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Opti - Cap® March 2011 P42BN820MA3152 Dielectric Laboratories Inc. 2777 Route 20 East, Cazenovia, NY 13035 Phone: 315‐655‐8710 Fax: 315‐655‐8179 Email: sales@dilabs.com Web: http://www.dilabs.com QUALITY SYSTEMS AS9100, ISO 9001 AND ENVIRONMENTAL SYSTEM ISO 14001 CERTIFIED 1 of 4 Maximum Envelope Dimensions Length 0.046” Max. Width 0.024” Max. Height 0.050” Max. Assembly Part Number Milli-Cap® MLC DLI Assembly Outline DrawingProduct Code Case Size Code Material Code Capacitance Code Capacitance Tolerance Code MLC Reference Code P 42 BN 820 M A 3152 P = Milli-Cap® or Opti-Cap® 42 = 0402 820 = 82 x 100 82pF M = ± 20% See Table Below Multilayer Capacitor Electrical Characteristics MLC Code Capacitance @ 1KHz Capacitance Tolerance Temperature Characteristic Working Voltage Insulation Resistance @ 25°C Dielectric Withstanding Voltage Maximum Dissipation Factor A 220nF ± 20% X5R* 10VDC >100 M Ω 20V 0.040 *X5R = Maximum Capacitance Change of ±15% from -55°C to +85°C .040 ± .002” .020 ± .002” .020 ± .002” .038 ± .004” .005 ± .001” .020 ± .002” MAXIMUM ENVELOPE (SEE TABLE) Multilayer Capacitor Milli ‐ Cap® Termination Metallization: 7.5 ± 4.5 microinches Au over a minimum of 50 microinches Ni
P42BN820MA3152 Opti - Cap® March 2011 Dielectric Laboratories Inc. 2777 Route 20 East, Cazenovia, NY 13035 Phone: 315-655-8710 Fax: 315-655-8179 Email: sales@dilabs.com Web: http://www.dilabs.com QUALITY SYSTEMS AS9100, ISO 9001 AND ENVIRONMENTAL SYSTEM ISO 14001 CERTIFIED 2 of 4 Recommended Attachment to Soft or Hard Substrate Using Conductive Epoxy: Recommended Micro Strip Layout: Attachment Method 1. Place a single drop of conductive epoxy onto each micro-strip as illustrated; the edge of the epoxy shall be at least .003”- .004” back from the edge of the trace to prevent filling the gap with epoxy. 2. Centering the termination gap of the capacitor with in the gap in the micro strip, press with careful, even pressure onto the micro strip ensuring the terminations make good contact with the epoxy drops. 3. Cure according to the epoxy manufacturer’s preferred schedule Typically 125°C to 150°C Max. 4. After curing, inspect joint for epoxy shorts acro ss the termination and micro strip gaps that would cause a short across the cap. Isopropanol, and Methanol are both safe to use to pre clean Opti-Caps® Isopropanol, and Methanol are not to be used after mounting with conductive epoxy as they act as a solvent! Distance from Trace Edge: .003” - .004” Ideal Micro Strip Width: .020” - .025” Gap: .015” - .020” Epoxy Diameter: .010 - .015” Epoxy Thickness: .003” - .005”
P42BN820MA3152 Opti - Cap® March 2011 Dielectric Laboratories Inc. 2777 Route 20 East, Cazenovia, NY 13035 Phone: 315-655-8710 Fax: 315-655-8179 Email: sales@dilabs.com Web: http://www.dilabs.com QUALITY SYSTEMS AS9100, ISO 9001 AND ENVIRONMENTAL SYSTEM ISO 14001 CERTIFIED 3 of 4 Recommended Attachment to Soft or Hard Substrate Using Solder: Recommended Micro Strip Layout: Attachment Method 1. Place a single drop of solder paste onto each micro-strip as illustrated; the edge of the epoxy shall be at least .001”- .002” back from the edge of the trace to prevent filling the gap with solder. 2. Centering the termination gap of the capacitor with in the gap in the micro strip, press with careful, even pressure onto the micro strip ensuring the terminations make good contact with the drops of solder paste. 3. Reflow according to the solder manufacturer’s preferred profile, ensuring the reflow temperature does not exceed 250°C. 4. After the reflow step is completed, inspect joint for voids or excess flux and non-reflowed solder balls that can degrade performance or cause shorts across the gaps. Proper cleaning after the reflow process is crucial to avoiding performance degradation and discovering poor solder joints. Isopropanol, and Methanol are both safe to use with soldered Milli-Caps®. Metric Conversion 1 microinch 0.0254um 1” 25.4mm Distance from Trace Edge: .001” - .002” Ideal Micro Strip Width: .020” - .025” Gap: .015” - .020” Solder Diameter: .020 - .025” Solder Thickness: .004” - .006”
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