STP60NF06FP_V01 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

N-channel 60V - 0.014Ω - 30A TO-220FP STripFET II™ Power MOSFET General features ■ Exceptional dv/dt capability ■ 100% avalanche tested ■ Application oriented characterization

Description

This Power MOSFET series realized with STMicroelectronics unique STripFET process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced high- efficiency isolated DC-DC converters for Telecom and Computer application. It is also intended for any application with low gate charge drive requirements.

Applications

■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STP60NF06FP 60V <0.016 Ω 30A TO-220FP Order code Part number Marking Package Packaging STP60NF06FP P60NF06 TO-220FP Tube

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Pulse width limited by safe operating area

Table 2. Thermal data Table 3. Avalanche characteristics

2 Electrical characteristics

Table 4. On/off states Table 5. Dynamic

  1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%

Table 6. Switching times

Table 7. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%

2.1 Electrical characteri stics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Source-drain diode forward Figure 6. Static drain-source on resistance

3 Test circuit

Figure 11. Switching times test circuit for Figure 12. Gate charge test circuit Figure 13. Test circuit for inductive load Figure 14. Unclamped Inductive load test Figure 15. Unclamped inductive waveform Figure 16. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

A B D E H G F 123F2 L4L5 DIM. mm. inch A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 TO-220FP MECHANICAL DATA

5 Revision history

Table 8. Revision history