STP4NM60_09 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 17
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuits
- 4 Package mechanical data
- 5 Packaging mechanical data
- 6 Revision history
Features
■ High dv/dt and avalanche capabilities ■ Improved ESD capability ■ Low input capacitance and gate charge ■ Low gate input resistance ■ Tight process control and high manufacturing yields
Applications
■ Switching
Description
Modems technology applies the benefits of the multiple drain process to STMicroelectronics' well- known PowerMESH™ horizontal layout structure. The resulting product offers low on-resistance, high dv/dt capability and excellent avalanche characteristics. Figure 1. Internal schematic diagram
3 A 42 W
Table 1. Device summary
1 Electrical ratings
Table 2. Absolute maximum ratings
- Pulse width limited by safe operating area
Table 3. Thermal data Table 4. Avalanche characteristics
2 Electrical characteristics
Table 5. On/off states Table 6. Dynamic
- Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
Table 7. Source drain diode
- Pulse width limited by safe operating area.
- Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
Table 8. Gate-source Zener diode (1)
- The built-in back-to-back Zener diodes have specif ically been designed to enhance not only the device’s
usage of external components.
2.1 Electrical characteri stics (curves)
Figure 2. Safe operating area for TO-220 Figure 3. Thermal impedance for TO-220 Figure 4. Safe operating area for DPAK and Figure 5. Thermal impedance for DPAK and Figure 6. Output characterisics Figure 7. Transfer characteristics
Figure 14. Source-drain diode forward
3 Test circuits
Figure 15. Switching times test circuit for Figure 16. Gate charge test circuit Figure 17. Test circuit for inductive load Figure 18. Unclamped inductive load test Figure 19. Unclamped inductive wavefo rm Figure 20. Switching time waveform
Figure 21. Gate charge waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
TO-220 type A mechanical data Dim mm Min Typ Max A 4.40 4.60 b 0.61 0. 88 b1 1.14 1.70 c0 . 4 8 0.70 D 15.25 15.75 D1 1.27 E1 0 1 0 . 4 0 e 2.40 2.70 e1 4. 95 5.15 F1 . 2 3 1.32 H1 6.20 6.60 J1 2.40 2.72 L1 3 14 L1 3.50 3.93 L20 16.40 L302 8.90 ∅P 3.75 3.85 Q 2.65 2. 95 0015988_Rev_S
DIM. mm. .xampyt.nim 04.202.2A 01.109.01A 32.030.02A 09.046.0b 04.502.54b 06.054.0c 06.084.02c 02.600.6D 01.51D 06.604.6E 07.41E 82.2e 06.404.41e 01.0153.9H 08.21L 08.02L 106.04L 02.0R V2 0 o 8 o TO-252 (DPAK) mechanical data 0068772_G
DIM. mm. min. typ max. A 2.20 2.40 A1 0. 901 . 1 0 b 0.64 0. 90 b2 0.95 b4 5.20 5.40 c 0.45 0.60 c2 0.4 8 0.60 D 6.00 6.20 E 6.40 6.60 e2 . 2 8 e1 4.40 4.60 H 16.10 L 9.00 9.40 (L1) 0. 801 . 2 0 L2 0. 80 V1 10 o TO-251 (IPAK) mechanical data 0068771_H
STD3NM60, STD3NM60-1, STP4NM60 Packaging mechanical data Doc ID 8370 Rev 4 15/17
5 Packaging mechanical data
DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C1 2 . 8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.0 39 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.41 3 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.06 3 D1 1.59 1.61 0.062 0.063 E1 . 6 5 1 . 85 0.065 0.07 3 F 11.4 11.6 0.449 0.456 K0 4. 8 5.0 0.1 89 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.46 8 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T0 . 2 5 0 . 35 0.009 8 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA
6 Revision history
Table 9. Document revision history