P6KA VISHAY | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- Designed for under the hood applications
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- Exclusive patented PAR® oxide passivated chip construction
- 600W peak pulse power surge capability with a 10/1000ms waveform repetition rate (duty cycle): 0.01%
- Excellent clamping capability
- Low incremental surge resistance
- Very fast response time
- For devices with V (BR)≥10V, ID are typically less than 1.0mA
- High temperature soldering guaranteed: 300°C/10 seconds, 0.375" (9.5mm) lead length, 5lbs. (2.3kg) tension Mechanical Data Case: JEDEC DO-204AC molded plastic body over passivated junction Terminals:Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity:For unidirectional types the color band denotes the cathode, which is positive with respect to the anode under normal TVS operation Mounting Position:Any Weight:0.015 oz., 0.4 g Packaging codes/options: 1/4K per Bulk Box, 40K/box 4/4K per 13" Reel, 16K/box 23/2K per Ammo mag., 18K/box
P6KA6.8 thru P6KA43A Vishay Semiconductors formerly General Semiconductor www.vishay.com Document Number 88368 2 06-May-02 Electrical Characteristics(TA = 25°C unless otherwise noted) TJ = 150°C Maximum Breakdown Voltage Maximum Maximum Peak Pulse Maximum Temp. V(BR)(1) at IT Test Stand-off Reverse Reverse Current Clamping Coefficient (V) Current Voltage Leakage Leakage I PPM (2) Voltage of IT VWM at VWM at VWM at lPPM V(BR) Device Type Min Max (A) (V) I D (µA) I D (µA) (A) V C (V) (% / °C) Notes: (1) V(BR) measured after IT applied for 300µs. IT=square wave pulse or equivalent (2) Surge current waveform per Fig. 3 and derate per Fig. 2 (3) All terms and symbols are consistent with ANSI/IEEE C62.35
P6KA6.8 thru P6KA43A Vishay Semiconductors formerly General Semiconductor Document Number 88368 www.vishay.com 06-May-02 3 Ratings and Characteristic Curves(TA = 25°C unless otherwise noted) 100 0 7525 50 100 125 150 175 200 Peak Pulse Power (PPP ) or Current (IPP ) Derating in Percentage, % TA — Ambient Temperature (°C) 1 10 100 Fig. 2 – Pulse Derating Curve PPPM — Peak Pulse Power (kW) Fig. 1 – Peak Pulse Power Rating Curve 0.1 100 0.1µs 1.0 µs1 0 µs td — Pulse Width (sec.) 100µs 1.0ms 10ms Fig. 5 – Steady State Power Derating Curve Non-repetitive Pulse Waveform shown in Fig. 3 T A = 25°C Fig. 6 - Maximum Non-Repetitive/Peak Forward Surge Current IFSM — Peak Forward Surge Current (A) Number of Cycles at 60HZ C J — Junction Capacitance (pF) 100 1,000 6,000 101.0 100 200 V(BR) — Breakdown Voltage (V) TJ = 25°C f = 1.0MHz Vsig = 50mVp-p 100 200 TL = 75°C 8.3ms Single Half Sine-Wave (JEDEC Method) Measured at Stand-Off Voltage, V WM Measured at Zero Bias 1.25 2.5 3.75 5.0 0 7525 100 125 150 175 200 PM (AV), Steady State Power Dissipation (W) 1.6 x 1.6 x 0.040" (40 x 40 x 1mm) Copper Heat Sinks Fig. 4 – Typical Junction Capacitance TL — Lead Temperature (°C) 60H Z Resistive or Inductive Load 100 150 IPPM — Peak Pulse Current, % IRSM Fig. 3 – Pulse Waveform TJ = 25°C Pulse Width (td) is defined as the point where the peak current decays to 50% of I PPM tr = 10µsec. Peak Value IPPM Half Value — IPP IPPM 2 td 10/1000µsec. Waveform as defined by R.E.A. 0 1.0 2.0 3.0 4.0 t — Time (ms) L = 0.375" (9.5mm) Lead Lengths