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Technical content

Features

  • Extremely small size: 330 x 180 mm cross section
  • Stable accurate pressure measurement
  • Low power consumption using high impedance
  • Absolute pressure sensing
  • Standard pressure range of 450 to 1050 mmHgA
  • 4500 mmHgA burst pressure
  • Gold wire bond pads

Applications

  • Cardiovascular
  • Respiratory
  • Intracranial
  • Urological/ Rectal
  • Ablation
  • Body Cavity
  • Research Amphenol Advanced Sensors’ P330 piezoresistive pressure die offers the same superior stability and sensitivity as in larger chips, but in an extremely small footprint for invasive applications where small size is critical. It has excellent measurement accuracy, which is ideal for demanding applications with restricted dimensional profiles such as medical catheters and IC packages. NovaSensor’s proprietary SenStable ® process provides excellent long term stability and repeatability. When excited with a DC voltage source, the P330 produces a mV output that is proportional to applied pressure. The P330 employs a half-bridge design which requires two external resistors to complete a full-bridge configuration. Additional components may be added to calibrate the output of the sensor. Amphenol Advanced Sensors

Parameter (Note 1,2) Unit Value Comment Pressure Range mmHg 450 to 1050 Absolute pressureProof Pressure3 mmHg 2700 Burst Pressure4 mmHg 4500 Excitation Volts 1 to 6 DC Voltage Bridge Resistance5 kohm 3.2±1.0 Symmetry6 % ±5 Offset Voltage7 mV/V 4.5 Typical @ 750 mmHg Sensitivity 7 µV/V/mmHg 10 Typical Pressure Non Linearity7 % ±1 Typical TBNL, 300 mmHg Range TC Offset 7 µV/V/°C ±40 Maximum TC Sensitivity 7 %/°C -0.2 Typical TC Resistance 7 %/°C 0.05 Typical Operating Temperature 8 °C 15 to 45 59 to 113°F Storage Temperature °C -25 to 70 -13 to 158°F Media Compatibility 9, 10 Clean, dry and non-corrosive gases Shipping and Handling Wafers are shipped on sticky tape with rings in protective plastic containers or in gel paks. All wafers are 100% electrically probed and visually inspected. Rejects are marked by ink dots. 1. Values measured at 22°C (72°F) unless noted with 3000 ohm resistors completing the bridge. 2. Pressure sensor performance can be affected by die mounting. Packaging stress should be minimized to achieve the specified performance. 3. Proof Pressure: The maximum pressure at which the sensor may be subjected as an uncommon event and for a short duration of time without permanent damage or performance degradation. If the Proof Pressure is exceeded, the die performance is no longer guaranteed. 4. Burst Pressure: The pressure at which permanent damage to the sensor may occur. Specification is for quasi-static pressure in an oil medium applied to the diaphragm side of the die. 5. Parameter is measured at the wafer-level 100% at room temperature, atmospheric pressure and 3V. 6. Symmetry is calculated as 2*(r1 – r2)/(r1 + r2), where r1 and r2 are two piezoresistors measured separately. 7. Parameters marked “Typical” are verified by testing samples from each wafer. TCR of sensor resistors only. TCR of bridge circuit will be affected by the resistor values completing the bridge. 8. Die is capable beyond this range with additional validation. 9. Die with protective layers has been successfully used in various medical and biological applications. 10. If the sensor is to be exposed to radiation, it is recommended to shield the die from radiation and implement auto-zeroing. Notes AAS-920-516B - 08/2014 www.amphenol-sensors.com © 2014 Amphenol Corporation. All Rights Reserved. Specifications are subject to change without notice. Other company names and product names used in this document are the registered trademarks or trademarks of their respective owners. Amphenol Advanced Sensors P330 Schematic Diagram: Complete the full bridge by inserting two 3000 ohm external resistors. Match resistors closely to minimize offset error. For +IN, both sides of the split pad must be connected for proper operation.