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Technical content

Features

  • 1x, LVCMOS Peak EMI Reduction
  • Input Clock Frequency : 10 MHz − 100 MHz
  • Output Clock Frequency : 10 MHz − 100 MHz
  • Four different Frequency Deviation selection
  • Frequency range Selection
  • Supply voltage: 5 V /C0036 0.5 V 3.3 V /C0036 0.3 V
  • 8 Pin SOIC Package
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Application
  • P3I2005A is targeted for use in a broad range of notebook and desktop PCs and consumer electronic applications. SOIC−8 CASE 751 MARKING DIAGRAM http://onsemi.com PIN CONFIGURATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

D_C CLKIN/XIN 1 4 5 ModOUT GND FRS P3I2005A XOUT AFG = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package AFG ALYWX /C0071

Figure 1. Block Diagram 1 CLKIN / XIN I External reference Clock input or Crystal connection. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 7 ModOUT O Buffered Modulated Clock Output.

10 MHz 20 MHz 30 MHz 30 MHz 80 MHz 100 MHz

http://onsemi.com OPERATING CONDITIONS Symbol Parameter Min Max Unit VDD(5V) Supply Voltage 4.5 5.5 V VDD(3.3V) Supply Voltage 3 3.6 V TA Operating Temperature −40 +85 °C CL Load Capacitance 15 pF CIN Input Capacitance 7 pF ABSOLUTE MAXIMUM RATINGS Symbol Parameter Rating Unit VDD, VIN Voltage on any input pin with respect to Ground −0.5 to +7.0 V TSTG Storage temperature −65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22− A114−B) 2 kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. DC ELECTRICAL CHARACTERISTICS FOR VDD = 5 V /C0036 0.5 V Symbol Parameter Min Typ Max Unit VDD Operating voltage 4.5 5.0 5.5 V VIL Input low voltage GND – 0.3 0.8 V VIH Input high voltage 2.0 VDD + 0.3 V IIL Input low current 100 /C0109A IIH Input high current 100 /C0109A VOL Output low voltage (IOL = 12 mA) 0.4 V VOH Output high voltage (IOH = −12 mA) 2.5 V ICC Static supply current (CLKIN/XIN pulled to GND) 12 mA IDD Dynamic supply current (Unloaded Output) FS = 0 (@ 30 MHz) 34 mA FS = 1 (@ 100 MHz) 40 ZOUT Output impedance 30 /C0087

http://onsemi.com AC ELECTRICAL CHARACTERISTICS FOR VDD = 5 V/C0036 0.5 V Symbol Parameter Min Typ Max Unit CLKIN/XIN Input Clock Frequency FRS = 0 10 30 MHz FRS = 1 30 100 MODOUT Output Clock Frequency FRS = 0 10 30 MHz FRS = 1 30 100 tLH (Notes 1 & 2) Output Rise time (measured between 20% to 80%) 1.6 2 nS tHL (Notes 1 & 2) Output Fall time (measured between 80% to 20%) 1.2 1.6 nS tD (Notes 1 & 2) Output duty cycle 45 50 55 % tJC (Note 2) Jitter (cycle to cycle) @ FS = 0, 24 MHz and FS = 1, 80 MHz /C0036250 /C0036350 pS tON (Notes 1 & 2) PLL lock time (Stable VDD, valid Clock presented on CLKIN/XIN) 3 mS 1. All parameters are specified with 15 pF loaded output. 2. Parameter is guaranteed by design and characterization. Not 100% tested in production DC ELECTRICAL CHARACTERISTICS FOR VDD = 3.3 V /C0036 0.3 V Symbol Parameter Min Typ Max Unit VDD Operating voltage 3 3.3 3.6 V VIL Input low voltage GND − 0.3 0.8 V VIH Input high voltage 2.0 VDD + 0.3 V IIL Input low current 100 /C0109A IIH Input high current 100 /C0109A VOL Output low voltage (IOL = 12 mA) 0.4 V VOH Output high voltage (IOH = −12 mA) 2.5 V ICC Static supply current (CLKIN/XIN pulled to GND) 11 mA IDD Dynamic supply current (Unloaded Output) FS = 0 (@ 30 MHz) 26 mA FS = 1 (@ 100 MHz) 32 ZOUT Output impedance 40 /C0087

http://onsemi.com AC ELECTRICAL CHARACTERISTICS FOR VDD = 3.3 V /C0036 0.3 V Symbol Parameter Min Typ Max Unit CLKIN/XIN Input Clock Frequency FRS = 0 10 30 MHz FRS = 1 30 100 MODOUT Output Clock Frequency FRS = 0 10 30 MHz FRS = 1 30 100 tLH (Notes 3 & 4) Output Rise time (measured between 20% to 80%) 1.9 2.5 nS tHL (Notes 3 & 4) Output Fall time (measured between 80% to 20%) 1.5 2 nS tD (Notes 3 & 4) Output duty cycle 45 50 55 % tJC (Note 4) Jitter (cycle to cycle) @ FS=0, 24MHz & FS=1, 80 MHz /C0036250 /C0036350 pS tON (Notes 3 & 4) PLL lock time (Stable VDD, valid Clock presented on CLKIN/XIN) 3 mS 3. All parameters are specified with 15 pF loaded output. 4. Parameter is guaranteed by design and characterization. Not 100% tested in production Part Number Marking Package Temperature Shipping† P3I2005AG−08SR AFG 8−PIN SOIC (Pb−Free) −40°C to +85°C Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb−Free.

http://onsemi.com PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AJ SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 P3I2005A/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative