P3MS650100H ONSEMI | Alldatasheet
Document overview
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- PDF pages: 7
Technical content
Features
- Peak EMI Reduction Clock Generator with LVCMOS Output
- Supply V oltage and Input / Output Clock Frequency Range 1.6 V − 2.0 V: 15 MHz − 30 MHz 2.3 V − 3.6 V: 15 MHz − 60 MHz
- Frequency Deviation: ±1.4% @ 24 MHz
- Power Down current less than 1 /C0109A
- 4−pin WDFN (1.2mmX1.0mm) Package
- Output Drive Current: 1.8 V: 8 mA 2.5 V/3.3 V: 16 mA
- Operating temperature range: −20°C to +85°C
- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
Applications
- P3MS650100H is targeted towards consumer electronic applications like mobile Phones, tablets, net books and MIDs VSS VDD CLKIN PLL Frequency Modulator ModOUT
Figure 1. Simplified Block Diagram dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
X = Specific Device Code M = Date Code X M 3CLKIN VDD ModOUT (Top View)
Table 1. PIN DESCRIPTION 1 VSS Power Ground connection. 2 CLKIN Input LVCMOS External reference clock input. 3 ModOUT Output Spread Spectrum Clock Output.
4 VDD Power Power supply for the entire chip
Table 2. OPERATING CONDITIONS Table 3. ABSOLUTE MAXIMUM RATING
Table 4. DC Electrical Characteristics VDD = 1.6 V − 2.0 V, TA= −20°C to +85°C Table 5. AC ELECTRICAL CHARACTERISTICS VDD = 1.6 V − 2.0 V, TA = −20°C to +85°C
15 MHz 400
30 MHz
- All parameters are specified with 15 pF loaded output.
- Parameter is guaranteed by design and characterization. Not 100% tested in production
Table 6. DC ELECTRICAL CHARACTERISTICS VDD = 2.3 V – 3.6 V, TA = −20°C to +85°C Table 7. AC ELECTRICAL CHARACTERISTICS VDD = 2.3 V – 3.6 V, TA = −20°C to +85°C
15 MHz 350 pS
24 MHz 250
60 MHz 100
- All parameters are specified with 15 pF loaded output.
- Parameter is guaranteed by design and characterization. Not 100% tested in production
http://onsemi.com A typical layout is shown in the figure below. Figure 5. Recommended PCB Layout Ordering Code Marking Temperature Package Type Shipping† P3MS650100H−4CR A −20°C to +85°C 4−pin (1.2 mm x 1.0 mm) WDFN (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb−Free.
http://onsemi.com PACKAGE DIMENSIONS WDFN4, 1.0x1.2, 0.5P CASE 511BS−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM THE TERMINAL TIPS. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. ÉÉ ÉÉ A B E D BOTTOM VIEW b e NOTE 3 2X 0.05 C PIN ONE REFERENCE TOP VIEW 2X 0.05 C A (A3) 0.05 C 0.05 C C SEATING PLANESIDE VIEW L4X1 2 DIM MIN MAX MILLIMETERS A 0.70 0.80 A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 D 1.00 BSC E 1.20 BSC e 0.50 BSC L 0.35 0.45 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MOUNTING FOOTPRINT* PITCH 0.63 1.50 DIMENSIONS: MILLIMETERS 0.30 RECOMMENDED PACKAGE OUTLINE AM0.05 B C 4 3 e/2 0.50 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 P3MS650100H/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative