes (AUTO mode). 1h = Forced to PWM operation

0 Reserved R/W 0h

8.6.1.5 BUCK1_CTRL2

Address: 0x05 D7 D6 D5 D4 D3 D2 D1 D0 Reserved ILIM1[2:0] SLEW_RATE1[2:0] Bits Field Type Default Description 7:6 Reserved R/W 0h 5:3 ILIM1[2:0] R/W X This bit sets the switch current limit of the BUCK1 regulator. Can be programmed at any time during operation. 0h = 1.5 A 1h = 2 A 2h = 2.5 A 3h = 3 A 4h = 3.5 A 5h = 4 A 6h = 4.5 A 7h = 5 A 2:0 SLEW_RATE1[2:0] R/W X This bit sets the output voltage slew rate for the BUCK1 regulator (rising and falling edges) 0h = Reserved 1h = Reserved 2h = 10 mV/µs 3h = 7.5 mV/µs 4h = 3.8 mV/µs 5h = 1.9 mV/µs 6h = 0.94 mV/µs 7h = 0.47 mV/µs

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

8.6.1.6 BUCK2_CTRL1

Address: 0x06 D7 D6 D5 D4 D3 D2 D1 D0 EN_BUCK2 EN_PIN_CTRL BUCK2_EN_PIN_SELECT[1:0] EN_ROOF_FL OOR2 EN_RDIS2 BUCK2_FPWM BUCK2_FPWM _MP Bits Field Type Default Description 7 EN_BUCK2 R/W X This bit enables the BUCK2 regulator. 0h = BUCK2 regulator is disabled 1h = BUCK2 regulator is enabled 6 EN_PIN_CTRL2 R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK2 regulator. 0h = Only the EN_BUCK2 bit controls BUCK2 1h = EN_BUCK2 bit AND ENx pin control BUCK2 5:4 BUCK2_EN_PIN_S ELECT[1:0] R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK2 regulator. 0h = EN_BUCK2 bit AND EN1 pin control the BUCK2 regulator 1h = EN_BUCK2 bit AND EN2 pin control the BUCK2 regulator 2h = EN_BUCK2 bit AND EN3 pin control the BUCK2 regulator 3h = Reserved R/W 0h This bit enables the roof and floor control of EN1, EN2, EN3 pin if the EN_PIN_CTRL2 bit is set to 1h. 0h = Enable and disable (1/0) control 1h = Roof and floor (1/0) control 2 EN_RDIS2 R/W 1h Enable output discharge resistor when BUCK2 is disabled. 0h = Discharge resistor disabled 1h = Discharge resistor enabled 1 BUCK2_FPWM R/W X This bit forces the BUCK2 regulator to operate in PWM mode. 0h = Automatic transitions between PFM and PWM modes (AUTO mode) 1h = Forced to PWM operation

0 BUCK2_FPWM_M

P R/W X This bit forces the BUCK2 regulator to operate always in multiphase and forced-PWM operation mode. 0h = Automatic phase adding and phase shedding 1h = Forced to multiphase operation; two phases in the 2-phase configuration

8.6.1.7 BUCK2_CTRL2

Address: 0x07 D7 D6 D5 D4 D3 D2 D1 D0 Reserved ILIM2[2:0] SLEW_RATE2[2:0] Bits Field Type Default Description 7:6 Reserved R/W 0h 5:3 ILIM2[2:0] R/W X This bit sets the switch current limit of the BUCK2 regulator. Can be programmed at any time during operation. 0h = 1.5 A 1h = 2 A 2h = 2.5 A 3h = 3 A 4h = 3.5 A 5h = 4 A 6h = 4.5 A 7h = 5 A 2:0 SLEW_RATE2[2:0] R/W X This bit sets the output voltage slew rate for the BUCK2 regulator (rising and falling edges). 0h = Reserved 1h = Reserved 2h = 10 mV/µs 3h = 7.5 mV/µs 4h = 3.8 mV/µs 5h = 1.9 mV/µs 6h = 0.94 mV/µs 7h = 0.47 mV/µs

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

8.6.1.8 BUCK3_CTRL1

Address: 0x08 D7 D6 D5 D4 D3 D2 D1 D0 EN_BUCK3 EN_PIN_CTRL BUCK3_EN_PIN_SELECT[1:0] EN_ROOF_FL OOR3 EN_RDIS3 BUCK3_FPWM Reserved Bits Field Type Default Description 7 EN_BUCK3 R/W X This bit enables the BUCK3 regulator. 0h = BUCK3 regulator is disabled 1h = BUCK3 regulator is enabled 6 EN_PIN_CTRL3 R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK3 regulator. 0h = Only the EN_BUCK3 bit controls the BUCK3 regulator 1h = EN_BUCK3 bit AND ENx pin control the BUCK3 regulator 5:4 BUCK3_EN_PIN_S ELECT[1:0] R/W X This bit enables the EN1, EN2, EN3 pin control for the BUCK3 regulator. 0h = EN_BUCK3 bit AND EN1 pin control the BUCK3 regulator 1h = EN_BUCK3 bit AND EN2 pin control the BUCK3 regulator 2h = EN_BUCK3 bit AND EN3 pin control the BUCK3 regulator 3h = Reserved R/W 0h This bit enables the roof and floor control of EN1, EN2, EN3 pin if the EN_PIN_CTRL3 bit is set to 1h. 0h = Enable and disable (1/0) control 1h = Roof and floor (1/0) control 2 EN_RDIS3 R/W 1h This bit enables the output discharge resistor when the BUCK3 regulator is disabled. 0h = Discharge resistor disabled 1h = Discharge resistor enabled 1 BUCK3_FPWM R/W X This bit forces the BUCK3 regulator to operate in PWM mode. 0h = Automatic transitions between PFM and PWM modes (AUTO mode) 1h = Forced to PWM operation

8.6.1.9 BUCK3_CTRL2

Address: 0x09 D7 D6 D5 D4 D3 D2 D1 D0 Reserved ILIM3[2:0] SLEW_RATE3[2:0] Bits Field Type Default Description 7:6 Reserved R/W 0h 5:3 ILIM3[2:0] R/W X This bit sets the switch current limit of the BUCK3 regulator. Can be programmed at any time during operation. 0h = 1.5 A 1h = 2 A 2h = 2.5 A 3h = 3 A 4h = 3.5 A 5h = 4 A 6h = 4.5 A 7h = 5 A 2:0 SLEW_RATE3[2:0] R/W X This bit sets the output voltage slew rate for the BUCK3 regulator (rising and falling edges). 0h = Reserved 1h = Reserved 2h = 10 mV/µs 3h = 7.5 mV/µs 4h = 3.8 mV/µs 5h = 1.9 mV/µs 6h = 0.94 mV/µs 7h = 0.47 mV/µs

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

8.6.1.10 BUCK0_VOUT

Address: 0x0A D7 D6 D5 D4 D3 D2 D1 D0 BUCK0_VSET[7:0] Bits Field Type Default Description 7:0 BUCK0_VSET[7:0] R/W X This bit sets the output voltage of the BUCK0 regulator. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.11 BUCK0_FLOOR_VOUT

Address: 0x0B D7 D6 D5 D4 D3 D2 D1 D0 BUCK0_FLOOR_VSET[7:0] Bits Field Type Default Description 7:0 BUCK0_FLOOR_V SET[7:0] R/W 0h This bit sets the output voltage of the BUCK0 regulator when the floor state is used. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.12 BUCK1_VOUT

Address: 0x0C D7 D6 D5 D4 D3 D2 D1 D0 BUCK1_VSET[7:0]

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description 7:0 BUCK1_VSET[7:0] R/W X This bit sets the output voltage of the BUCK1 regulator. Reserved, do not use 0h to 9h 0.6 V - 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V - 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V - 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.13 BUCK1_FLOOR_VOUT

Address: 0x0D D7 D6 D5 D4 D3 D2 D1 D0 BUCK1_FLOOR_VSET[7:0] Bits Field Type Default Description 7:0 BUCK1_FLOOR_V SET[7:0] R/W 0h This bit sets the output voltage of the BUCK1 regulator when the floor state is used. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.14 BUCK2_VOUT

Address: 0x0E D7 D6 D5 D4 D3 D2 D1 D0 BUCK2_VSET[7:0] Bits Field Type Default Description 7:0 BUCK2_VSET[7:0] R/W X This bit sets the output voltage of the BUCK2 regulator. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

8.6.1.15 BUCK2_FLOOR_VOUT

Address: 0x0F D7 D6 D5 D4 D3 D2 D1 D0 BUCK2_FLOOR_VSET[7:0] Bits Field Type Default Description 7:0 BUCK2_FLOOR_V SET[7:0] R/W 0h This bit sets the output voltage of the BUCK2 regulator when the floor state is used. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.16 BUCK3_VOUT

Address: 0x10 D7 D6 D5 D4 D3 D2 D1 D0 BUCK3_VSET[7:0] Bits Field Type Default Description 7:0 BUCK3_VSET[7:0] R/W X This bit sets the output voltage of the BUCK3 regulator. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.17 BUCK3_FLOOR_VOUT

Address: 0x11 D7 D6 D5 D4 D3 D2 D1 D0 BUCK3_FLOOR_VSET[7:0]

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description 7:0 BUCK3_FLOOR_V SET[7:0] R/W 0h This bit sets the output voltage of the BUCK3 regulator when the floor state is used. Reserved, do not use 0h to 9h 0.6 V to 0.73 V, 10-mV steps Ah = 0.6 V ... 17h = 0.73 V 0.73 V to 1.4 V, 5-mV steps 18h = 0.735 V ... 9Dh = 1.4 V 1.4 V to 3.36 V, 20-mV steps 9Eh = 1.42 V ... FFh = 3.36 V

8.6.1.18 BUCK0_DELAY

Address: 0x12 D7 D6 D5 D4 D3 D2 D1 D0 BUCK0_SHUTDOWN_DELAY[3:0] BUCK0_STARTUP_DELAY[3:0] Bits Field Type Default Description 7:4 BUCK0_SHUTDO WN_DELAY[3:0] R/W X Shutdown delay of the BUCK0 regulator from the falling edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms 3:0 BUCK0_STARTUP _DELAY[3:0] R/W X Start-up delay the of the BUCK0 regulator from the rising edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms

8.6.1.19 BUCK1_DELAY

Address: 0x13 D7 D6 D5 D4 D3 D2 D1 D0 BUCK1_SHUTDOWN_DELAY[3:0] BUCK1_STARTUP_DELAY[3:0] Bits Field Type Default Description 7:4 BUCK1_SHUTDO WN_DELAY[3:0] R/W X Shutdown delay of the BUCK1 regulator from the falling edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms 3:0 BUCK1_STARTUP _DELAY[3:0] R/W X start-up delay of the BUCK1 regulator from the rising edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

8.6.1.20 BUCK2_DELAY

Address: 0x14 D7 D6 D5 D4 D3 D2 D1 D0 BUCK2_SHUTDOWN_DELAY[3:0] BUCK2_STARTUP_DELAY[3:0] Bits Field Type Default Description 7:4 BUCK2_SHUTDO WN_DELAY[3:0] R/W X Shutdown delay of the BUCK2 regulator from the falling edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms ... Fh = 15 ms (Default from OTP memory) 3:0 BUCK2_STARTUP _DELAY[3:0] R/W X start-up delay of the BUCK2 regulator from the rising edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

8.6.1.21 BUCK3_DELAY

Address: 0x15 D7 D6 D5 D4 D3 D2 D1 D0 BUCK3_SHUTDOWN_DELAY[3:0] BUCK3_STARTUP_DELAY[3:0] Bits Field Type Default Description 7:4 BUCK3_SHUTDO WN_DELAY[3:0] R/W X Shutdown delay of the BUCK3 regulator from the falling edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms 3:0 BUCK3_STARTUP _DELAY[3:0] R/W X Startup delay of the BUCK3 regulator from the rising edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms

8.6.1.22 GPIO2_DELAY

Address: 0x16 D7 D6 D5 D4 D3 D2 D1 D0 GPIO2_SHUTDOWN_DELAY[3:0] GPIO2_STARTUP_DELAY[3:0] Bits Field Type Default Description 7:4 GPIO2_SHUTDOW N_DELAY[3:0] R/W X Delay for the GPIO2 falling edge from the falling edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms 3:0 GPIO2_STARTUP _DELAY[3:0] R/W X Delay for the GPIO2 rising edge from the rising edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms

8.6.1.23 GPIO3_DELAY

Address: 0x17 D7 D6 D5 D4 D3 D2 D1 D0 GPIO3_SHUTDOWN_DELAY[3:0] GPIO3_STARTUP_DELAY[3:0] Bits Field Type Default Description 7:4 GPIO3_SHUTDOW N_DELAY[3:0] R/W X Delay for the GPIO3 falling edge from the falling edge of the ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms Fh = 15 ms

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description 3:0 GPIO3_STARTUP _DELAY[3:0] R/W X Delay for GPIO3 rising edge from rising edge of ENx signal (the DOUBLE_DELAY bit is set to 0h in the CONFIG register and the HALF_DELAY bit is set to 0h in the PGOOD_CTRL2 register). For other delay options, see the Start-Up and Shutdown Delays table. 0h = 0 ms 1h = 1 ms . Fh = 15 ms

8.6.1.24 RESET

Address: 0x18 D7 D6 D5 D4 D3 D2 D1 D0 Reserved SW_RESET Bits Field Type Default Description 7:1 Reserved R/W 0h 0 SW_RESET R/W 0h Software commanded reset. When this bit is written to 1h, the registers are reset to the default values, OTP memory is read, and the I2C interface is reset. The bit is automatically cleared.

8.6.1.25 CONFIG

Address: 0x19 D7 D6 D5 D4 D3 D2 D1 D0 DOUBLE_DEL AY CLKIN_PD Reserved EN3_PD TDIE_WARN_ LEVEL EN2_PD EN1_PD Reserved Bits Field Type Default Description

7 DOUBLE_DELAY R/W X Start-up and shutdown delays from the ENx signals

0h = 0 ms to 15 ms with 1-ms steps 1h = 0 ms to 30 ms with 2-ms steps 6 CLKIN_PD R/W X This bit selects the pulldown resistor on the CLKIN input pin. 0h = Pulldown resistor is disabled 1h = Pulldown resistor is enabled

5 Reserved R/W 0h

4 EN3_PD R/W X This bit selects the pulldown resistor on the EN3 (GPIO3) input pin. 0h = Pulldown resistor is disabled 1h = Pulldown resistor is enabled

3 TDIE_WARN_LEV

R/W X Thermal warning threshold level 0h = 125°C 1h = 137°C 2 EN2_PD R/W X This bit selects the pulldown resistor on the EN2 (GPIO2) input pin. 0h = Pulldown resistor is disabled 1h = Pulldown resistor is enabled 1 EN1_PD R/W X This bit selects the pulldown resistor on the EN1 (GPIO1) input pin. 0h = Pulldown resistor is disabled 1h = Pulldown resistor is enabled

8.6.1.26 INT_TOP1

Address: 0x1A D7 D6 D5 D4 D3 D2 D1 D0 Reserved INT_BUCK23 INT_BUCK01 NO_SYNC_CL K TDIE_SD TDIE_WARN INT_OVP I_LOAD_ READY

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description

7 Reserved R/W 0h

6 INT_BUCK23 R 0h Interrupt indicating that the output of the BUCK3 regulator,BUCK2 regulator, or both

regulators has a pending interrupt. The reason for the interrupt is indicated in the INT_BUCK_2_3 register. This bit is cleared automatically when the INT_BUCK_2_3 register is cleared to 0x00.

5 INT_BUCK01 R 0h Interrupt indicating that the output of the BUCK1 regulator, BUCK0 regulator, or both

regulators has a pending interrupt. The reason for the interrupt is indicated in the INT_BUCK_0_1 register. This bit is cleared automatically when the INT_BUCK_0_1 register is cleared to 0x00. 4 NO_SYNC_CLK R/W1C 0h Latched status bit indicating that the external clock is not valid. Write this bit to 1h to clear the interrupt.

3 TDIE_SD R/W1C 0h Latched status bit indicating that the die junction temperature is greater than the

thermal shutdown level. The regulators are disabled if previously enabled. The regulators cannot be enabled if this bit is active. The actual status of the thermal warning condition is indicated by the TDIE_SD_STAT bit in the TOP_STAT register. Write this bit to 1h to clear the interrupt. 2 TDIE_WARN R/W1C 0h Latched status bit indicating that the die junction temperature is greater than the thermal warning level. The actual status of the thermal warning condition is indicated by the TDIE_WARN_STAT bit in the TOP_STAT register. Write this bit to 1h to clear the interrupt. 1 INT_OVP R/W1C 0h Latched status bit indicating that the input voltage is greater than the overvoltage- detection level. The actual status of the overvoltage condition is indicated by the OVP_STAT bit in the OP_STAT register. Write this bit to 1h to clear the interrupt. 0 I_LOAD_READY R/W1C 0h Latched status bit indicating that the load-current measurement result is available in the I_LOAD_1 and I_LOAD_2 registers. Write this bit to 1h to clear the interrupt.

8.6.1.27 INT_TOP2

Address: 0x1B D7 D6 D5 D4 D3 D2 D1 D0 Reserved RESET_REG Bits Field Type Default Description 7:1 Reserved R/W 0h 0 RESET_REG R/W1C 0h Latched status bit indicating that either start-up (NRST rising edge) is done, VANA supply voltage is less than the undervoltage threshold level, or the host has requested a reset (the SW_RESET bit in the RESET register). The regulators are disabled, the registers are reset to default values, and the normal start-up procedure is done. Write this bit to 1h to clear the interrupt.

8.6.1.28 INT_BUCK_0_1

Address: 0x1C D7 D6 D5 D4 D3 D2 D1 D0 Reserved BUCK1_PG _INT BUCK1_SC _INT BUCK1_ILIM _INT Reserved BUCK0_PG _INT BUCK0_SC _INT BUCK0_ILIM _INT Bits Field Type Default Description 6 BUCK1_PG_INT R/W1C 0h Latched status bit indicating that the BUCK1 output voltage reached the power-good- threshold level. Write this bit to 1h to clear. 5 BUCK1_SC_INT R/W1C 0h Latched status bit indicating that the BUCK1 output voltage has fallen to less than the 0.35-V level during operation or the BUCK1 output did not reach the 0.35-V level in 1 ms from enable. Write this bit to 1h to clear.

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description 4 BUCK1_ILIM_INT R/W1C 0h Latched status bit indicating that output current limit is active. Write this bit to 1h to clear.

3 Reserved R/W 0h

2 BUCK0_PG_INT R/W1C 0h Latched status bit indicating that the BUCK0 output voltage reached power-good-

threshold level. Write this bit to 1h to clear. 1 BUCK0_SC_INT R/W1C 0h Latched status bit indicating that the BUCK0 output voltage has fallen to less than the 0.35-V level during operation or the BUCK0 output did not reach the 0.35-V level in 1 ms from enable. Write this bit to 1h to clear. 0 BUCK0_ILIM_INT R/W1C 0h Latched status bit indicating that output current limit is active. Write this bit to 1h to clear.

8.6.1.29 INT_BUCK_2_3

Address: 0x1D D7 D6 D5 D4 D3 D2 D1 D0 Reserved BUCK3_PG _INT BUCK3_SC _INT BUCK3_ILIM _INT Reserved BUCK2_PG _INT BUCK2_SC _INT BUCK2_ILIM _INT Bits Field Type Default Description 6 BUCK3_PG_INT R/W1C 0h Latched status bit indicating that the BUCK3 output voltage reached the power-good- threshold level. Write this bit to 1h to clear. 5 BUCK3_SC_INT R/W1C 0h Latched status bit indicating that the BUCK3 output voltage has fallen to less than the 0.35-V level during operation or the BUCK3 output did not reach the 0.35-V level in 1 ms from enable. Write this bit to 1h to clear. 4 BUCK3_ILIM_INT R/W1C 0h Latched status bit indicating that the output current limit is active. Write this bit to 1h to clear. 2 BUCK2_PG_INT R/W1C 0h Latched status bit indicating that the BUCK2 output voltage reached the power-good- threshold level. Write this bit to 1h to clear. 1 BUCK2_SC_INT R/W1C 0h Latched status bit indicating that the BUCK2 output voltage has fallen to less than the 0.35-V level during operation or the BUCK2 output did not reach the 0.35-V level in 1 ms from enable. Write this bit to 1h to clear. 0 BUCK2_ILIM_INT R/W1C 0h Latched status bit indicating that the output current limit is active. Write this bit to 1h to clear.

8.6.1.30 TOP_STAT

Address: 0x1E D7 D6 D5 D4 D3 D2 D1 D0 Reserved SYNC_CLK _STAT TDIE_SD _STAT TDIE_WARN _STAT OVP_STAT Reserved Bits Field Type Default Description 7:5 Reserved R 0h 4 SYNC_CLK_STAT R 0h Status bit indicating the status of the external clock (CLKIN). 0h = External clock frequency is valid 1h = External clock frequency is not valid 3 TDIE_SD_STAT R 0h Status bit indicating the status of the thermal shutdown condition. 0h = Die temperature is less than the thermal shutdown level 1h = Die temperature is greater than the thermal shutdown level

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description

2 TDIE_WARN_STA

T R 0h Status bit indicating the status of thermal warning condition. 0h = Die temperature is less than the thermal warning level 1h = Die temperature is greater than the thermal warning level 1 OVP_STAT R 0h Status bit indicating the status of input overvoltage monitoring. 0h = Input voltage is less than the overvoltage threshold level 1h = Input voltage is greater than the overvoltage threshold level

0 Reserved R 0h

8.6.1.31 BUCK_0_1_STAT

Address: 0x1F D7 D6 D5 D4 D3 D2 D1 D0 BUCK1_STAT BUCK1_PG _STAT Reserved BUCK1_ILIM _STAT BUCK0_STAT BUCK0_PG _STAT Reserved BUCK0_ILIM _STAT Bits Field Type Default Description 7 BUCK1_STAT R 0 Status bit indicating the enable or disable status of the BUCK1 regulator. 0h = BUCK1 regulator is disabled 1h = BUCK1 regulator is enabled 6 BUCK1_PG_STAT R 0 Status bit indicating the validity of the BUCK1 output voltage (raw status). 0h = BUCK1 output is less than the power-good-threshold level 1h = BUCK1 output is greater than the power-good-threshold level

5 Reserved R 0

4 BUCK1_ILIM_STA

T R 0 Status bit indicating the BUCK1 current limit status (raw status). 0h = BUCK1 output current is less than the current limit level 1h = BUCK1 output current limit is active 3 BUCK0_STAT R 0 Status bit indicating the enable or disable status of the BUCK0 regulator. 0h = BUCK0 regulator is disabled 1h = BUCK0 regulator is enabled 2 BUCK0_PG_STAT R 0 Status bit indicating the validity of the BUCK0 output voltage (raw status). 0h = BUCK0 output is less than the power-good-threshold level 1h = BUCK0 output is greater than the power-good-threshold level

1 Reserved R 0

0 BUCK0_ILIM_STA

T R 0 Status bit indicating the BUCK0 current limit status (raw status). 0h = BUCK0 output current is less than the current limit level 1h = BUCK0 output current limit is active

8.6.1.32 BUCK_2_3_STAT

Address: 0x20 D7 D6 D5 D4 D3 D2 D1 D0 BUCK3_STAT BUCK3_PG _STAT Reserved BUCK3_ILIM _STAT BUCK2_STAT BUCK2_PG _STAT Reserved BUCK2_ILIM _STAT Bits Field Type Default Description 7 BUCK3_STAT R 0 Status bit indicating the enable or disable status of the BUCK3 regulator. 0h = BUCK3 regulator is disabled 1h = BUCK3 regulator is enabled 6 BUCK3_PG_STAT R 0 Status bit indicating the validity of the BUCK3 output voltage (raw status). 0h = BUCK3 output is less than the power-good-threshold level 1h = BUCK3 output is greater than the power-good-threshold level

4 BUCK3_ILIM_STA

T R 0 Status bit indicating the BUCK3 current limit status (raw status). 0h = BUCK3 output current is less than the current limit level 1h = BUCK3 output current limit is active 3 BUCK2_STAT R 0 Status bit indicating the enable or disable status of the BUCK2 regulator. 0h = BUCK2 regulator is disabled 1h = BUCK2 regulator is enabled

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description

2 BUCK2_PG_STAT R 0 Status bit indicating the validity of the BUCK2 output voltage (raw status)

0h = BUCK2 output is less than the power-good-threshold level 1h = BUCK2 output is greater than the power-good-threshold level

0 BUCK2_ILIM_STA

T R 0 Status bit indicating the BUCK2 current limit status (raw status). 0h = BUCK2 output current is less than the current limit level 1h = BUCK2 output current limit is active

8.6.1.33 TOP_MASK1

Address: 0x21 D7 D6 D5 D4 D3 D2 D1 D0 Reserved Reserved SYNC_CLK _MASK Reserved TDIE_WARN _MASK Reserved I_LOAD_ READY_MASK Bits Field Type Default Description

7 Reserved R/W 1h

6:5 Reserved R/W 0h

4 SYNC_CLK_MASK R/W X Masking for the external clock detection interrupt (the NO_SYNC_CLK bit in the

INT_TOP1 register) 0h = Interrupt generated 1h = Interrupt not generated

2 TDIE_WARN_MAS

K R/W X Masking for the thermal warning interrupt (the TDIE_WARN bit in the INT_TOP1 register) This bit does not affect TDIE_WARN_STAT status bit in the TOP_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

1 Reserved R/W 0

0 I_LOAD_READY_

R/W X Masking for the load-current measurement-ready interrupt (the I_LOAD_READY bit in the INT_TOP register). 0h = Interrupt generated 1h = Interrupt not generated

8.6.1.34 TOP_MASK2

Address: 0x22 D7 D6 D5 D4 D3 D2 D1 D0 Reserved RESET_REG _MASK Bits Field Type Default Description 7:1 Reserved R/W 0h

0 RESET_REG_MAS

K R/W X Masking for the register reset interrupt (the RESET_REG bit in the INT_TOP2 register) 0h = Interrupt generated 1h = Interrupt not generated

8.6.1.35 BUCK_0_1_MASK

Address: 0x23 D7 D6 D5 D4 D3 D2 D1 D0 Reserved BUCK1_PG _MASK Reserved BUCK1_ILIM _MASK Reserved BUCK0_PG _MASK Reserved BUCK0_ILIM _MASK

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description

6 BUCK1_PG_MASK R/W X Masking for the BUCK1 power-good interrupt (the BUCK1_PG_INT bit in the

INT_BUCK_0_1 register) This bit does not affect BUCK1_PG_STAT status bit in BUCK_0_1_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

5 Reserved R 0h

4 BUCK1_ILIM_MAS

K R/W X Masking for the BUCK1 current-limit-detection interrupt (the BUCK1_ILIM_INT bit in the INT_BUCK_0_1 register) This bit does not affect the BUCK1_ILIM_STAT status bit in the BUCK_0_1_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

2 BUCK0_PG_MASK R/W X Masking for the BUCK0 power-good interrupt (the BUCK0_PG_INT bit in the

INT_BUCK_0_1 register) This bit does not affect the BUCK0_PG_STAT status bit in the BUCK_0_1_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

1 Reserved R 0h

0 BUCK0_ILIM_MAS

K R/W X Masking for the BUCK0 current-limit-detection interrupt (the BUCK0_ILIM_INT bit in the INT_BUCK_0_1 register) This bit does not affect the BUCK0_ILIM_STAT status bit in the BUCK_0_1_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

8.6.1.36 BUCK_2_3_MASK

Address: 0x24 D7 D6 D5 D4 D3 D2 D1 D0 Reserved BUCK3_PG _MASK Reserved BUCK3_ILIM _MASK Reserved BUCK2_PG _MASK Reserved BUCK2_ILIM _MASK Bits Field Type Default Description

6 BUCK3_PG_MASK R/W X Masking for the BUCK3 power-good interrupt (the BUCK3_PG_INT bit in the

INT_BUCK_2_3 register) This bit does not affect the BUCK3_PG_STAT status bit in the BUCK_2_3_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

4 BUCK3_ILIM_MAS

K R/W X Masking for the BUCK3 current-limit-detection interrupt (the BUCK3_ILIM_INT bit in the INT_BUCK_2_3 register) This bit does not affect the BUCK3_ILIM_STAT status bit in the BUCK_2_3_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

2 BUCK2_PG_MASK R/W X Masking for the BUCK2 power-good interrupt (the BUCK2_PG_INT bit in the

INT_BUCK_2_3 register) This bit does not affect the BUCK2_PG_STAT status bit in the BUCK_2_3_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description

0 BUCK2_ILIM_MAS

K R/W X Masking for the BUCK2 current limit-detection interrupt (the BUCK2_ILIM_INT bit in the INT_BUCK_2_3 register) This bit does not affect the BUCK2_ILIM_STAT status bit in the BUCK_2_3_STAT register. 0h = Interrupt generated 1h = Interrupt not generated

8.6.1.37 SEL_I_LOAD

Address: 0x25 D7 D6 D5 D4 D3 D2 D1 D0 Reserved LOAD_CURRENT_BUCK _SELECT[1:0] Bits Field Type Default Description 7:2 Reserved R/W 0h 1:0 LOAD_CURRENT_ BUCK_SELECT[1: R/W 0h This bit starts the current measurement on the selected regulator. One measurement is started when the register is written. If the selected buck is a master, the measurement result is the sum of the current of both the master and slave bucks. If the selected buck is a slave, the measurement result is the current of the selected slave bucks. 0h = BUCK0 1h = BUCK1 2h = BUCK2 3h = BUCK3

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

8.6.1.38 I_LOAD_2

Address: 0x26 D7 D6 D5 D4 D3 D2 D1 D0 Reserved BUCK_LOAD_CURRENT[9:8] Bits Field Type Default Description 7:2 Reserved R 0h 1:0 BUCK_LOAD_CUR RENT[9:8] R 0h This register describes the three MSB bits of the average load current on the selected regulator with a resolution of 20 mA per LSB and maximum code corresponding to a 20.47-A current.

8.6.1.39 I_LOAD_1

Address: 0x27 D7 D6 D5 D4 D3 D2 D1 D0 BUCK_LOAD_CURRENT[7:0] Bits Field Type Default Description 7:0 BUCK_LOAD_CUR RENT[7:0] R 0x00 This register describes the eight LSB bits of the average load current on the selected regulator with a resolution of 20 mA per LSB and maximum code corresponding to a 20.47-A current.

8.6.1.40 PGOOD_CTRL1

Address: 0x28 D7 D6 D5 D4 D3 D2 D1 D0 PG3_SEL[1:0] PG2_SEL[1:0] PG1_SEL[1:0] PG0_SEL[1:0] Bits Field Type Default Description 7:6 PG3_SEL[1:0] R/W X PGOOD signal source control from the BUCK3 regulator 0h = Masked 1h = Power-good-threshold voltage 2h = Reserved, do not use 3h = Power-good-threshold voltage AND current limit 5:4 PG2_SEL[1:0] R/W X PGOOD signal source control from the BUCK2 regulator 0h = Masked 1h = Power-good-threshold voltage 2h = Reserved, do not use 3h = Power-good threshold voltage AND current limit 3:2 PG1_SEL[1:0] R/W X PGOOD signal source control from the BUCK1 regulator 0h = Masked 1h = Power-good-threshold voltage 2h = Reserved, do not use 3h = Power-good-threshold voltage AND current limit 1:0 PG0_SEL[1:0] R/W X PGOOD signal source control from the BUCK0 regulator 0h = Masked 1h = Power-good-threshold voltage 2h = Reserved, do not use 3h = Power-good-threshold voltage AND current limit

8.6.1.41 PGOOD_CTRL2

Address: 0x29 D7 D6 D5 D4 D3 D2 D1 D0 HALF_DELAY EN_PG0 _NINT PGOOD_SET _DELAY EN_PGFLT _STAT Reserved PGOOD_ WINDOW PGOOD_OD PGOOD_POL

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description 7 HALF_DELAY R/W X This bit elects the time step for the start-up and shutdown delays. 0h = Start-up and shutdown delays have 0.5-ms or 1-ms time steps, based on the DOUBLE_DELAY bit in the CONFIG register. 1h = Start-up and shutdown delays have 0.32-ms or 0.64-ms time steps, based on the DOUBLE_DELAY bit in the CONFIG register.

6 EN_PG0_NINT R/W X This bit combines theBUCK0 PGOOD signal with the nINT signal

0h = BUCK0 PGOOD signal not included with the nINT signal 1h = BUCK0 PGOOD signal included with the nINT signal. If the nINT OR the BUCK0 PGOOD signal is low then the nINT signal is low.

5 PGOOD_SET_DEL

R/W X Debounce time of the output voltage monitoring for the PGOOD signal (only when the PGOOD signal goes valid) 0h = 4-10 µs 1h = 11 ms

4 EN_PGFLT_STAT R/W X Operation mode for PGOOD signal

0h = Indicates live status of monitored voltage outputs 1h = Indicates status of the PGOOD_FLT register, inactive if at least one of the PGx_FLT bit is inactive

2 PGOOD_WINDOW R/W X Voltage monitoring method for the PGOOD signal

0h = Only undervoltage monitoring 1h = Overvoltage and undervoltage monitoring

1 PGOOD_OD R/W X PGOOD signal type

0h = Push-pull output (VANA level) 1h = Open-drain output

0 PGOOD_POL R/W X PGOOD signal polarity

0h = PGOOD signal high when monitored outputs are valid 1h = PGOOD signal low when monitored outputs are valid

8.6.1.42 PGOOD_FLT

Address: 0x2A D7 D6 D5 D4 D3 D2 D1 D0 Reserved PG3_FLT PG2_FLT PG1_FLT PG0_FLT Bits Field Type Default Description 7:4 Reserved R/W 0x0

3 PG3_FLT R 0 Source for the PGOOD inactive signal

0h = BUCK3 has not set the PGOOD signal inactive. 1h = BUCK3 has set the PGOOD signal inactive. This bit can be cleared by reading this register when the BUCK3 output is valid.

2 PG2_FLT R 0 Source for the PGOOD inactive signal

0h = BUCK2 has not set the PGOOD signal inactive. 1h = BUCK2 has set the PGOOD signal inactive. This bit can be cleared by reading this register when the BUCK2 output is valid.

1 PG1_FLT R 0 Source for the PGOOD inactive signal

0h = BUCK1 has not set the PGOOD signal inactive. 1h = BUCK1 has set the PGOOD signal inactive. This bit can be cleared by reading this register when the BUCK1 output is valid.

0 PG0_FLT R 0 Source for the PGOOD inactive signal

0h = BUCK0 has not set the PGOOD signal inactive. 1h = BUCK0 has set the PGOOD signal inactive. This bit can be cleared by reading this register when the BUCK0 output is valid.

8.6.1.43 PLL_CTRL

Address: 0x2B D7 D6 D5 D4 D3 D2 D1 D0 PLL_MODE[1:0] Reserved EXT_CLK_FREQ[4:0]

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description 7:6 PLL_MODE[1:0] R/W X This bit selects the external clock and PLL operation. 0h = Forced to internal RC oscillator (PLL is disabled). 1h = PLL is enabled in the STANDBY and ACTIVE states. Automatic external clock use when available, interrupt generated if external clock appears or disappears. 2h = PLL is enabled only in the ACTIVE state. Automatic external clock use when available, interrupt generated if external clock appears or disappears. 3h = Reserved

5 Reserved R/W 0

4:0 EXT_CLK_FREQ[4 :0] R/W X Frequency of the external clock (CLKIN). For the input clock frequency tolerance see the Electrical Characteristics table. Settings 18h through 1Fh are reserved and must not be used. 0x00h = 1 MHz 0x01h = 2 MHz 2h = 3 MHz 16h = 23 MHz 17h = 24 MHz .

8.6.1.44 PIN_FUNCTION

Address: 0x2C D7 D6 D5 D4 D3 D2 D1 D0 EN_SPREAD_ SPEC EN_PIN_CTRL _GPIO3 EN_PIN_SELE CT_GPIO3 EN_PIN_CTRL _GPIO2 EN_PIN_SELE CT_GPIO2 GPIO3_SEL GPIO2_SEL GPIO1_SEL Bits Field Type Default Description

7 EN_SPREAD_SPE

C R/W X This bit enables the spread-spectrum feature. 0h = Disabled 1h = Enabled

6 EN_PIN_CTRL_GP

R/W X This bit enables EN1 and EN2 pin control for GPIO3 (the GPIO3_SEL bit is set to 1h AND the GPIO3_DIR bit is set to 1h). 0h = Only GPIO3_OUT bit controls GPIO3 1h = GPIO3_OUT bit AND ENx pin control GPIO3

5 EN_PIN_SELECT_

R/W X This bit enables EN1 and EN2 pin control for GPIO3. 0h = GPIO3_SEL bit AND EN1 pin control GPIO3 1h = GPIO3_SEL bit AND EN2 pin control GPIO3

4 EN_PIN_CTRL_GP

R/W X This bit enables EN1 and EN3 pin control for GPIO2 (the GPIO2_SEL bit is set to 1h AND the GPIO2_DIR bit is set to 1h). 0h = Only GPIO2_OUT bit controls GPIO2 1h = GPIO2_OUT bit AND ENx pin control GPIO2

3 EN_PIN_SELECT_

R/W X This bit enables EN1 and EN3 pin control for GPIO2 0h = GPIO2_SEL bit AND EN1 pin control GPIO2 1h = GPIO2_SEL bit AND EN3 pin control GPIO2

2 GPIO3_SEL R/W X This bit selects the EN3 pin function

0h = EN3 1h = GPIO3

1 GPIO2_SEL R/W X This bit selects the EN2 pin function

0h = EN2 1h = GPIO2

0 GPIO1_SEL R/W X This bit selects the EN1 pin function

0h = EN1 1h = GPIO1

8.6.1.45 GPIO_CONFIG

Address: 0x2D D7 D6 D5 D4 D3 D2 D1 D0 Reserved GPIO3_OD GPIO2_OD GPIO1_OD Reserved GPIO3_DIR GPIO2_DIR GPIO1_DIR

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated Bits Field Type Default Description

7 Reserved R 0h

6 GPIO3_OD R/W X GPIO3 signal type when configured as an output

0h = Push-pull output (VANA level) 1h = Open-drain output

5 GPIO2_OD R/W X GPIO2 signal type when configured as an output

0h = Push-pull output (VANA level) 1h = Open-drain output

4 GPIO1_OD R/W X GPIO1 signal type when configured as an output

0h = Push-pull output (VANA level) 1h = Open-drain output

3 Reserved R 0h

2 GPIO3_DIR R/W X GPIO3 signal direction

0h = Input 1h = Output

1 GPIO2_DIR R/W X GPIO2 signal direction

0h = Input 1h = Output

0 GPIO1_DIR R/W X GPIO1 signal direction

0h = Input 1h = Output

8.6.1.46 GPIO_IN

Address: 0x2E D7 D6 D5 D4 D3 D2 D1 D0 Reserved GPIO3_IN GPIO2_IN GPIO1_IN Bits Field Type Default Description 7:3 Reserved R 0h

2 GPIO3_IN R 0h State of the GPIO3 signal

0h = Logic-low level 1h = Logic high level

1 GPIO2_IN R 0h State of the GPIO2 signal

0h = Logic-low level 1h = Logic-high level

0 GPIO1_IN R 0h State of the GPIO1 signal

0h = Logic-low level 1h = Logic-high level

8.6.1.47 GPIO_OUT

Address: 0x2F D7 D6 D5 D4 D3 D2 D1 D0 Reserved GPIO3_OUT GPIO2_OUT GPIO1_OUT Bits Field Type Default Description 7:3 Reserved R/W 0h

2 GPIO3_OUT R/W X Control for theGPIO3 signal when configured as the GPIO output

0h = Logic-low level 1h = Logic-high level

1 GPIO2_OUT R/W X Control for the GPIO2 signal when configured as the GPIO output

0h = Logic-low level 1h = Logic-high level

0 GPIO1_OUT R/W 0h Control for theGPIO1 signal when configured as the GPIO output

0h = Logic-low level 1h = Logic-high level

9 Application and Implementation

validate and test their design implementation to confirm system functionality.

9.1 Application Information

  • single output four-phase regulator,
  • three-phase and one-phase regulators,
  • two-phase and two one-phase regulators,
  • four one-phase regulators or
  • two 2-phase regulators configuration.

9.2 Typical Applications

Figure 28. 4-Phase Configuration (LP87561-Q1)

(1) Operating temperature range is up to 125°C including self temperature rise.

9.2.1 Design Requirements

9.2.1.1 Inductor Selection

Table 10. Pay attention to the saturation current and temperature rise current of the inductor. Check that the middle load. Shielded inductors are preferred as they radiate less noise. Table 10. Recommended Inductors

9.2.1.2 Input Capacitor Selection

ripple current rating. In addition ferrite can be used in front of the input capacitor to decrease the EMI. Table 11. Recommended Input Capacitors (X7R Dielectric)

9.2.1.3 Output Capacitor Selection

good is 10 μF for each phase including the DC voltage roll-off, tolerances, aging and temperature effects. selection process is at the switching frequency of the part. See Table 12. time is required to settle VOUT down as a consequence of the increased time constant. Table 12. Recommended Output Capacitors (X7R or X7T Dielectric)

9.2.1.4 Snubber Components

and capacitance values finally depend on the PCB layout. Table 13. Recommended Snubber Components

9.2.1.5 Supply Filtering Components

components for VANA input supply filtering. Table 14. Recommended Supply Filtering Components

current and maximum load current = 0.795 A + 0.25 A = 1.045 A. Figure 33. Current Limit vs Maximum Output Current

9.2.2 Detailed Design Procedure

VIN_Bx power connections together outside the package using power plane construction.

9.2.3 Application Curves

Typical Applications schematics. Figure 34. Efficiency in PFM/PWM and Forced-PWM Mode Figure 35. Efficiency in PFM/PWM and Forced-PWM Mode Figure 36. Efficiency in PFM/PWM and Forced-PWM Mode Figure 37. Efficiency in PFM/PWM and Forced-PWM Mode Figure 38. Efficiency in Forced-PWM Mode (4-Phase Figure 39. Efficiency in Forced-PWM Mode (3-Phase

Typical Applications schematics. Figure 112. Start-Up With Short on Output (1-Phase Output)

10 Power Supply Recommendations

may be required in addition to the ceramic bypass capacitors.

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

11 Layout

11.1 Layout Guidelines

The high frequency and large switching currents of the LP8756x-Q1 make the choice of layout important. Good power supply results only occur when care is given to correct design and layout. Layout affects noise pickup and generation and can cause a good design to perform with less-than-expected results. With a range of output currents from milliamps to 10 A and over, good power supply layout is much more difficult than most general PCB design. Use the following steps as a reference to make sure the device is stable and keeps correct voltage and current regulation across its intended operating voltage and current range.

  • Place CIN as close as possible to the VIN_Bx pin and the PGND_Bxx pin. Route the VIN trace wide and thick to avoid IR drops. The trace between the positive node of the input capacitor and the VIN_Bx pin(s) of LP8756x-Q1, as well as the trace between the negative node of the input capacitor and power PGND_Bxx pin(s), must be kept as short as possible. The input capacitance provides a low-impedance voltage source for the switching converter. The inductance of the connection is the most important parameter of a local decoupling capacitor — parasitic inductance on these traces must be kept as small as possible for correct device operation. The parasitic inductance can be decreased by using a ground plane as close as possible to top layer by using thin dielectric layer between top layer and ground plane.
  • The output filter, consisting of COUT and L, converts the switching signal at SW_Bx to the noiseless output voltage. It must be placed as close as possible to the device keeping the switch node small, for best EMI behavior. Route the traces between the LP8756x-Q1 output capacitors and the load direct and wide to avoid losses due to the IR drop.
  • Input for analog blocks (VANA and AGND) must be isolated from noisy signals. Connect VANA directly to a quiet system voltage node and AGND to a quiet ground point where no IR drop occurs. Place the decoupling capacitor as close as possible to the VANA pin.
  • If the processor load supports remote voltage sensing, connect the feedback pins FB_Bx of the LP8756x-Q1 device to the respective sense pins on the processor. The sense lines are susceptible to noise. They must be kept away from noisy signals such as PGND_Bxx, VIN_Bx, and SW_Bx, as well as high bandwidth signals such as the I2C. Avoid both capacitive and inductive coupling by keeping the sense lines short, direct, and close to each other. Run the lines in a quiet layer. Isolate them from noisy signals by a voltage or ground plane if possible. Running the signal as a differential pair is recommended for multiphase outputs. If series resistors are used for load current measurement, place them after connection of the voltage feedback.
  • PGND_Bxx, VIN_Bx and SW_Bx must be routed on thick layers. They must not surround inner signal layers, which are cannot withstand interference from noisy PGND_Bxx, VIN_Bx and SW_Bx.
  • If the input voltage is above 4 V, place snubber components (capacitor and resistor) between SW_Bx and ground on all four phases. The components can be also placed to the other side of the board if there are area limitations and the routing traces can be kept short. Due to the small package of this converter and the overall small solution size, the thermal performance of the PCB layout is important. Many system-dependent parameters such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component. Correct PCB layout, focusing on thermal performance, results in lower die temperatures. Wide and thick power traces can sink dissipated heat. This can be improved further on multi- layer PCB designs with vias to different planes. This results in decreased junction-to-ambient (RθJA) and junction- to-board (RθJB) thermal resistances and thereby decreases the device junction temperature, TJ. TI strongly recommends doing a careful system-level 2D or full 3D dynamic thermal analysis at the beginning product design process, by using a thermal modeling analysis software.

11.2 Layout Example

(1) The output voltage rails are shorted together based on the configuration as shown in Typical Applications. Figure 113. LP8756x-Q1 Board Layout

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.3 Related Links

resources, tools and software, and quick access to order now. Table 15. Related Links

12.4 Receiving Notification of Documentation Updates

changed. For change details, review the revision history included in any revised document.

12.5 Community Resources

from the experts. Search existing answers or ask your own question to get the quick design help you need. not necessarily reflect TI's views; see TI's Terms of Use.

12.6 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

12.7 Electrostatic Discharge Caution

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.8 Glossary

This glossary lists and explains terms, acronyms, and definitions.

LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com PACKAGE OUTLINE C 8X 0.5 12X 0.5 0.3 12X 0.3 0.2

0.9 MAX

2.24 0.1 0.66 0.1 10X 0.5 2.5 2X 2 0.05 0.00 10X 1.72 1.52 10X 0.3 0.2

0.1 MIN

(0.05) A 4.6 4.4 B 4.1 3.9 (0.2) TYP 4X (0.35) 4X (0.4) 4X (0.625) 4X (0.575) VQFN-HR - 0.9 mm max heightRNF0026C PLASTIC QUAD FLATPACK - NO LEAD 4223207/B 04/2018 PIN 1 INDEX AREA SEATING PLANE 0.08 C

0.1 C A B

0.05 C SYMM SYMM THERMAL PAD PIN 1 ID NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.800 A-A 25.000 SECTION A-A TYPICAL LP87561-Q1 LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

www.ti.com EXAMPLE BOARD LAYOUT 12X (0.6) (0.87)

0.05 MIN

0.05 MAX

12X (0.25) 10X (1.82) 10X (0.25) (R0.05) TYP 10X (0.5) (3.08) 8X (0.5) (2.24) (0.66) ( 0.2) TYP VIA 2X (3.2) 2X (3.65) 4X (0.4) 4X (0.825) 4X (0.775) 4X (0.35) (3.8) VQFN-HR - 0.9 mm max heightRNF0026C PLASTIC QUAD FLATPACK - NO LEAD 4223207/B 04/2018 SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 9 13 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. METALSOLDER MASK OPENING NOT TO SCALE SOLDER MASK DETAIL NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK DEFINED SOLDER MASK METAL UNDER SOLDER MASK OPENING EXPOSED METAL LP87561-Q1 LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 www.ti.com SNVSB22 –MARCH 2018 Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation FeedbackCopyright © 2018, Texas Instruments Incorporated

www.ti.com EXAMPLE STENCIL DESIGN 20X (0.81) 12X (0.6) 12X (0.25) 20X (0.25) (3.8) 2X (0.98) (R0.05) TYP (1.01) TYP (0.59) (0.5) TYP (1.035) TYP 10X (0.5) 4X (0.3) 4X (0.825) 4X (0.3) 4X (0.775) 2X (0.66) (1.575) TYP (1.775) TYP VQFN-HR - 0.9 mm max heightRNF0026C PLASTIC QUAD FLATPACK - NO LEAD 4223207/B 04/2018 NOTES: (continued) 6. For alternate stencil design recommendations, see IPC-7525 or board assembly site preference. SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE PADS 1, 8, 14 & 21: 87% - PADS 9-13 & 22-26: 88% - THERMAL PAD 27: 87% SCALE:25X EXPOSED METAL 10X EXPOSED METAL 8 14 9 13 LP87561-Q1 LP87562-Q1, LP87563-Q1, LP87564-Q1, LP87565-Q1 SNVSB22 –MARCH 2018 www.ti.com Product Folder Links: LP87561-Q1 LP87562-Q1 LP87563-Q1 LP87564-Q1 LP87565-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

www.ti.com 5-Oct-2024 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LP875610BRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 10B-Q1 Samples LP875610RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 10-Q1 Samples LP875610RNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 10-Q1 Samples LP87561IRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 1I-Q1 Samples LP87561IRNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 1I-Q1 Samples LP875620RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 20-Q1 Samples LP875620RNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 20-Q1 Samples LP87562RRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 2R-Q1 Samples LP875630RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 30-Q1 Samples LP875630RNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 30-Q1 Samples LP875640RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 40-Q1 Samples LP875640RNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 40-Q1 Samples LP87564TRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 4T-Q1 Samples LP87564WRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 4W-Q1 Samples LP875650RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 50-Q1 Samples LP875650RNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 50-Q1 Samples Addendum-Page 1

www.ti.com 5-Oct-2024 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LP875651RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 51-Q1 Samples LP875653RNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 53-Q1 Samples LP87565CRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 5C-Q1 Samples LP87565CRNFTQ1 ACTIVE VQFN-HR RNF 26 250 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 5C-Q1 Samples LP87565URNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 5U-Q1 Samples LP87565VRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 RoHS-Exempt & Green SN Level-1-260C-UNLIM -40 to 125 LP8756 5V-Q1 Samples P87562TRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 TBD Call TI Call TI -40 to 125 Samples P875630CRNFRQ1 ACTIVE VQFN-HR RNF 26 3000 TBD Call TI Call TI -40 to 125 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2

www.ti.com 5-Oct-2024 (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 6-Oct-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LP875610BRNFRQ1 VQFN- HR LP875610RNFRQ1 VQFN- HR LP875610RNFTQ1 VQFN- HR LP87561IRNFRQ1 VQFN- HR LP87561IRNFTQ1 VQFN- HR LP875620RNFRQ1 VQFN- HR LP875620RNFTQ1 VQFN- HR LP87562RRNFRQ1 VQFN- HR LP875630RNFRQ1 VQFN- HR Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 6-Oct-2024 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LP875630RNFTQ1 VQFN- HR LP875640RNFRQ1 VQFN- HR LP875640RNFTQ1 VQFN- HR LP87564TRNFRQ1 VQFN- HR LP87564WRNFRQ1 VQFN- HR LP875650RNFRQ1 VQFN- HR LP875650RNFTQ1 VQFN- HR LP875651RNFRQ1 VQFN- HR LP875653RNFRQ1 VQFN- HR LP87565CRNFRQ1 VQFN- HR LP87565CRNFTQ1 VQFN- HR LP87565URNFRQ1 VQFN- HR LP87565VRNFRQ1 VQFN- HR Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 6-Oct-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP875610BRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875610RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875610RNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP87561IRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP87561IRNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP875620RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875620RNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP87562RRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875630RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875630RNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP875640RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875640RNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP87564TRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP87564WRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875650RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875650RNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP875651RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP875653RNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 6-Oct-2024 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP87565CRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP87565CRNFTQ1 VQFN-HR RNF 26 250 200.0 183.0 25.0 LP87565URNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 LP87565VRNFRQ1 VQFN-HR RNF 26 3000 346.0 346.0 35.0 Pack Materials-Page 4

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